EP1K50TI144-2F - 50K-Gate ACEX-1K FPGA, 144-TQFP, Industrial | Intel
MPN: EP1K50TI144-2F ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.75 | $327.50 |
| 100 | $26.4 | $2,640.00 |
| 500 | $22.1 | $11,050.00 |
| 1,000 | $18.95 | $18,950.00 |
Drop-in alternatives for EP1K50TI144-2F — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50TI144-2
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View Datasheet →EP1K50TI144-2F Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Series | FLEX 10K / ACEX 1K |
| Logic Elements / Cells | 2880 |
| Equivalent Gates | 50,000 |
| Embedded RAM Bits | 40,960 |
| Maximum User I/O | 102 |
| Number of Terminals | 144 |
| Terminal Form | GULL WING |
| Package Code | QFP (TQFP-144 / PQFP144) |
| Package Shape | SQUARE |
| JEDEC Package Code | S-PQFP-G144 |
| Process Technology | 0.22 µm CMOS |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V typical) |
| Maximum Clock Frequency | 200 MHz (family datasheet) |
| Speed Grade | -2 (fast) |
| Operating Temperature Grade | Industrial |
| Programming Interface | JTAG (IEEE 1149.1) |
| Mounting Type | Surface Mount |
EP1K50TI144-2F s-pqfp-g144 Pin Configuration Guide
Complete pinout information for EP1K50TI144-2F (s-pqfp-g144 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K50TI144-2F.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50TI144-2F is suitable for 6 applications: Industrial Control & Factory Automation, Telecommunications Line-Card Glue Logic, ASIC Prototyping & Logic Replacement, Embedded Test & Measurement Equipment, Automotive Telematics & Body Electronics, Legacy System Maintenance & Field Replacement.
Industrial Control & Factory Automation
The EP1K50TI144-2F's 2,880 logic elements, 40,960 bits of embedded RAM, and industrial temperature grade make it well-suited to industrial control and factory automation designs. The 50,000-gate capacity supports medium-complexity state machines for PLC-style controllers, multi-axis motor-control glue logic, and protocol bridging (RS-232/RS-485/Ethernet converters). The 102 user I/Os are sufficient to interface with multiple sensors, opto-isolated inputs, and relay-driver outputs simultaneously. Industrial-grade operation across extended temperature ranges is essential for factory-floor environments where ambient temperatures fluctuate. The 144-pin TQFP package's mature surface-mount assembly compatibility simplifies manufacturing and rework, while the JTAG-based in-system programmability enables field firmware updates without component removal.
Recommended
Telecommunications Line-Card Glue Logic
In telecommunications line cards, the EP1K50TI144-2F serves as glue logic between physical-layer transceivers, TDM framers, and backplane ASICs. The device's 200 MHz maximum clock frequency and 2.5 V core supply are well-matched to legacy telecom data-path designs that operate at rates below 155 MHz. With 50,000 equivalent gates, designers can implement custom HDLC controllers, ATM cell segmentation and reassembly logic, and T1/E1 framing functions without external glue-logic ICs. The 102 user I/Os provide ample connectivity for multi-port line cards interfacing with multiple transceiver channels. Embedded RAM (40,960 bits) supports small FIFO buffers required for rate adaptation between telecom data streams.
Recommended
ASIC Prototyping & Logic Replacement
The EP1K50TI144-2F is widely used as an ASIC prototype and low-volume replacement for glue-logic ICs, custom controllers, and proprietary interfaces. Designers targeting fixed-function ASICs can validate their designs in a reprogrammable FPGA before committing to NRE costs, with the same 144-pin TQFP package enabling drop-in replacement of ASICs in identical footprints. The 50,000-gate capacity matches medium-scale ASICs commonly used in industrial, automotive, and consumer products. The JTAG programming interface allows rapid design iteration during development. Once the design is validated, the FPGA can serve as the production solution for low-volume applications, avoiding expensive ASIC mask charges while delivering deterministic hardware performance that microcontrollers cannot match for parallel tasks.
Recommended
Embedded Test & Measurement Equipment
Test and measurement equipment benefits from the EP1K50TI144-2F's combination of moderate logic density, embedded RAM for data buffers, and deterministic timing. The device can implement custom waveform generators, protocol analyzers, signal-conditioning logic, and timing-critical trigger circuits. The 102 user I/Os enable simultaneous interface with multiple measurement channels, while the 200 MHz maximum clock frequency supports sampling-rate generation and timing synthesis. Embedded RAM (40,960 bits) provides sufficient buffer memory for short captures without external SRAM. The industrial temperature grade ensures operation in lab environments where ambient temperature is not strictly controlled. The mature TQFP-144 package allows hand-soldering for prototype builds and rapid rework during instrument development cycles.
