Microchip Technology

ATSAMA5D23B-CNR - ARM Cortex-A5 500MHz MPU, 196-TFBGA | Microchip

MPN: ATSAMA5D23B-CNR ✓ Active
In Stock Ships in 1-3 business days
196-ball TFBGA, 11x11 mm, 0.8 mm ball pitch Package 500 MHz Speed 160 Kbytes Memory
From $10.25 USD / Unit
MOQ: 1 |
Price updated: 2026-09-20
Volume Pricing
Qty Unit Price Extended
1 $17.5 $17.50
10 $15.75 $157.50
100 $13.5 $1,350.00
500 $11.8 $5,900.00
1,000 $10.25 $10,250.00
ℹ️ All prices are in USD

ATSAMA5D23B-CNR Overview

The Microchip Technology ATSAMA5D23B-CNR is a high-performance ARM Cortex-A5 32-bit microprocessor from the SAMA5D2 family, operating at up to 500 MHz with Armv7-A architecture including Arm TrustZone and a NEON media processing engine, housed in a 196-ball TFBGA (11x11 mm, 0.8 mm ball pitch) package. It integrates 128 Kbytes of L2 cache configurable as SRAM, 32 Kbytes of L1 instruction cache, and 32 Kbytes of L1 data cache, along with 160 Kbytes of internal ROM and an embedded Peripheral Touch Controller (PTC). The device delivers low system cost and high value integration with simplified power management, embedded audio subsystem, and rich connectivity peripherals.

An ARM Cortex-A5 MPU (microprocessor unit) is a 32-bit application-class processor core implementing the Armv7-A architecture, designed for low-power embedded applications requiring full operating system support (Linux, RTOS) and rich user interfaces. Positioned in the product taxonomy as MPU -> microprocessor -> application processor -> SoC, the Cortex-A5 provides an ideal balance of performance and power efficiency for industrial HMI, IoT gateways, and connected devices.

Key features include Arm TrustZone security extensions, NEON SIMD media engine for accelerated audio/video processing, and 8 Kbytes of ETM/ETB trace memory for real-time debugging. The integrated memory management unit (MMU) supports full virtual memory Linux distributions, while the configurable 128 Kbyte L2 cache can be repurposed as on-chip SRAM for latency-critical code or data paths. The peripheral set typically includes EMAC, USB, CAN-FD, and multiple UART/SPI/I2C instances, reducing external component count.

Typical applications span industrial HMI panels, IoT edge gateways, smart home controllers, building automation, point-of-sale terminals, and low-power Linux-based appliances. The combination of Cortex-A5 performance and Cortex-M4-class power efficiency (consumption can be optimized to single-digit mW/MHz in retention modes) makes it especially attractive for always-connected battery-aware systems. Industrial temperature grade supports deployment in harsh environments including factory automation and outdoor signage.

When designing with this device, careful PCB layout of the 196-ball TFBGA with 0.8 mm pitch is critical - microvia stack-ups and via-in-pad designs are strongly recommended. Decoupling strategy must follow the manufacturer's reference schematic, and DDR memory interface timing closure requires matched-length routing and proper termination.

This page synthesizes distributor pricing, parametric data, and drop-in alternatives sourced from Microchip's SAMA5D2 family, providing context beyond what the manufacturer datasheet alone offers.

Drop-in alternatives for ATSAMA5D23B-CNR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with ATSAMA5D23B-CNR (same form factor and footprint) — differing in Package, Ethernet, Core Architecture, USB, Operating Temperature.

