EP1S25F672C8 - 25,660 LEs Stratix FPGA 672-BGA | Intel / Altera
MPN: EP1S25F672C8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $652.85 | $652.85 |
| 10 | $620.21 | $6,202.10 |
| 100 | $587.56 | $58,756.00 |
| 500 | $555 | $277,500.00 |
| 1,000 | $525 | $525,000.00 |
Drop-in alternatives for EP1S25F672C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S25F672C7N
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$535 / Unit
View Datasheet →EP1S25F672C7
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$595 / Unit
View Datasheet →EP1S25F672C6N
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$192.75 / Unit
View Datasheet →EP1S25F672C6
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$125 / Unit
View Datasheet →EP1S25F672C5N
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$142 / Unit
View Datasheet →EP1S25F672C8 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| User I/Os | 473 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Operating Frequency | 357.14 MHz |
| Package | 672-ball FineLine BGA (FBGA) |
| Package Dimensions | 35 x 35 mm, 1.27 mm pitch |
| Speed Grade | C8 (commercial, -8) |
| Operating Temperature | 0 C to +85 C (commercial) |
| Mounting Type | Surface Mount |
| Logic Family | CMOS |
| Configuration Method | JTAG / Altera configuration device |
EP1S25F672C8 35 x 35 mm, 1.27 mm pitch Pin Configuration Guide
Complete pinout information for EP1S25F672C8 (35 x 35 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F672C8.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F672C8 is suitable for 7 applications: ASIC Prototyping, Telecom Line-Card Design, Video and Image Processing Pipelines, Military and Aerospace Signal Processing, High-Speed Serial Interface Bridging, Industrial Control and Automation, Legacy Storage System Design.
ASIC Prototyping
The EP1S25F672C8 fits ASIC prototyping because its 25,660 logic elements provide sufficient capacity to map mid-complexity ASIC RTL into a real, measurable FPGA target. Designers can validate timing, power, and I/O behavior before committing to silicon, reducing respin risk. The 672-BGA package supports up to 473 user I/Os, which is more than enough for ASIC prototyping boards with DDR memory buses and parallel chip-to-chip interfaces. Compared to a fixed-function ASIC, the FPGA fabric gives the engineering team the ability to iterate RTL changes in hours rather than weeks. The C8 commercial speed grade is suitable for lab validation, though production prototypes targeting faster timing closure typically migrate to the C6 or C7 bins.
Recommended
Telecom Line-Card Design
Telecom line cards need high logic density and many I/Os for framer, mapper, and traffic-manager functions, and the EP1S25F672C8 provides 25,660 LEs in a 672-BGA package with 473 user I/Os to support those parallel data paths. The integrated DSP blocks accelerate Reed-Solomon, FEC, and CRC operations common in SONET/SDH and Ethernet line cards. The 130 nm process and 1.5 V core keep dynamic power manageable for always-on telecom infrastructure. The C8 speed grade is appropriate for backplane speeds in the 100-200 MHz range typical of legacy line-card designs.
Recommended
Video and Image Processing Pipelines
The EP1S25F672C8 is well suited to video processing because its TriMatrix on-chip memory and dedicated DSP blocks deliver the parallelism required for real-time pixel pipelines, deinterlacers, and scaling engines. The 473 user I/Os accept wide parallel video buses from external video ADCs and drive DDR memory for frame buffering. 25,660 logic elements support multi-tap filters and motion-estimation kernels in broadcast and surveillance applications. The 130 nm Stratix fabric is widely cited in legacy video reference designs from Altera's broadcast development kit family.
Recommended
Military and Aerospace Signal Processing
For military and aerospace signal-processing applications, the EP1S25F672C8 offers the logic density and DSP throughput needed for radar pulse compression, electronic-warfare demodulation, and software-defined-radio baseband chains. Designers often select the EP1S25 family because of its maturity, extensive reference designs, and availability of industrial-temperature variants (EP1S25B672) for rugged environments. The 672-BGA package supports high-bandwidth data converters and external SRAM interfaces. Note that for true military/aerospace programs, the EP1S25F672I (industrial) or EP1S25B672C (military-temp) speed grades are typically required.
Recommended
High-Speed Serial Interface Bridging
The EP1S25F672C8 is suitable for high-speed serial bridging because the Stratix family integrates dedicated transceiver channels supporting multi-gigabit serial protocols. Designers use the device to bridge between legacy parallel buses and serial backplanes, or to aggregate lower-speed links onto a higher-speed uplink. The 25,660 logic elements comfortably fit serializer/deserializer, clock-data-recovery, and protocol-state-machine functions. The 672-BGA package supplies the power and ground pins required by the high-speed transceivers to meet jitter budgets.
