DSPIC30F2011-20I/ML - 16-bit 20MIPS DSC 12KB Flash | Microchip
MPN: DSPIC30F2011-20I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.15 | $4.15 |
| 10 | $3.74 | $37.40 |
| 100 | $3.32 | $332.00 |
| 500 | $2.99 | $1,495.00 |
| 1,000 | $2.69 | $2,690.00 |
DSPIC30F2011-20I/ML Overview
A digital signal controller combines a high-performance 16-bit microcontroller (MCU) architecture with extensive Digital Signal Processor (DSP) functionality in a single chip. Within the embedded control hierarchy, a DSC sits between a general-purpose MCU and a dedicated DSP: it runs real-time C code with MCU-style peripherals while providing DSP multiply-accumulate instructions, making it well suited to sensor signal conditioning, closed-loop control, and motor drive applications.
Key differentiating features of this part include its 16-bit modified Harvard architecture core at up to 20 MIPS, on-chip FLASH program memory with in-circuit self-programming, 21 I/O pins, and an industrial (I) temperature grade. The dsPIC30F2011 integrates sensor-oriented analog and control peripherals that let a single chip replace MCU-plus-signal-chain designs.
Architecturally, the dsPIC30F core supports DSP-class instructions and addressing modes alongside conventional MCU peripherals, with a rich interrupt structure and flexible clocking options. According to Microchip documentation (DeviceDoc 70139b), the dsPIC30F2011, dsPIC30F2012, dsPIC30F3012 and dsPIC30F3013 share this data sheet and a common 16-bit architecture, which simplifies design reuse and code migration.
Typical applications include sensor signal acquisition and conditioning, switch-mode power supply (SMPS) and power-conversion control, industrial automation nodes, and general embedded control that benefits from DSP filtering or transform math. The 6x6 mm QFN footprint suits compact industrial boards.
For design, note the industrial temperature rating applies with appropriate supply derating: verify the supply voltage window (2.5V to 5.5V per distributor data) against your clock-speed selection, and follow Microchip programming-specification documents for ICSP connections.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC30F2011-20I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC30F2011-20I/ML (same form factor and footprint) — differing in Core Architecture, Package, Migration Path, DSP Functionality, I/O Pins.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC30F2012-20I/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC30F3012-20I/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC30F3013-20I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.12 / Unit
View Datasheet →DSPIC30F2011-20E/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.05 / Unit
View Datasheet →DSPIC30F2011T-20I/ML
✅ Drop-In✓ In Stock
$3.96 / Unit
View Datasheet →DSPIC30F2011-20I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC30F (MCU + DSP) |
| Max CPU Speed | 20 MIPS |
| Program Memory | 12 KB (4K x 24) FLASH |
| Supply Voltage Range | 2.5 V to 5.5 V |
| Operating Temperature | -40C to +85C (Industrial, I grade) |
| I/O Pins | 21 |
| Package | 28-QFN (6 x 6 mm, 0.90 mm height) |
| Mounting Type | Surface Mount |
| Product Family | dsPIC30F Sensor Family |
| DSP Functionality | Yes (integrated DSP engine) |
| Program Memory Type | FLASH |
| Migration Path | Seamless to dsPIC33F, PIC24H, PIC24F in similar packages |
| Packaging | Tray (/ML suffix, non tape-and-reel) |
DSPIC30F2011-20I/ML 28-qfn (6 x 6 mm, 0.90 mm height) Pin Configuration Guide
Pin configuration for DSPIC30F2011-20I/ML (28-qfn (6 x 6 mm, 0.90 mm height) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC30F2011-20I/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC30F2011-20I/ML is suitable for 6 applications: Sensor Signal Acquisition and Conditioning, Switch-Mode Power Supply (SMPS) Control, Industrial Automation and Control Nodes, Motor Drive and Motion Control, Portable and Battery-Powered Instruments, Embedded Test and Measurement Front Ends.
Sensor Signal Acquisition and Conditioning
The DSPIC30F2011-20I/ML belongs to Microchip's dsPIC30F Sensor Family, purpose-built for sensor signal acquisition nodes where raw analog signals need digital filtering, scaling and decision logic in one chip. Its 20 MIPS 16-bit core executes FIR/IIR filter kernels and calibration math far faster than an 8-bit MCU, while 21 I/O pins interface switches, displays and communication links. Used as the single controller on an industrial sensor board, it digitizes, filters and transmits conditioned measurements; the DSP multiply-accumulate instruction set reduces loop latency compared with software-only math on a general MCU, improving sample-rate headroom at the same clock frequency.
Recommended
Switch-Mode Power Supply (SMPS) Control
Microchip explicitly classifies the dsPIC30F2011/2012/3012/3013 group as 28/44-pin High-Performance Switch Mode Power Supply Digital Signal Controllers, making this part a natural fit for digitally controlled AC-DC and DC-DC converters. The 20 MIPS core closes current- and voltage-mode control loops with DSP-class math, and the 16-bit architecture provides the arithmetic precision compensation networks need. In a digital SMPS, the controller replaces analog error-amp and PWM chips, enabling adaptive compensation, programmable soft-start and telemetry. The industrial -40C to +85C grade matches power-electronics ambient conditions; verify PWM resolution against switching frequency during design.