Microchip Technology
Package: 196-ball TFBGA (10x10 mm)
Ethernet: 10/100 Mbps MAC (1 port)
USB: USB 2.0 + HSIC
Compare with ATSAMA5D23B-CNR →
Microchip Technology
Package: 196-TFBGA (11x11 mm), 0.75 mm pitch
Ethernet: 10/100 Mbps + 10/100/1000 Mbps MAC
USB: 3x USB 2.0 + HSIC
Compare with ATSAMA5D23B-CNR →
Microchip Technology
Package: 196-TFBGA (CSBGA) 11x11 mm
Ethernet: Dual 10/100 Mbps EMAC with 1588 PTP
Core Architecture: ARM Cortex-A5 (32-bit)
Compare with ATSAMA5D23B-CNR →
Microchip Technology
Package: 196-TFBGA (11x11 mm, 0.8 mm pitch)
Ethernet: 10/100 MAC (GMII/RMII/MII)
Core Architecture: ARM Cortex-A5 (32-bit RISC)
Compare with ATSAMA5D23B-CNR →
Microchip Technology
Package: 289-LFBGA (14x14x1.4 mm)
Ethernet: 2x EMAC with IEEE 1588 (10/100 Mbps)
Core Architecture: Arm Cortex-A5 (Armv7-A) with NEON and FPU
Compare with ATSAMA5D23B-CNR →
Microchip Technology
Package: 289-LFBGA (14x14 mm, 0.8 mm pitch)
Ethernet: 10/100 Mbps EMAC with GMII/RMII/MII
Core Architecture: ARM Cortex-A5 (32-bit)
Compare with ATSAMA5D23B-CNR →
Microchip Technology
Package: 289-ball LFBGA, 14x14 mm, 0.8 mm pitch
Core Architecture: ARM Cortex-A5
Operating Temperature: -40C to +85C (Industrial)
Compare with ATSAMA5D23B-CNR →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

ATSAMA5D23A-CNR

✅ Drop-In
Microchip Technology
📦 196-TFBGA (11x11)
ARM Cortex-A5 (32-bit RISC) · 500 MHz · 1 · 32 Kbytes · 32 Kbytes · 128 Kbytes · Yes · Yes (VFPv4)

✓ In Stock

$11.2 / Unit

View Datasheet →

ATSAMA5D23B-CN

✅ Drop-In
📦 196-TFBGA (11x11)
identical silicon, tray packaging vs tape-and-reel; same 196-ball TFBGA footprint

📋 Reference alternative (not in catalog)

ATSAMA5D22C-CU

✅ Drop-In
Microchip Technology
📦 196-TFBGA (11x11)
ARM Cortex-A5 (32-bit) · 1 · 500 MHz · Yes · 32 KB · 32 KB · 128 KB · DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC

✓ In Stock

$7.14 / Unit

View Datasheet →

ATSAMA5D22A-CNR

✅ Drop-In
Microchip Technology
📦 196-TFBGA (11x11)
Microchip Technology · SAMA5D2 · ARM Cortex-A5 · 1 · 32-bit · 500 MHz · 196-TFBGA (11x11 mm), 0.75 mm pitch · Surface Mount (BGA)

✓ In Stock

$10.8 / Unit

View Datasheet →

ATSAMA5D22A-CN

✅ Drop-In
Microchip Technology
📦 196-TFBGA (11x11)
ARM Cortex-A5 (32-bit) · 500 MHz · 32 KB I-cache, 32 KB D-cache · 128 KB · 16-bit DDR3/DDR3L/LPDDR2/LPDDR3 · 160 KB boot ROM · 2D (GC320) · Yes, up to WXGA

✓ In Stock

$9.95 / Unit

View Datasheet →

ATSAMA5D23B-CNR Maximum Ratings & Electrical Characteristics

Core Architecture ARM Cortex-A5 (Armv7-A)
Maximum Clock Frequency 500 MHz
Core Count 1
Data Bus Width 32-bit
L1 Instruction Cache 32 Kbytes
L1 Data Cache 32 Kbytes
L2 Cache / SRAM 128 Kbytes (configurable)
Internal ROM 160 Kbytes
Internal SRAM 128 Kbytes
NEON Media Engine Yes
TrustZone Yes (Arm TrustZone)
MMU Yes (full virtual memory)
ETM / ETB Trace Memory 8 Kbytes
Peripheral Touch Controller (PTC) Embedded
Package 196-ball TFBGA, 11x11 mm, 0.8 mm ball pitch
Operating Temperature Grade Industrial
Mounting Type Surface Mount
Lead-Free / RoHS Yes (Compliant)

ATSAMA5D23B-CNR 196-ball tfbga, 11x11 mm, 0.8 mm ball pitch Pin Configuration Guide

Pin configuration for ATSAMA5D23B-CNR (196-ball tfbga, 11x11 mm, 0.8 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

196-ball tfbga, 11x11 mm, 0.8 mm ball pitch package pinout diagram for ATSAMA5D23B-CNR

No detailed pinout data available for ATSAMA5D23B-CNR.

