Altera

EP1C6F25617L - Cyclone FPGA 6K LE, 256-BGA, 1.7V | Altera

MPN: EP1C6F25617L ✗ End of Life
In Stock Ships in 1-3 business days
1.7 V (L variant) Vdss 256-pin FineLine BGA (FBGA-256) Package 8 Speed
From $26.4 USD / Unit
MOQ: 1 |
Price updated: 2026-09-06
Volume Pricing
Qty Unit Price Extended
1 $42.5 $42.50
10 $38.25 $382.50
100 $33.9 $3,390.00
500 $29.75 $14,875.00
1,000 $26.4 $26,400.00
ℹ️ All prices are in USD

Drop-in alternatives for EP1C6F25617L — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP1C6F256C8L

✅ Drop-In
📦 256-pin FineLine BGA (FBGA-256)
same FBGA-256 package, same Cyclone family, -8 speed grade (15-20% slower Fmax) vs -7

📋 Reference alternative (not in catalog)

EP1C6F256I7N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 256-pin FineLine BGA (FBGA-256)
Cyclone · 5,980 · 598 · 92,160 (90 Kbit M4K blocks) · 185 · 130 nm CMOS · 1.5 V (1.425 V to 1.575 V) · 250 MHz

✓ In Stock

$27.94 / Unit

View Datasheet →

EP1C6F256C6

✅ Drop-In ⚠️ 参数待验证
Intel
📦 256-pin FineLine BGA (FBGA-256)
Cyclone · 5,980 · 598 · 92,160 · [DATA_NEEDED: embedded multiplier count] · 185 · 2 · 1.5 V

✓ In Stock

$38.9 / Unit

View Datasheet →

EP1C12F256C8N

✅ Drop-In
Altera
📦 256-pin FineLine BGA (FBGA-256)
Cyclone I · 12,060 · 239,616 bits · 52 M4K (4,608 bits each) · 185 · 2 · 256-ball FBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch · 1.5 V

✓ In Stock

$15.1 / Unit

View Datasheet →

EP1C20F256C8N

✅ Drop-In
📦 256-pin FineLine BGA (FBGA-256)
Cyclone II family, 18,752 LE (vs 5,980), 1.2V core, bitstream recompile required

📋 Reference alternative (not in catalog)

EP1C6F25617

✅ Drop-In
Altera
📦 256-pin FineLine BGA (FBGA-256)
Cyclone (1st generation) · 5,980 LEs · 921,600 bits (921 Kb / ~115 KB) · 20 M4K blocks (4 Kbit each) · 185 · 13 · 2 · 1.5 V

✓ In Stock

$23.9 / Unit

View Datasheet →

EP1C6F25617L Maximum Ratings & Electrical Characteristics

Family Cyclone
Logic Elements 5,980 LE
Total RAM Bits 92,160 bits (90 Kbits)
Embedded RAM Blocks M4K blocks (20 blocks)
User I/O Pins (max) 185
PLLs 2
Global Clock Networks 8
Package 256-pin FineLine BGA (FBGA-256)
Speed Grade -7
Core Voltage 1.7 V (L variant)
I/O Voltage 3.3 V
Operating Temperature 0C to +85C (commercial)
Configuration Mode Active Serial (AS), Passive Serial (PS), JTAG
Process Technology 130 nm SRAM
RoHS Status Compliant (L suffix indicates lead-free)

EP1C6F25617L 256-pin fineline bga (fbga-256) Pin Configuration Guide

Complete pinout information for EP1C6F25617L (256-pin fineline bga (fbga-256) package) with 185 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

256-pin fineline bga (fbga-256) package pinout diagram for EP1C6F25617L

No detailed pinout data available for EP1C6F25617L.

Refer to the datasheet for full pin configuration.

Estimated pin count: 185 pins (digital package)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EP1C6F25617L Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1C6F25617L is suitable for 6 applications: Industrial Control Glue Logic, Video Processing Front-End, Communications Protocol Bridging, Legacy Equipment Maintenance, Educational and Hobbyist Development, Consumer Electronics Interface Bridging.

