EP1S10F672I7N - Stratix FPGA, 10,570 LEs, 672-BGA | Intel
MPN: EP1S10F672I7N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 250 | $130 | $32,500.00 |
| 500 | $118 | $59,000.00 |
Drop-in alternatives for EP1S10F672I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S10F672C7N
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View Datasheet →EP1S10F672I7
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View Datasheet →EP1S10F672C6
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View Datasheet →EP1S10F672I7N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| User I/Os | 345 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Frequency | 420.17 MHz |
| Operating Temperature | 0C to 85C |
| Package | 672-ball FineLine BGA, 35 x 35 mm, 1.27 mm pitch |
| Logic Family | CMOS |
| Embedded Memory | 920 Kbits (TriMatrix) |
| DSP Blocks | Yes (dedicated) |
| Configuration Interface | Active Serial / Passive Serial / JTAG |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Speed Grade | I7 (industrial, -7 speed bin) |
| MSL Level | 3 (per JEDEC J-STD-020, typical for BGA of this era) |
| Mounting Type | Surface Mount (BGA) |
EP1S10F672I7N 672-ball fineline bga, 35 x 35 mm, 1.27 mm pitch Pin Configuration Guide
Complete pinout information for EP1S10F672I7N (672-ball fineline bga, 35 x 35 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S10F672I7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10F672I7N is suitable for 6 applications: Telecommunications Line-Card Processing, Software-Defined Radio Baseband, High-Speed Data Acquisition Front-End, Industrial Imaging and Machine Vision, Test and Measurement Instrumentation, Embedded Control and Industrial Networking.
Telecommunications Line-Card Processing
The EP1S10F672I7N fits line-card processing applications because its 10,570 logic elements and dedicated DSP blocks deliver the throughput needed for channel aggregation, framing, and packet classification. With 345 user I/Os in the 672-FBGA, designers can connect directly to external PHYs, SFP cages, and backplane SERDES glue logic without external bus expander chips. The embedded TriMatrix memory (920 Kbits) supports fast lookup tables for routing and QoS classification. The industrial 0-85°C temperature grade suits central-office equipment that runs in temperature-controlled but continuously-operated cabinets.
Recommended
Software-Defined Radio Baseband
The EP1S10F672I7N suits SDR baseband implementations because its dedicated DSP blocks accelerate the multiply-accumulate loops that dominate FIR filtering, FFT butterfly operations, and digital down-conversion. The 672-FBGA exposes enough I/O to support parallel ADC/DAC interfaces and the high-speed LVDS links typically used between the FPGA and RF front-end converters. Quartus II IP libraries provide FFT, NCO, and digital up/down-converter cores tuned for Stratix DSP blocks, reducing firmware development time. The industrial temperature rating enables deployment in outdoor or ruggedized enclosures where commercial-grade parts would otherwise require thermal derating.
Recommended
High-Speed Data Acquisition Front-End
The EP1S10F672I7N fits high-speed data acquisition front-ends because its embedded TriMatrix memory absorbs burst ADC samples at peak rates while the FPGA fabric pre-processes the data stream. The 345 available user I/Os in the 672-FBGA allow direct LVDS or parallel-CMOS interfaces to multi-channel ADC arrays without intermediate buffering. Designers can route events through on-chip DSP blocks for real-time decimation, filtering, or feature extraction before storing to external DDR memory. The 0-85°C industrial rating supports factory-floor and laboratory instrumentation deployments where ambient temperatures fluctuate during continuous operation.
Recommended
Industrial Imaging and Machine Vision
The EP1S10F672I7N is well matched to industrial imaging pipelines because its 10,570 LEs can host Bayer demosaicing, color-space conversion, and preprocessing kernels in parallel with embedded memory acting as line buffers. The 345 I/Os of the 672-FBGA accommodate Camera Link, CoaXPress, or LVDS-based imagers that often demand 20+ differential pairs plus control signals. The Stratix DSP blocks accelerate convolution operations used in edge-detection and morphological filtering, offloading the host processor. Industrial 0-85°C qualification supports factory-floor cameras exposed to warm LED illumination and enclosed housings.
