EP1K30TI144-2NGA - ACEX 1K FPGA, 30K Gates, 144-TQFP | Altera
MPN: EP1K30TI144-2NGA β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $22.1 | $2,210.00 |
| 500 | $19.85 | $9,925.00 |
| 1,000 | $18.2 | $18,200.00 |
Drop-in alternatives for EP1K30TI144-2NGA β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1K30TI144-2N
β Drop-Inβ In Stock
$25 / Unit
View Datasheet βEP1K30TI144-2
β Drop-Inβ In Stock
$13.85 / Unit
View Datasheet βEP1K30TC144-2N
β Drop-Inβ In Stock
$21.95 / Unit
View Datasheet βEP1K30TC144-2
β Drop-Inβ In Stock
$18.4 / Unit
View Datasheet βEP1K30TC144-1
β Drop-Inβ In Stock
$9.75 / Unit
View Datasheet βEP1K30TI144-2NGA Maximum Ratings & Electrical Characteristics
| Series | ACEX 1K |
| Logic Elements / Cells | 1728 |
| Total RAM Bits | 24576 |
| Number of Logic Array Blocks (LABs) | 216 |
| Number of I/O | 102 |
| Number of Gates (typical) | 119000 |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Supply Voltage (VCCIO) | 3.3 V |
| Operating Temperature | -40C to +85C (Industrial) |
| Mounting Type | Surface Mount |
| Package / Case | 144-LFQFP / 144-TQFP (20x20 mm) |
| Process Technology | 0.18 um SRAM CMOS |
| Programmable Logic Type | In-system programmable SRAM FPGA |
| Speed Grade | -2 (faster than -3) |
| Lead Free / RoHS Status | Lead free / RoHS compliant per suffix code |
| Design Software | Quartus II, MAX+PLUS II |
| JTAG Support | Yes (IEEE 1149.1 boundary scan) |
| Configuration | SRAM-based, requires configuration device at power-up |
EP1K30TI144-2NGA Pin Configuration
| Pin 1 | I/O β User I/O (bank 1) |
| Pin 2 | I/O β User I/O (bank 1) |
| Pin 3 | VCCIO β I/O supply 3.3 V |
| Pin 4 | I/O β User I/O (bank 1) |
| Pin 5 | I/O β User I/O (bank 1) |
| Pin 6 | GND β Ground |
| Pin 7 | I/O β User I/O (bank 1) |
| Pin 8 | I/O β User I/O (bank 1) |
| Pin 9 | I/O β User I/O (bank 1) |
| Pin 10 | I/O β User I/O (bank 1) |
| Pin 11 | VCCINT β Core supply 2.5 V |
| Pin 12 | I/O β User I/O (bank 1) |
| Pin 13 | I/O β User I/O (bank 1) |
| Pin 14 | GND β Ground |
| Pin 15 | I/O β User I/O (bank 1) |
| Pin 16 | I/O β User I/O (bank 1) |
| Pin 17 | I/O β User I/O (bank 1) |
| Pin 18 | I/O β User I/O (bank 1) |
| Pin 19 | I/O β User I/O (bank 1) |
| Pin 20 | I/O β User I/O (bank 1) |
| Pin 21 | GND β Ground |
| Pin 22 | I/O β User I/O (bank 1) |
| Pin 23 | I/O β User I/O (bank 1) |
| Pin 24 | I/O β User I/O (bank 1) |
| Pin 25 | I/O β User I/O (bank 1) |
| Pin 26 | VCCIO β I/O supply 3.3 V |
| Pin 27 | I/O β User I/O (bank 2) |
| Pin 28 | I/O β User I/O (bank 2) |
| Pin 29 | I/O β User I/O (bank 2) |
| Pin 30 | GND β Ground |
| Pin 31 | I/O β User I/O (bank 2) |
| Pin 32 | I/O β User I/O (bank 2) |
| Pin 33 | VCCINT β Core supply 2.5 V |
| Pin 34 | I/O β User I/O (bank 2) |
| Pin 35 | I/O β User I/O (bank 2) |
| Pin 36 | I/O β User I/O (bank 2) |
| Pin 37 | GND β Ground |
| Pin 38 | CLK0 β Dedicated clock input 0 |
| Pin 39 | CLK1 β Dedicated clock input 1 |
| Pin 40 | I/O β User I/O (bank 2) |
| Pin 41 | I/O β User I/O (bank 2) |
| Pin 42 | VCCIO β I/O supply 3.3 V |
| Pin 43 | I/O β User I/O (bank 2) |
| Pin 44 | I/O β User I/O (bank 2) |
| Pin 45 | GND β Ground |
| Pin 46 | I/O β User I/O (bank 2) |
| Pin 47 | I/O β User I/O (bank 2) |
| Pin 48 | I/O β User I/O (bank 3) |
| Pin 49 | I/O β User I/O (bank 3) |
| Pin 50 | I/O β User I/O (bank 3) |
| Pin 51 | VCCINT β Core supply 2.5 V |