🏭

Industrial Control Glue Logic

The EP1C6F25617L fits industrial control glue-logic applications because its 5,980 logic elements and 185 user I/O pins provide sufficient capacity to bridge legacy parallel buses (PCI, ISA, VME) to modern serial interfaces (SPI, I2C, UART) without an external ASIC. The two on-chip PLLs enable clean clock generation from a single 50 MHz crystal, deriving multiple domain frequencies for motor-control PWMs and sensor sampling. With 90 Kbits of embedded RAM distributed across M4K blocks, the device handles FIFO buffering for inter-processor communication. The commercial 0C to +85C operating range suits factory-floor enclosures; for harsher environments the EP1C6F256I7N industrial variant extends to -40C to +100C with the same 256-FBGA footprint.

📺

Video Processing Front-End

The EP1C6F25617L suits video processing front-end designs such as camera-link receivers, NTSC/PAL decoders, and LCD timing controllers because its 256-FBGA package supports the high I/O count required for parallel video buses (8/16/24-bit RGB or ITU-R BT.656). The M4K memory blocks can implement line buffers and frame-stores up to the 90 Kbit total, sufficient for several lines of CIF-resolution video. Two PLLs generate pixel clocks from a 27 MHz reference. The -7 speed grade ensures the device meets timing for 100-150 MHz internal datapaths common in VGA-to-LCD scaling pipelines. Bitstream recompilation in Quartus II lets designers iterate on color-space conversion or de-interlacing algorithms in the same hardware.

🌐

Communications Protocol Bridging

The EP1C6F25617L is well-suited for communications protocol bridging, including UART-to-Ethernet, SPI-to-PCI, and I2C-to-parallel converters used in telecom and networking equipment. With 5,980 logic elements, the device can implement multiple protocol engines concurrently plus packet buffers using the 90 Kbits of embedded RAM. The 185 user I/O pins accommodate multi-channel serial interfaces alongside 16- or 32-bit host buses without external mux logic. Two PLLs allow independent clock domains for the host processor and the line-side interface. The Cyclone family's JTAG and Active Serial configuration interfaces support field firmware updates essential for deployed telecom hardware.

🔧

Legacy Equipment Maintenance

The EP1C6F25617L is primarily used today for maintaining legacy equipment originally designed in the early-to-mid 2000s, where the FPGA bitstream and PCB layout cannot be modified without expensive re-certification. Industries including aerospace, medical imaging, and industrial automation still require these FPGAs for field-replacement boards where the alternative is a complete system redesign costing hundreds of thousands of dollars. Independent distributors stock remaining factory inventory and reclaimed components specifically for this maintenance market. The 256-FBGA footprint and Cyclone architecture ensure bitstream-compatible operation with original boards, allowing drop-in replacement of failed units.

🧩

Educational and Hobbyist Development

The EP1C6F25617L and related Cyclone family devices are featured in university digital-design curricula and hobbyist development boards because they offer a balance of capacity, cost, and tool support. Students learn HDL design, state-machine implementation, and synthesis on a 5,980-LE device large enough for meaningful projects (UART, VGA controller, simple CPU) but small enough to fit in budget lab kits. The Cyclone family is supported by the free Quartus II Web Edition toolchain, eliminating licensing barriers for educational use. Although Intel now focuses on Cyclone 10 LP and Cyclone V for new curricula, legacy Cyclone development boards remain widely available and continue to teach foundational FPGA concepts.

📱

Consumer Electronics Interface Bridging

The EP1C6F25617L targets consumer electronics interface bridging applications such as HDMI-to-LVDS converters, USB-to-I2S audio bridges, and image-sensor pre-processors in digital cameras and projectors. With 185 user I/O pins and 90 Kbits of RAM, the device handles multi-format video timing plus audio sample buffering without external memory. The two PLLs derive pixel clocks and audio master clocks from a common reference. Low unit cost made Cyclone attractive for consumer products in the mid-2000s. The L-variant 1.7V core reduces power consumption in battery-powered devices such as digital camcorders and portable media players where the part was widely deployed.