Refer to the datasheet for full pin configuration.

Typical Applications

ATSAMA5D23B-CNR is suitable for 6 applications: Industrial HMI Touch Panels, IoT Edge Gateways, Smart Home and Building Automation Hubs, Point-of-Sale and Payment Terminals, Connected Medical Devices, Industrial IoT Sensor Aggregation Nodes.

🏭

Industrial HMI Touch Panels

The ATSAMA5D23B-CNR is well-suited to industrial HMI panels because its integrated Peripheral Touch Controller (PTC) supports projected-capacitive sensing directly, eliminating the need for an external touch controller and reducing both BOM cost and PCB area. The 500 MHz Cortex-A5 with NEON engine enables Qt/QML-based graphical user interfaces with 60 fps rendering on LCD resolutions up to WXGA, while the MMU allows full Linux deployment. The 196-ball TFBGA's 0.8 mm pitch accommodates compact 3.5" to 7" display modules. Industrial temperature grade supports deployment in factory-floor environments. Power optimization modes (idle, retention) extend life in battery-backed HMIs.

🧩

IoT Edge Gateways

For IoT edge gateways, the ATSAMA5D23B-CNR offers the right balance of compute (500 MHz Cortex-A5 with TrustZone) and connectivity peripherals (EMAC, USB, CAN-FD) needed to aggregate sensor data, run edge analytics, and forward filtered streams to the cloud. TrustZone isolates the secure element firmware from the application OS, critical for over-the-air update integrity. The 128 Kbytes of L2 cache configurable as SRAM enables zero-wait-state data paths for protocol stacks (MQTT, CoAP, LWM2M). Linux4SAM BSP and Device Tree support accelerate development. The 11x11 mm BGA footprint suits compact gateway enclosures.

🏠

Smart Home and Building Automation Hubs

In smart home and building automation hubs, the ATSAMA5D23B-CNR runs full Linux for Zigbee/Z-Wave/Matter bridge logic while its Cortex-A5 efficiency keeps enclosure thermals low for fanless ceiling- or wall-mount designs. The embedded audio subsystem supports voice-control front-ends, and the rich peripheral set (USB for cellular/Wi-Fi modules, multiple UART/SPI for sensor expansion) reduces external component count. The 196-ball TFBGA with 0.8 mm pitch supports compact hub designs. Industrial temperature grade accommodates unheated equipment closets. TrustZone hardware isolation is increasingly important as Matter/Thread security models mature.

💳

Point-of-Sale and Payment Terminals

Point-of-sale and payment terminals benefit from the ATSAMA5D23B-CNR's hardware security through Arm TrustZone, which isolates PCI/PTS payment logic from general application code. The NEON engine accelerates TLS handshake and AES bulk encryption, reducing transaction latency at the checkout counter. The 128 Kbytes of L2-as-SRAM holds security-critical code in zero-wait-state memory. The 196-ball TFBGA 11x11 mm package supports compact handheld-terminal form factors. Industrial temperature grade handles outdoor deployment (vending, kiosks). The Peripheral Touch Controller simplifies integrated signature-pad designs.

💊

Connected Medical Devices

The ATSAMA5D23B-CNR's combination of Linux-capable Cortex-A5 compute and TrustZone isolation is well-suited to connected medical peripherals (patient monitors, diagnostic instruments, infusion-pump HMIs). NEON accelerates medical-imaging preprocessing (filtering, FFT), and the configurable 128 Kbytes of L2-as-SRAM provides deterministic interrupt latency for safety-critical loops. Industrial temperature grade supports clinical-environment reliability. The 196-ball TFBGA 0.8 mm pitch suits dense medical PCBs with multiple wireless modules. Linux4SAM's mainline support simplifies FDA/IEC 62304 software-lifecycle documentation.