| Pin 52 | I/O β User I/O (bank 3) |
| Pin 53 | I/O β User I/O (bank 3) |
| Pin 54 | GND β Ground |
| Pin 55 | I/O β User I/O (bank 3) |
| Pin 56 | I/O β User I/O (bank 3) |
| Pin 57 | I/O β User I/O (bank 3) |
| Pin 58 | I/O β User I/O (bank 3) |
| Pin 59 | I/O β User I/O (bank 3) |
| Pin 60 | GND β Ground |
| Pin 61 | I/O β User I/O (bank 3) |
| Pin 62 | I/O β User I/O (bank 3) |
| Pin 63 | I/O β User I/O (bank 3) |
| Pin 64 | I/O β User I/O (bank 3) |
| Pin 65 | VCCIO β I/O supply 3.3 V |
| Pin 66 | I/O β User I/O (bank 3) |
| Pin 67 | I/O β User I/O (bank 3) |
| Pin 68 | GND β Ground |
| Pin 69 | I/O β User I/O (bank 4) |
| Pin 70 | I/O β User I/O (bank 4) |
| Pin 71 | I/O β User I/O (bank 4) |
| Pin 72 | I/O β User I/O (bank 4) |
| Pin 73 | VCCINT β Core supply 2.5 V |
| Pin 74 | I/O β User I/O (bank 4) |
| Pin 75 | I/O β User I/O (bank 4) |
| Pin 76 | GND β Ground |
| Pin 77 | I/O β User I/O (bank 4) |
| Pin 78 | I/O β User I/O (bank 4) |
| Pin 79 | CLK2 β Dedicated clock input 2 |
| Pin 80 | CLK3 β Dedicated clock input 3 |
| Pin 81 | I/O β User I/O (bank 4) |
| Pin 82 | I/O β User I/O (bank 4) |
| Pin 83 | VCCIO β I/O supply 3.3 V |
| Pin 84 | I/O β User I/O (bank 4) |
| Pin 85 | I/O β User I/O (bank 4) |
| Pin 86 | GND β Ground |
| Pin 87 | I/O β User I/O (bank 4) |
| Pin 88 | I/O β User I/O (bank 4) |
| Pin 89 | I/O β User I/O (bank 5) |
| Pin 90 | I/O β User I/O (bank 5) |
| Pin 91 | VCCINT β Core supply 2.5 V |
| Pin 92 | I/O β User I/O (bank 5) |
| Pin 93 | I/O β User I/O (bank 5) |
| Pin 94 | GND β Ground |
| Pin 95 | nCONFIG β Configuration control (active-low) |
| Pin 96 | nSTATUS β Configuration status (active-low) |
| Pin 97 | CONF_DONE β Configuration done indicator |
| Pin 98 | DCLK β Configuration clock input |
| Pin 99 | DATA0 β Configuration data input 0 |
| Pin 100 | VCCIO β I/O supply 3.3 V |
| Pin 101 | I/O β User I/O (bank 5) |
| Pin 102 | I/O β User I/O (bank 5) |
| Pin 103 | I/O β User I/O (bank 5) |
| Pin 104 | I/O β User I/O (bank 5) |
| Pin 105 | GND β Ground |
| Pin 106 | I/O β User I/O (bank 5) |
| Pin 107 | I/O β User I/O (bank 5) |
| Pin 108 | VCCINT β Core supply 2.5 V |
| Pin 109 | I/O β User I/O (bank 5) |
| Pin 110 | I/O β User I/O (bank 5) |
| Pin 111 | I/O β User I/O (bank 6) |
| Pin 112 | I/O β User I/O (bank 6) |
| Pin 113 | GND β Ground |
| Pin 114 | I/O β User I/O (bank 6) |
| Pin 115 | I/O β User I/O (bank 6) |
| Pin 116 | VCCIO β I/O supply 3.3 V |
| Pin 117 | I/O β User I/O (bank 6) |
| Pin 118 | I/O β User I/O (bank 6) |
| Pin 119 | I/O β User I/O (bank 6) |
| Pin 120 | I/O β User I/O (bank 6) |
| Pin 121 | I/O β User I/O (bank 6) |
| Pin 122 | VCCINT β Core supply 2.5 V |
| Pin 123 | I/O β User I/O (bank 6) |
| Pin 124 | I/O β User I/O (bank 6) |
| Pin 125 | GND β Ground |
| Pin 126 | TDI β JTAG test data in |
| Pin 127 | TMS β JTAG test mode select |
| Pin 128 | TCK β JTAG test clock |
| Pin 129 | TDO β JTAG test data out |
| Pin 130 | I/O β User I/O (bank 6) |
| Pin 131 | VCCIO β I/O supply 3.3 V |
| Pin 132 | I/O β User I/O (bank 7) |
| Pin 133 | I/O β User I/O (bank 7) |
| Pin 134 | I/O β User I/O (bank 7) |
| Pin 135 | I/O β User I/O (bank 7) |
| Pin 136 | GND β Ground |
| Pin 137 | I/O β User I/O (bank 7) |
| Pin 138 | I/O β User I/O (bank 7) |
| Pin 139 | I/O β User I/O (bank 7) |
| Pin 140 | I/O β User I/O (bank 7) |