Recommended Products Summary

EP1C6F256I7N Intel Used in: Industrial Control Glue Logic, Consumer Electronics Interface Bridging EPCS4 Serial configuration device for AS mode Used in: Industrial Control Glue Logic EPCS16 Larger configuration memory for video bitstreams Used in: Video Processing Front-End EP2C8F256C8N Cyclone II upgrade with hardware multipliers Used in: Video Processing Front-End EP1C12F256C8N Altera Used in: Communications Protocol Bridging EPCS64 64-Mbit configuration device for larger designs Used in: Communications Protocol Bridging EP1C6F256C8L Same package, slower speed grade, similar availability Used in: Legacy Equipment Maintenance EP1C6F25617 Altera Used in: Legacy Equipment Maintenance EP1C3T100C6 Intel Used in: Educational and Hobbyist Development EP1C12Q240C8N Intel Used in: Educational and Hobbyist Development EPCS1 Small configuration memory for compact designs Used in: Consumer Electronics Interface Bridging
What is the EP1C6F25617L?
The EP1C6F25617L is an Altera Cyclone family FPGA with 5,980 logic elements, 90 Kbits of embedded RAM, and two PLLs, housed in a 256-ball FineLine BGA package. The '17L' suffix indicates a -7 speed grade with 1.7V low-voltage core. According to the Cyclone family datasheet, this part targets cost-sensitive digital glue-logic and bus-bridging applications where ASIC development is not economically justified.
How many logic elements does EP1C6F25617L have?
The EP1C6F25617L contains 5,980 logic elements (LEs), which is the mid-density option in the original Cyclone family (range: 2,910 LE in EP1C3 to 20,060 LE in EP1C20). Each LE contains a 4-input lookup table, a programmable register, and a carry chain for arithmetic operations, sufficient for moderate-complexity state machines and datapaths.
Where can I buy the EP1C6F25617L?
The EP1C6F25617L is in obsolete/limited-stock status and is primarily available through independent distributors such as Veswin Electronics, Jotrin, VEKEMO, and EBICS as of 2026-09-06. Authorized distributors (DigiKey, Mouser) no longer stock this part due to its lifecycle status; expect minimum order quantities and lead times of 4-12 weeks. Pricing fluctuates significantly with market availability.
What is the lead time for EP1C6F25617L?
Lead time for EP1C6F25617L is 4-12 weeks as of 2026-09-06, depending on distributor stock and minimum order quantities. Because this part is obsolete, lead times vary widely; some lots may ship immediately from existing inventory, while larger orders require allocation searches across the authorized independent distribution channel.
What is the price of EP1C6F25617L?
The EP1C6F25617L prices as of 2026-09-06 start at approximately $42.50 per unit at qty-1, decreasing to about $26.40 per unit at qty-1000. Pricing varies by distributor and lot; independent distributors may quote higher prices for small quantities or smaller lot dates. Always request current quotes from multiple sources.
What is the difference between EP1C6F25617L and EP1C6F256C8L?
The EP1C6F25617L is the -7 speed grade (faster), while the EP1C6F256C8L is the -8 speed grade (slower, more economical). Both share the same 256-FBGA package and 1.7V L-variant core. The -7 grade provides approximately 15-20% better Fmax performance on internal logic and DSP paths, making it preferred for timing-critical designs.
Is the EP1C6F25617L suitable for new designs in 2026?
The EP1C6F25617L is not recommended for new designs in 2026 because it is in obsolete lifecycle status. For new designs, consider the Cyclone IV or Cyclone 10 LP families from Intel (formerly Altera), which offer improved power efficiency, more logic density per dollar, modern development tools (Quartus Prime), and active long-term supply. The EP1C6F25617L remains suitable only for legacy maintenance and replication of existing designs.
What package does EP1C6F25617L use?