Recommended
Industrial Automation and Control Nodes
For factory automation nodes such as motor control boards, process transmitters and small PLC I/O modules, the DSPIC30F2011-20I/ML provides a 20 MIPS 16-bit core with DSP capability in an industrial -40C to +85C rating and a compact 6x6 mm QFN footprint. Its DSC architecture handles closed-loop control (PID plus filtering) and communication simultaneously without a second processor. Typical role: the main controller on an actuator or transmitter PCB, running control firmware and a serial link to the host. Migration options to dsPIC33F or PIC24H devices in similar packages give a defined upgrade path as throughput requirements grow over the product lifecycle.
Recommended
Motor Drive and Motion Control
Digital motor control benefits directly from the DSPIC30F2011-20I/ML's combination of 20 MIPS execution, DSP multiply-accumulate instructions for FOC and commutation math, and MCU-class peripherals for PWM and feedback interfaces. In a compact drive board, the controller executes the current loop and speed loop while sequencing power stages; the 16-bit core avoids the saturation and scaling issues that complicate 8-bit motor firmware. The 28-QFN (6x6 mm) package keeps the controller footprint small on dense inverter PCBs, and the industrial temperature grade supports motor-adjacent thermal environments encountered in fans, pumps and light industrial drives.
Recommended
Portable and Battery-Powered Instruments
With a 2.5V to 5.5V supply window, the DSPIC30F2011-20I/ML operates directly from single-cell-adjacent rails or a 3.3V/5V system rail, which simplifies power-tree design in portable instruments, handheld meters and battery-operated data loggers. The 20 MIPS core performs DSP tasks such as RMS computation, windowing and averaging locally, reducing the data volume sent off-board. The 6x6 mm QFN conserves board area in compact enclosures. Designers should account for the industrial-grade temperature specification and the supply-versus-speed relationship from the family data sheet when operating at reduced battery voltage near the lower 2.5V end.
Recommended
Embedded Test and Measurement Front Ends
Bench and embedded test equipment front ends need a controller that can run calibration routines, digital filters and communication stacks concurrently - a workload the DSPIC30F2011-20I/ML handles with its 20 MIPS 16-bit DSC core and integrated DSP engine. Typical use is as the system controller in a measurement card, coordinating an external precision ADC, driving display and keypad I/O from its 21 GPIO, and reporting over a serial link. The 12 KB FLASH suffices for front-end firmware with in-system reprogrammability for calibration updates, and the shared data sheet with the 3012/3013 offers a memory-upgrade route on the same footprint if firmware grows.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC30F2011-20I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC30F2012-20I/ML | DSPIC30F3012-20I/ML | DSPIC30F3013-20I/ML | DSPIC30F2011-20E/ML | DSPIC30F2011T-20I/ML |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Speed | 16-bit dsPIC30F, 20 MIPS | 16-bit dsPIC30F, 20 MIPS | 16-bit dsPIC30F, 20 MIPS | 16-bit dsPIC30F, 20 MIPS | 16-bit dsPIC30F, 20 MIPS | 16-bit dsPIC30F, 20 MIPS |
| Supply Voltage Range | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V |
| Operating Temperature | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E, extended) | -40C to +85C (I) |
| Packaging / Delivery | Tray (/ML) | Tray (/ML) | Tray (/ML) | Tray (/ML) | Tray (/ML) | Tape & Reel (/ML T-suffix) |
Key Differentiators
- Lowest-memory entry point of the shared 28-QFN DSC group (vs DSPIC30F3012-20I/ML)
- Extended-temperature pin-compatible variant available (vs DSPIC30F2011-20E/ML)
- Defined next-generation migration path (vs DSPIC30F2012-20I/ML)
Design Notes
Supply the dsPIC30F2011 within its 2.5V to 5.5V window, but check the voltage-versus-speed derating in the family data sheet: a third-party summary indicates full 20 MIPS operation is specified near the 4.5-5.5V rail, while lower supplies correspond to reduced maximum MIPS. Decouple VDD with a 0.1 uF ceramic at each power pin placed within 5 mm of the QFN pad, plus a bulk 4.7-10 uF. On battery rails, verify brown-out reset thresholds against your minimum battery voltage before relying on reset behavior.
The 28-QFN (6x6 mm) package exposes a center ground pad that must be soldered to a grounded via array for both mechanical reliability and thermal performance - a commonly skipped step that causes intermittent grounds. Follow the land pattern in the Microchip data sheet, use a 4x4 or larger via matrix under the pad, and keep the ICSP programming header (MCLR, VDD, VSS, PGD/PGC-equivalent pins) routed to a header or test points for in-circuit programming with MPLAB-class tools.
The /ML suffix is package (QFN tray) and temperature (industrial) coding - do not order the T-suffix tape-and-reel part or the -20E extended-temperature grade interchangeably without checking your assembly process and environmental requirements. Second, migration to dsPIC33F or PIC24H in similar packages is code- and footprint-friendly per Microchip but NOT electrically drop-in: the newer generation uses a 3.0-3.6V supply, so re-verify the power rail and any 5V-tolerant interfaces before redesigning around the newer family.
Compliance Information
Compliance data was not present in the verified web data retrieved for this part; consult the Microchip product page or environmental datasheet for RoHS/REACH certification status.