🏭

Industrial IoT Sensor Aggregation Nodes

In industrial IoT sensor aggregation nodes, the ATSAMA5D23B-CNR's Cortex-A5 500 MHz performance runs Linux-side protocol stacks (OPC-UA, MQTT-SN, Modbus-TCP) while the rich peripheral mix (multiple UART, SPI, I2C, CAN-FD) interfaces directly to industrial sensors and field buses. The 196-ball TFBGA's 11x11 mm 0.8 mm pitch supports compact DIN-rail or panel-mount enclosures. Industrial temperature grade (-40C to +85C) handles factory environments. The 128 Kbyte L2 cache holds protocol stacks in zero-wait-state memory, and the embedded audio subsystem enables audio-event detection in predictive-maintenance nodes.

What is the operating frequency of ATSAMA5D23B-CNR?
The ATSAMA5D23B-CNR operates at up to 500 MHz on a single ARM Cortex-A5 core implementing the Armv7-A architecture. According to the Microchip SAMA5D2 datasheet (DS60001476), the maximum CPU clock is 500 MHz with the NEON media engine and FPU active. This places the part in the low-power application-processor tier, suitable for Linux-based embedded designs.
What package does ATSAMA5D23B-CNR use?
The ATSAMA5D23B-CNR is housed in a 196-ball TFBGA package measuring 11x11 mm with a 0.8 mm ball pitch. The 0.8 mm pitch (versus legacy 1.0 mm) reduces PCB design complexity and enables higher-density board layouts. The "-CNR" suffix denotes a TFBGA package with industrial temperature grade and Tape-and-Reel packaging.
How much on-chip memory does ATSAMA5D23B-CNR have?
The ATSAMA5D23B-CNR integrates 32 Kbytes of L1 instruction cache, 32 Kbytes of L1 data cache, a 128 Kbyte L2 cache configurable as on-chip SRAM, 128 Kbytes of total internal SRAM, and 160 Kbytes of internal ROM. The L2-as-SRAM feature is especially valuable for latency-critical code or data paths in real-time control loops running alongside Linux.
Does ATSAMA5D23B-CNR support ARM TrustZone?
Yes, the ATSAMA5D23B-CNR includes Arm TrustZone security extensions on the Cortex-A5 core. According to the Microchip SAMA5D2 datasheet, TrustZone enables hardware isolation between secure and non-secure execution domains - critical for IoT gateways, payment terminals, and any application handling cryptographic keys or DRM-protected content.
Can ATSAMA5D23B-CNR run Linux?
The ATSAMA5D23B-CNR fully supports Linux distributions, including the official Microchip build of Linux4SAM based on mainline kernel. The MMU implements full virtual memory, the NEON engine accelerates multimedia workloads, and Microchip provides a mainline-supported Device Tree and board support package. Industrial temperature grade supports fanless deployments.
Where can I buy ATSAMA5D23B-CNR online?
The ATSAMA5D23B-CNR is in stock at authorized Microchip distributors including DigiKey (part number 8593232), Mouser, and major catalog resellers, priced approximately USD 17.50 per unit at qty-1 as of 2026-09-21. XAIPART also stocks this part with quantity-break pricing; volume quotes (>1000 units) are available on request with standard lead times of 6-10 weeks.
What is the price of ATSAMA5D23B-CNR at quantity 100?
The ATSAMA5D23B-CNR lists at approximately USD 13.50 per unit at 100-piece quantity, dropping to around USD 10.25 at 1000 pieces, as of 2026-09-21. Pricing varies by distributor; XAIPART's tiered pricing and direct Microchip factory quotes are recommended for high-volume or scheduled-production needs. Tape-and-Reel is standard with 2000-piece reels.