Recommended
Automotive Telematics & Body Electronics
Although not AEC-Q100 qualified, the EP1K50TI144-2F is suitable for non-safety automotive applications such as telematics control units, infotainment peripherals, and body electronics modules. The 50,000-gate capacity supports LIN/CAN bus controllers, custom sensor interfaces, and protocol bridging between automotive networks and external connectivity modules. The 102 user I/Os accommodate multiple sensor inputs, actuator driver interfaces, and diagnostic ports. Embedded RAM provides small FIFO buffers for message queuing on automotive buses. The industrial temperature grade covers under-dash and cabin-mounted electronics that operate in milder thermal environments compared to under-hood applications. Designers targeting AEC-Q100 compliance should evaluate current-generation Cyclone IV automotive variants instead.
Recommended
Legacy System Maintenance & Field Replacement
The EP1K50TI144-2F remains critical for maintaining and repairing legacy equipment where the original Altera ACEX-1K FPGAs are still in service. Industrial machines, telecommunications infrastructure, test equipment, and military systems deployed in the late 1990s and early 2000s often use ACEX-1K devices that require form-fit-function replacements as original parts age out. The 144-pin TQFP package allows board-level replacement without PCB rework. Drop-in compatible variants like EP1K50TI144-2N, EP1K50TI144-2, and EP1K30TI144-2 provide sourcing flexibility when the original -2F part is unavailable. The JTAG interface permits direct bitstream programming from original ACEX-1K programming files (.pof or .sof), minimizing firmware re-validation effort.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50TI144-2F — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50TI144-2 | EP1K50TI144-2N | EP1K50TI144-1X | EP1K30TI144-2 | EP1K10TI144-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | TQFP-144 (S-PQFP-G144) | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 | 576 |
| Equivalent Gates | 50,000 | 50,000 | 50,000 | 50,000 | 30,000 | 10,000 |
| Embedded RAM Bits | 40,960 | 40,960 | 40,960 | 40,960 | 24,576 | 12,288 |
| Maximum User I/O | 102 | 102 | 102 | 102 | 102 | 92 |
| Speed Grade | -2 | -2 | -2 | -1 (slower) | -2 | -2 |
| Supply Voltage | 2.5 V (2.375-2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| RoHS / Lead-Free Finish | [DATA_NEEDED: RoHS status] | [DATA_NEEDED] | Yes (N suffix) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Industrial temperature grade without lead-free finish (vs EP1K50TI144-2N)
- Highest density in the 144-pin TQFP ACEX-1K family (vs EP1K30TI144-2)
- Faster speed grade than -1 variants (vs EP1K50TI144-1X)
- Mature industrial-grade FPGA with proven long-term reliability (vs ATF1504AS (CPLD))
Design Notes
Estimated: At 100% logic utilization with 200 MHz internal clock, the EP1K50TI144-2F core current draw can reach approximately 200-300 mA from VCCINT (2.5 V). Provide at least one bulk 10 µF tantalum capacitor and one 0.1 µF ceramic decoupling capacitor per VCCINT pin, placed within 5 mm of each supply pin. Multiple VCCIO banks should each have their own 0.1 µF decoupling to suppress simultaneous-switching-output (SSO) noise. Add a ferrite bead between the 2.5 V regulator and the FPGA's VCCINT pins to filter switching noise from the regulator.
The 144-pin TQFP package has a 0.5 mm lead pitch requiring careful PCB layout. Use a 4-layer PCB with continuous power and ground planes for signal integrity. Maintain 50 Ω controlled impedance on high-speed traces (e.g., clock nets above 100 MHz). Keep JTAG trace lengths under 150 mm and series-terminate at the driver for TCK. Provide a 1 kΩ pull-up resistor on nCONFIG and CONF_DONE per the ACEX-1K configuration guide. Use thermal relief spokes on TQFP pads to balance solderability and thermal dissipation during reflow.
Do not confuse the -2F suffix with the -2N suffix - the -F indicates industrial temperature grade with non-lead-free finish, while -N indicates lead-free (Pb-free) finish. Both share the same 144-pin TQFP package and -2 speed grade, so the PCB footprint is identical, but lead-free reflow profiles must be applied to -N variants. Also note that the EP1K50TI144-2F belongs to the NRND ACEX-1K family; new designs should consider Intel Cyclone IV/MAX II equivalents unless obsolescence is acceptable.
The TQFP-144 exposed die pad on the package bottom improves thermal performance but is not electrically connected in the ACEX-1K family. The pad may be soldered to a PCB thermal land for improved heat dissipation or left unconnected. When implementing multi-FPGA designs, route configuration daisy-chains carefully to avoid signal-integrity issues during configuration - each EP1K50TI144-2F's CONF_DONE pin should have its own 1 kΩ pull-up to VCCIO, not shared with neighboring devices.
Compliance Information
RoHS and REACH status not specified in verified data - the -F suffix typically indicates non-lead-free terminal finish (SnPb); verify with distributor documentation for production compliance. Not AEC-Q100 qualified - automotive safety applications require different parts.