The EP1C6F25617L is housed in a 256-ball FineLine BGA (FBGA-256) package with 1.0 mm ball pitch. The 'F256' in the part number designates this BGA package; the '17L' suffix indicates -7 speed grade and 1.7V L-variant core. The 256-FBGA provides 185 user I/O pins and supports high-density board layouts but requires X-ray inspection or BGA rework equipment for prototype rework.
What is the best drop-in replacement for EP1C6F25617L?
The best drop-in replacement for EP1C6F25617L is the EP1C6F256C8L (same 256-FBGA package, same Cyclone family, same 1.7V L-variant core) when only a speed-grade change is acceptable. For pin-compatible upgrades, the EP1C12F256C8N (Cyclone II family, 12,060 LE, 1.2V core) requires recompilation in Quartus II but shares the same 256-FBGA footprint for PCB compatibility. Cross-brand equivalents are not available as drop-in.
Can EP1C12F256C8N replace EP1C6F25617L without PCB changes?
Yes, the EP1C12F256C8N is pin-compatible with the EP1C6F25617L in the 256-FBGA package, enabling PCB reuse without layout changes. However, the EP1C12F256C8N requires a different bitstream (Cyclone II architecture vs Cyclone), so the FPGA design must be recompiled in Quartus II. Core voltage is 1.2V vs 1.7V, so the power supply may need adjustment.
What configuration devices work with EP1C6F25617L?
The EP1C6F25617L supports configuration from EPC2, EPC4, EPC8, EPC16, and EPC64 serial configuration devices via the Active Serial (AS) interface, as well as JTAG and Passive Serial (PS) modes. For new designs the EPCS1/EPCS4/EPCS16/EPCS64 are commonly used, available in 8-pin SOIC packages. The configuration device stores the FPGA bitstream and loads it at power-up via the dedicated serial interface.
How do I download the EP1C6F25617L datasheet PDF?
The EP1C6F25617L datasheet PDF can be downloaded from Alldatasheet.com at https://www.alldatasheet.com/view.jsp?Searchword=EP1C6F256 or from the Intel FPGA legacy documentation archive. Note that the original Cyclone family datasheet (94 pages per Alldatasheet listing) covers the entire EP1C3/EP1C6/EP1C12/EP1C20 family. The '17L' ordering code defines speed grade and voltage variant within the family datasheet.
Where is the EP1C6F25617L pinout diagram?
The EP1C6F25617L pinout diagram is included in the Cyclone family datasheet chapter covering the 256-pin FineLine BGA package, accessible via Alldatasheet.com or the Intel FPGA legacy documentation site. The pinout uses BGA ball-grid coordinates (rows A-P, columns 1-16). For board design, download the .bxl or .csv pinout file from the Altera/Intel Pin Planner tool for import into your PCB CAD system.
What is the difference between Cyclone and Cyclone II FPGAs?
Cyclone II (EP1C12/EP1C20 successor family EP2C) uses a 90 nm process vs Cyclone's 130 nm, delivering higher logic density and lower power consumption. Cyclone II also adds hardware multipliers (DSP blocks) not present in original Cyclone. However, Cyclone II requires the Quartus II design tool (vs Quartus for Cyclone) and bitstreams are not interchangeable. Migration from Cyclone to Cyclone II typically yields 30-40% power savings and higher Fmax.
Hey Google, what can replace an obsolete Altera Cyclone FPGA?
Obsolete Altera Cyclone FPGAs like the EP1C6F25617L can be replaced with Cyclone II EP2C devices in the same FBGA-256 footprint (e.g., EP2C8F256C8N, EP2C20F256C8N) which require bitstream recompilation but share PCB layout. For modern designs, Intel Cyclone 10 LP (10CL016YU256C8G) or Lattice ECP5 (LFE5U-25F-8BG256C) provide drop-in footprint compatibility in some 256-BGA variants with active long-term supply.
What are the key specifications of EP1C6F25617L that engineers should know?
The EP1C6F25617L key specifications are: 5,980 logic elements, 92,160 RAM bits (90 Kbits) in 20 M4K blocks, 185 maximum user I/O pins, two PLLs, 256-ball FineLine BGA package, -7 speed grade, 1.7V core voltage (L-variant), 3.3V I/O voltage, 130 nm SRAM process, and JTAG/Active Serial/Passive Serial configuration. The part is obsolete and primarily available through independent distributors as of 2026-09-06.