What is the lead time for ATSAMA5D23B-CNR?
Lead time for the ATSAMA5D23B-CNR is typically 6-10 weeks from Microchip factory for production volumes, as of 2026-09-21. Distributor stock (DigiKey, Mouser, Avnet) is the fastest path for prototype quantities and is usually available for immediate shipment in tray or tape-and-reel packaging.
Is ATSAMA5D23B-CNR in stock right now?
As of 2026-09-21, distributor inventory for ATSAMA5D23B-CNR is constrained; stock is available at DigiKey with limited qty, and broader inventory exists across Mouser and Avnet for industrial-grade orders. For guaranteed supply, Microchip factory orders are recommended 10-12 weeks before production need. XAIPART can source from authorized channels for confirmed orders.
What is the difference between ATSAMA5D23B-CNR and ATSAMA5D23B-CN?
The ATSAMA5D23B-CNR and ATSAMA5D23B-CN differ only in packaging form: the "-CNR" suffix indicates Tape-and-Reel packaging, while "-CN" (without R) ships in Tray. Both share identical silicon, the same 196-ball TFBGA 11x11 mm package, and industrial temperature grade. The two are drop-in equivalents; choose CNR for SMT production lines, CN for low-volume or prototype work.
What is the difference between ATSAMA5D23B and ATSAMA5D22B?
ATSAMA5D23B integrates higher-tier peripherals (HSIC interface, AES on-the-fly encryption, and full PTC) compared to ATSAMA5D22B, which omits some peripherals. Both share the 196-ball TFBGA footprint. The ATSAMA5D23B is recommended when AES-OTF, CAN-FD, or HSIC is required; ATSAMA5D22B is suitable for lower-cost designs without those interfaces.
When should I choose ATSAMA5D23B-CNR over ATSAMA5D27C-D5M-CU?
Choose ATSAMA5D23B-CNR when you need 196-ball TFBGA compatibility and the SAMA5D2 peripheral set, and ATSAMA5D27C-D5M-CU when you need a smaller 289-ball BGA with DDR2/LPDDR interface and higher peripheral count. The two are NOT drop-in (different packages and ball maps); design changes are required when migrating between them.
What is the best drop-in replacement for ATSAMA5D23B-CNR?
The best drop-in replacements for ATSAMA5D23B-CNR are ATSAMA5D23A-CNR (predecessor revision, same package, slightly lower errata list) and ATSAMA5D23B-CN (same silicon, tray packaging). Both share the 196-ball TFBGA footprint and are electrically compatible; choose ATSAMA5D23A-CNR for legacy BOM continuity and CN for hand-prototype assembly.
Where can I download the ATSAMA5D23B-CNR datasheet PDF?
The ATSAMA5D23B-CNR datasheet (DS60001476) is freely downloadable from Microchip's official product page at microchip.com; it covers the entire SAMA5D2 family with full register descriptions, electrical characteristics, and reference schematics. Application notes and Linux4SAM BSP are available from the Microchip developer portal alongside the datasheet.
What is the pinout of ATSAMA5D23B-CNR?
The ATSAMA5D23B-CNR uses a 196-ball TFBGA with the pinout defined in the SAMA5D2 datasheet (DS60001476) chapter "Package and Pinout." Key balls include power (VDDANA, VDDIN, VDDIO), DDR interface (DDR_DQ, DDR_A, DDR_BA), and the JTAG/SWD debug interface (TDI, TDO, TMS, TCK, NRST). Microvia-in-pad PCB technology is recommended for the 0.8 mm pitch.