Recommended
Test and Measurement Instrumentation
The EP1S10F672I7N suits test and measurement instruments because its combination of logic density, embedded memory, and DSP blocks enables stimulus generation, response capture, and on-the-fly signal analysis in a single device. The 672-FBGA package exposes enough user I/Os to drive parallel DAC/ADC pairs, reference clocks, and trigger buses simultaneously. The Quartus II toolchain provides SignalTap II embedded logic-analyzer IP that uses the JTAG pins already present on the device, eliminating the need for external probing on most signals. Industrial 0-85°C operation covers bench and laboratory environments that frequently exceed typical office temperatures.
Recommended
Embedded Control and Industrial Networking
The EP1S10F672I7N fits embedded control and industrial networking designs because its logic capacity can run Profinet, EtherCAT, or EtherNet/IP soft-MAC stacks alongside custom deterministic control logic. The 345 I/Os of the 672-FBGA provide PHY interfaces, GPIO for sensors and actuators, and memory buses to external SRAM or flash. Industrial 0-85°C qualification makes it suitable for control cabinets and machine enclosures where ambient temperatures climb during long production runs. Designers benefit from the legacy Stratix IP ecosystem, which still ships industrial-protocol reference designs in the Quartus II library.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10F672I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10F672C7N | EP1S10F672I7 | EP1S10F672C7 | EP1S10F672C6 |
|---|---|---|---|---|---|
| Package | 672-FBGA (35 x 35 mm) | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same | 672-FBGA (35 x 35 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Temperature Grade | Industrial (0C to 85C) | Commercial (0C to 70C) | Industrial (0C to 85C) | Commercial (0C to 70C) | Commercial (0C to 70C) |
| Speed Grade | -7 | -7 | -7 | -7 | -6 |
| User I/Os | 345 | 345 | 345 | 345 | 345 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Industrial 0-85C temperature qualification in the 672-FBGA Stratix line (vs EP1S10F672C7N)
- Same silicon die and ball map as the C-grade siblings (vs EP1S10F672C7)
- Higher speed grade than the -6 variant (vs EP1S10F672C6)
Design Notes
The EP1S10F672I7N requires Quartus II version 13.0 or older because Intel/Altera dropped legacy Stratix support in Quartus Prime 14.0 and later. Verify your design services environment has a licensed Quartus II 13.0 installation before committing to a board spin. IP cores generated with newer Quartus versions are not backward compatible. Estimated: a Quartus II 13.0 maintenance extension is necessary for any long-term firmware updates.
The 672-FBGA has a theta-JA around 8-12 C/W with a standard 4-layer PCB and adequate thermal via array under the package, so at full 1.5 V core utilization the device typically dissipates 2-5 W. Provide a continuous via-in-pad or thermal-ball pattern stitched to internal copper planes. The industrial 0-85°C spec assumes proper airflow; in sealed enclosures, derate to 70°C ambient. Estimated: airflow of 200 LFM is recommended for fully-utilized designs.
The 1.27 mm pitch FineLine BGA requires NSMD (non-solder-mask defined) pads with a diameter of approximately 0.55 mm to ensure reliable solder joints. Microvia-in-pad is strongly recommended for the inner-row balls that route to internal layers, and a 4-6 layer stack-up with continuous ground planes below the device is mandatory for signal integrity of the LVDS pairs. Use ENIG or OSP surface finish and reflow profile per JEDEC J-STD-020 MSL-3.
Stratix devices require specific VCCINT and VCCIO power-up sequencing to avoid latch-up; consult the Stratix handbook chapter on power management before finalizing the power tree. Configuration mode (AS, PS, or JTAG) must be selected via MSEL pins and cannot be changed in-system. The 672-FBGA exposes fewer user I/Os than the raw 672 ball count because configuration, JTAG, power, and ground balls consume a meaningful fraction; budget only for 345 I/Os in pin planning.
Compliance Information
RoHS/REACH compliance for the EP1S10F672I7N is not stated in the provided web data; consult the official Intel/Altera PDN and material declaration documents for definitive compliance information. AEC-Q100 is not applicable to FPGAs of this generation.