| Pin 141 | I/O β User I/O (bank 7) |
| Pin 142 | VCCINT β Core supply 2.5 V |
| Pin 143 | I/O β User I/O (bank 8) |
| Pin 144 | I/O β User I/O (bank 8) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K30TI144-2NGA is suitable for 6 applications: Industrial PLC I/O Expansion, Telecom Line-Card Glue Logic, Avionics and Defense Retrofit, Test and Measurement Front-Ends, Consumer Electronics Protocol Bridging, University Digital Design Laboratory.
Industrial PLC I/O Expansion
The EP1K30TI144-2NGA is widely used in legacy PLC I/O expansion modules where its 1,728 logic elements implement custom protocol handling and glue-logic between a microcontroller and digital I/O banks. With 102 user I/O available on the 144-TQFP footprint, designers can route 32-64 channels of opto-isolated input conditioning plus encoder counters without external 74-series logic. The 2.5 V core and 3.3 V I/O operation keeps the BOM aligned with industrial 24 V->5 V->3.3 V power trees. Industrial temperature grade (-40C to +85C) supports cabinet-mounted deployments on factory floors. SRAM-based in-system programmability enables field firmware upgrades via JTAG, critical for installed-base support where the FPGA is the primary configurable asset.
Recommended
Telecom Line-Card Glue Logic
In legacy telecom line-card designs the EP1K30TI144-2NGA replaces multiple PAL/GAL and discrete 74-series devices by implementing bus arbitration, TDM (time-division multiplexing) framing, and alarm-scan logic in a single 144-TQFP device. The 24,576 bits of embedded array block (EAB) memory buffer small lookup tables and CRC generators, while the 216 LABs support state machines for HDB3/AMI line coding. Its 3.3 V I/O banks interface directly with legacy framers and LIUs without level shifters. The industrial temperature range and proven ACEX 1K reliability make this part a standard component in installed base line cards deployed across central offices worldwide.
Recommended
Avionics and Defense Retrofit
The EP1K30TI144-2NGA appears in military and avionics retrofit programs where the original Altera ACEX 1K design is being re-spun to resolve parts obsolescence while preserving the FPGA bitstream and PCB footprint. Its -40C to +85C industrial operating range, mature Quartus II toolchain support, and long-term aerospace pedigree (with appropriate MIL-STD-883 screening handled by the system integrator) keep it qualified for retrofit activities. Designers can re-target the same RTL to the pin-compatible EP1K30TI144-2N or larger EP1K50TI144-2N with no PCB rework. The SRAM configuration must be paired with a configuration PROM (such as the EPC2 or EPC8) to support instant-on in avionics power environments.
Recommended
Test and Measurement Front-Ends
Bench-top and rack-mounted test equipment uses the EP1K30TI144-2NGA as a flexible digital signal routing and pattern-generation engine. Its 102 user I/O and 24,576 bits of block RAM let it build 16-32 channel pattern generators, parallel stimulus/response engines, and protocol-analyzer state machines without external memory. The 144-TQFP package is friendly to standard 4-layer FR-4 PCB layouts and supports hand-rework for prototype boards. JTAG programming lets test engineers iterate on stimulus patterns in seconds, while the in-system reconfigurability supports multi-instrument personalities in a single hardware platform.