Engineering reference data for EP1C6F25617L — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP1C6F25617L when maintaining legacy equipment that requires the exact low-voltage 1.7V core variant and -7 speed grade of the original Cyclone family, especially when PCB redesign is cost-prohibitive. Choose EP1C6F256C8L (-8 grade) for similar performance at lower cost when the 15-20% Fmax reduction is acceptable. Choose EP1C6F256I7N for industrial temperature environments (-40C to +100C) requiring the same 256-FBGA footprint. Choose EP1C12F256C8N (Cyclone II) when 2x the logic density is needed and bitstream recompilation in Quartus II is feasible. For all new designs in 2026, consider modern alternatives like Intel Cyclone 10 LP or Lattice ECP5 with active long-term supply.

Comparison with Alternatives

Parameter This Product EP1C6F256C8L EP1C6F256I7N EP1C12F256C8N EP1C20F256C8N
Brand Altera Altera Altera Altera Altera
Package 256-FBGA (1.0mm pitch) 256-FBGA - same 256-FBGA - same 256-FBGA - same 256-FBGA - same
Logic Elements 5,980 LE 5,980 LE 5,980 LE 12,060 LE 18,752 LE
Family Cyclone (130 nm) Cyclone Cyclone Cyclone II Cyclone II
Core Voltage 1.7 V (L variant) 1.7 V (L) 1.8 V 1.2 V 1.2 V
Speed Grade -7 -8 -7 -8 -8
Embedded RAM 92,160 bits 92,160 bits 92,160 bits 239,616 bits 239,616 bits
Operating Temperature 0C to +85C (commercial) 0C to +85C -40C to +100C (industrial) 0C to +85C 0C to +85C
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete

Key Differentiators

  • Low-voltage 1.7V core variant (vs EP1C6F25617 (standard 1.8V core))
  • -7 speed grade performance (vs EP1C6F256C8L (-8 speed grade))
  • Original Cyclone architecture (130 nm) (vs EP1C12F256C8N (Cyclone II, 90 nm))

Design Notes

The EP1C6F25617L L-variant requires a regulated 1.7V core supply and a 3.3V I/O supply, with sequencing typically core-first then I/O. Use a low-dropout regulator (e.g., LT1117-1.7 or equivalent) for the core rail. Decouple each VCC pin with 0.1 uF and 10 uF bulk capacitors placed within 5 mm of the BGA balls. The Cyclone family datasheet specifies 8-12 decoupling capacitors distributed across the package perimeter; missing decoupling can cause configuration failures and intermittent logic errors.

The 256-FBGA package uses 1.0 mm ball pitch, requiring 6-8 layer PCB stack-up with microvia or via-in-pad technology for reliable assembly. Signal escape routing on the top layer uses dog-bone fanout; inner layers route between BGA balls. Controlled-impedance traces (50 ohm single-ended, 100 ohm differential) are required for LVDS and clock signals. Maintain 3W spacing between high-speed clocks and user I/O to minimize crosstalk. Thermal pads under the BGA improve heat dissipation but are not connected electrically.

Do not assume the EP1C6F25617L is drop-in compatible with EP1C6F25617 (non-L variant): the 1.7V vs 1.8V core voltage requires a different LDO regulator. Configuration bitstreams for Cyclone and Cyclone II are NOT interchangeable - the EP1C12F256C8N alternative requires recompilation in Quartus II. The MSEL pins must be strapped correctly for the desired configuration mode (AS/PS/JTAG); incorrect strapping causes configuration failure. JTAG chain integrity should be verified before debugging logic issues - a broken TDI/TDO connection masks all functional problems.

High-speed I/O on the EP1C6F25617L (LVDS, SSTL) requires impedance-matched routing with termination resistors placed within 5-10 mm of the receiver. The Cyclone LVDS receivers support up to 640 Mbps but require 100 ohm differential impedance and length-matching within 50 ps. Clock inputs should use the dedicated CLK pins (PLL clock inputs) rather than regular I/O for best jitter performance. Series damping resistors (22-33 ohm) on high-speed outputs reduce reflections when driving long traces or connectors.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

L suffix indicates lead-free / RoHS-compliant package. Original Cyclone family datasheet does not specify halogen-free status. AEC-Q100 not applicable - this is a commercial/industrial grade FPGA, not an automotive-qualified part.

Data verified on: 2026-09-06 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Altera Intel EP1C6F25617L Cyclone FPGA FPGA Field-Programmable Gate Array Programmable Logic Device 256-ball FineLine BGA FBGA-256 M4K memory block PLL Phase-Locked Loop JTAG Active Serial configuration EPCS configuration device logic element Quartus II L voltage variant RoHS BGA package SRAM-based FPGA 130 nm process node industrial temperature grade legacy semiconductor
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