Engineering reference data for ATSAMA5D23B-CNR — comparison, design guidance, and compliance information.

Selection Guide

Choose ATSAMA5D23B-CNR when designing industrial HMI panels, IoT edge gateways, or connected embedded devices that require ARM Cortex-A5 500 MHz performance, Arm TrustZone isolation, and the full SAMA5D2 peripheral set including HSIC and AES-OTF. For designs that do not need HSIC or hardware encryption, ATSAMA5D22A-CNR or ATSAMA5D22C-CU offer cost savings with the same 196-ball TFBGA footprint. For tray-packaged prototype builds, select ATSAMA5D23B-CN (same silicon). For lower-power portable designs, ATSAMA5D21C-CUR may suffice. All five options maintain Linux4SAM BSP compatibility and industrial temperature grade.

Comparison with Alternatives

Parameter This Product ATSAMA5D23A-CNR ATSAMA5D23B-CN ATSAMA5D22C-CU ATSAMA5D22A-CNR ATSAMA5D22A-CN
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 196-TFBGA (11x11 mm) 196-TFBGA (11x11 mm) - same 196-TFBGA (11x11 mm) - same 196-TFBGA (11x11 mm) - same 196-TFBGA (11x11 mm) - same 196-TFBGA (11x11 mm) - same
Core Cortex-A5 500 MHz Cortex-A5 500 MHz - same Cortex-A5 500 MHz - same Cortex-A5 500 MHz - same Cortex-A5 500 MHz - same Cortex-A5 500 MHz - same
L2 Cache / SRAM 128 Kbytes 128 Kbytes - same 128 Kbytes - same 128 Kbytes - same 128 Kbytes - same 128 Kbytes - same
TrustZone Yes Yes - same Yes - same Yes - same Yes - same Yes - same
HSIC Interface Yes Yes - same Yes - same No - software workaround No - software workaround No - software workaround
AES On-The-Fly Yes Yes - same Yes - same No No No
Peripheral Touch Controller Yes Yes - same Yes - same Yes - same Yes - same Yes - same
Temperature Grade Industrial Industrial - same Industrial - same Industrial - same Industrial - same Industrial - same
Packaging Form Tape & Reel Tape & Reel Tray Tray Tape & Reel Tray

Key Differentiators

  • Highest tier of SAMA5D2 family in same package (vs ATSAMA5D22A-CNR)
  • Silicon revision B with latest errata fixes (vs ATSAMA5D23A-CNR)
  • Industrial temperature grade with 196-ball TFBGA (vs ATSAMA5D27C-D5M-CU)

Design Notes

The 196-ball TFBGA with 0.8 mm ball pitch demands microvia-in-pad PCB technology. Use laser-drilled microvias (stacked or staggered 1-2 structures) on the top layer and high-density interconnect (HDI) stack-up to route escape patterns without dog-bone fanouts. Microchip's SAMA5D2 hardware design package includes reference PCB stack-ups and routing guidelines that should be reviewed before layout.

The ATSAMA5D23B-CNR integrates multiple power rails (VDDIN, VDDANA, VDDIO, VDDPLL, VDDBU) each requiring local bulk + bypass capacitors as specified in the datasheet's "Power Considerations" section. Use 100 nF X7R 0402 capacitors within 2 mm of each power pin and 4.7 uF-10 uF bulk caps per rail. For low-noise analog rails (VDDANA), add ferrite-bead filtering from the digital supply to avoid coupling noise into the ADC.

DDR2/LPDDR interfaces (when used with companion memory IC) require matched-length routing and proper termination as detailed in the SAMA5D2 hardware design guide. Impedance-controlled traces (50 ohm single-ended, 100 ohm differential for DDR_DQS pairs) are mandatory. Series-termination resistors may be required on data strobe pairs depending on memory topology; consult the reference schematic before deviating.

Avoid leaving NRST (active-low reset) floating; the datasheet mandates an external pull-up plus a 100 nF capacitor for proper power-on-reset behavior. Do not omit the 32.768 kHz low-frequency crystal on the SAMA5D2's RTC oscillator pins unless you can accept degraded RTC accuracy (the internal RC oscillator is much less accurate). Always program the proper boot configuration via the BMS pin before first power-up.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and lead-free status confirmed by Microchip product page; AEC-Q100 qualification is not applicable (industrial-grade MPU). Halogen-free status not stated in available web data.

Data verified on: 2026-09-21 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Microchip Technology ATSAMA5D23B-CNR ATSAMA5D23A-CNR ATSAMA5D23B-CN ATSAMA5D22C-CU ATSAMA5D22A-CNR ATSAMA5D22A-CN ARM Cortex-A5 Armv7-A Arm TrustZone NEON media processing engine Microprocessor (MPU) 196-ball TFBGA Peripheral Touch Controller (PTC) Linux4SAM BSP DDR memory interface RoHS compliant Industrial temperature grade Surface mount Embedded audio subsystem L2 cache configurable as SRAM Memory Management Unit (MMU)
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