Recommended
Consumer Electronics Protocol Bridging
In consumer A/V receivers, set-top boxes, and game-console peripherals the EP1K30TI144-2NGA acts as a multi-protocol bridge, converting between I2S, SPDIF, parallel RGB, LVDS, and proprietary bus formats using its 1,728 logic elements and 102 I/O. The 144-TQFP package is well suited to high-volume SMT lines, and the 3.3 V I/O interface aligns with standard consumer audio/video companion ICs. Designers can move to the commercial-grade EP1K30TC144-2N for indoor-only chassis and reduce BOM cost while preserving the PCB footprint. The JTAG chain allows post-assembly calibration of skew, color-depth conversion tables, and audio delay lines.
Recommended
University Digital Design Laboratory
Educational institutions continue to deploy the EP1K30TI144-2NGA in digital-logic and computer-architecture laboratories because the Quartus II and MAX+PLUS II software is mature, freely available for legacy versions, and well documented in textbooks and lab manuals. The 144-TQFP development boards expose all 102 user I/O on 0.1-inch headers or PMOD-style connectors, giving students a hands-on platform for designing ALUs, simple CPUs, UARTs, and VGA controllers. Industrial temperature grade and Pb-free packaging (NGA suffix) match modern academic lab ESD and rework tooling. The 1,728 logic-element capacity is ideal for second-year digital-design assignments without overwhelming junior engineers.
Recommended
Recommended Products Summary
Engineering reference data for EP1K30TI144-2NGA β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K30TI144-2N | EP1K30TI144-2 | EP1K30TC144-2N | EP1K30TC144-2 | EP1K30TC144-1 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 |
| Number of I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -2 | -2 | -2 | -2 | -2 | -1 (slower Fmax) |
| Pb-Free / RoHS | Yes (NGA suffix) | Yes (N suffix) | Not guaranteed | Yes (N suffix) | Not guaranteed | Not guaranteed |
| Total RAM Bits | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Approx. Unit Price (USD, qty 1) | 28.50 | ~30 (similar, depends on stock) | ~25 (slightly lower, legacy stock) | ~26 (commercial grade) | ~22 (commercial, non-Pb-free) | ~20 (slower grade) |
Key Differentiators
- Pb-free / RoHS assembly with industrial temperature grade in single suffix (vs EP1K30TI144-2 (without NGA suffix))
- Speed grade -2 with industrial temperature coverage (vs EP1K30TC144-1 (commercial, slower grade))
- 102 I/O with 24 Kbit block RAM in the smallest ACEX 1K TQFP package (vs EP1K50TI144-2N (higher gate count))
Design Notes
The ACEX 1K EP1K30 requires a clean 2.5 V VCCINT and 3.3 V VCCIO supply. Place 100 nF decoupling capacitors within 5 mm of every VCCINT and VCCIO pin, and add bulk 47-100 uF tantalum or low-ESR ceramic capacitors on each supply rail near the package. Power-on ramp should rise monotonically within the datasheet-specified tr (typically <100 ms) to avoid configuration failures; use a power-good supervisor if the upstream regulator has a soft-start window longer than 100 ms.
Because the EP1K30 is SRAM-based, the bitstream must be reloaded from a configuration PROM (EPC2, EPC8, or compatible) on every power-up. Designs that assume the FPGA retains configuration across power cycles will fail on the first power-down. Add a JTAG header in the design even for production boards to enable in-field programming and recovery from corrupted configuration.
The 144-TQFP package has a typical theta_JA of around 25-30 C/W on a 4-layer JEDEC test board; with industrial -40C to +85C ambient operation, junction temperature at the 800 mW worst-case power envelope remains within the 125 C limit. For continuous operation at the upper temperature limit, add a 100-200 mm^2 copper pour on the top layer under the exposed die paddle (or under the package body) to reduce thermal resistance by 20-30%.
Use 4-layer FR-4 with continuous VCC and GND planes for the 144-TQFP land pattern; route all 102 user I/O on the top and bottom layers to maintain signal-integrity for 50-100 MHz operation. Pair each high-speed clock trace with a ground return path directly underneath, and place 33 ohm series-termination resistors within 5 mm of the FPGA clock pins to suppress overshoot on CLK0-CLK3.
Compliance Information
RoHS compliance inferred from NGA suffix (Altera / Intel PSG Pb-free convention). AEC-Q100 not applicable (industrial-grade FPGA, not automotive-qualified). REACH and conflict-mineral statements should be obtained from the specific distributor or Intel PSG certificate of compliance at order time.