Recommended
Industrial Control and Automation
The EP1S25F672C8 supports industrial control designs by combining 25,660 LEs of programmable logic with 473 user I/Os for sensor aggregation, motor-control loop timing, and safety-logic integration. The TriMatrix memory blocks implement deterministic buffer pools required for closed-loop control, and the DSP blocks accelerate field-oriented control algorithms. The commercial 0 to +85 C operating range covers most factory-floor enclosures; for harsher environments, designers specify the EP1S25B672 industrial-temperature variant.
Recommended
Legacy Storage System Design
The EP1S25F672C8 is frequently retained in legacy storage controller designs (RAID, SAN switches, storage accelerators) where the Stratix fabric handles parallel data-path processing and protocol bridging. Its 25,660 logic elements and on-chip memory absorb the buffer-management and XOR-acceleration logic typical in RAID-6 implementations. The 672-BGA footprint and 473 I/Os connect to multiple SATA/SAS PHYs and DDR-II memory channels. For new designs, Intel recommends Stratix V or Cyclone V, but the EP1S25 remains a common BOM entry in long-lifecycle storage platforms.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F672C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F672C7N | EP1S25F672C7 | EP1S25F672C6N | EP1S25F672C6 | EP1S25F672C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-ball FineLine BGA (FBGA) | 672-ball FineLine BGA (FBGA) - same | 672-ball FineLine BGA (FBGA) - same | 672-ball FineLine BGA (FBGA) - same | 672-ball FineLine BGA (FBGA) - same | 672-ball FineLine BGA (FBGA) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| LABs | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Speed Grade | C8 (-8) | C7N (-7, lead-free) | C7 (-7) | C6N (-6, lead-free) | C6 (-6) | C5N (-5, lead-free) |
| User I/Os | 473 | 473 | 473 | 473 | 473 | 473 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Lifecycle Status | Obsolete (legacy Stratix) | Obsolete (legacy Stratix) | Obsolete (legacy Stratix) | Obsolete (legacy Stratix) | Obsolete (legacy Stratix) | Obsolete (legacy Stratix) |
Key Differentiators
- Multiple speed grades share the same 672-BGA footprint (vs EP1S25F780C7N)
- Mature Stratix reference-design ecosystem (vs Generic 130 nm FPGA)
- Higher I/O count than smaller-density Stratix devices (vs EP1S10F672C7N)
Design Notes
The EP1S25F672C8's 672-ball FineLine BGA at 1.27 mm pitch demands via-in-pad or microvia escape routing on the PCB. Use a 4- or 6-layer stack-up with continuous power and ground planes to supply the 1.5 V core and I/O voltage rails. Per Stratix pin connection guidelines, place decoupling capacitors within 200 mils of each power pin, and use 0.1 uF / 0.01 uF / 10 uF combinations per the Quartus power-play tuner recommendations. Fan-out pattern must respect anti-pad clearances and use blind/buried vias if signal escape is congested under the BGA field.
Estimated: when migrating from C8 (this device) to C6 or C7 speed grades, expect approximately 15-25% faster Fmax on internal timing paths but identical logic utilization. Designers often forget to update the Quartus device-selection field, leaving the synthesis target as the slower C8 even after PCB re-spin, which loses the benefit of the higher speed grade. Always re-run the Quartus Fitter with the new device selection before tape-out. Also note that the C5N variant requires explicit Quartus timing-model verification because the -5 bin was a niche offering.
Estimated: at typical Stratix utilization of 70% logic + 60% memory + active transceivers, the EP1S25F672C8 dissipates approximately 5-8 W steady-state. With the 672-BGA's typical theta_JA of 15-20 C/W (depending on PCB stack-up and airflow), expect junction-temperature rises of 75-160 C above ambient. The commercial device is rated to 85 C ambient, so airflow or a heatsink is recommended if the design runs near full utilization. Do not confuse the EP1S25F672C8 (commercial, 0 to +85 C) with the EP1S25B672C8 (industrial/extended, -40 to +125 C) when calculating thermal margin.
Compliance Information
EP1S25F672C8 is a legacy Altera / Intel Stratix FPGA. MSL Level, RoHS, REACH, and lead-free status were not present in the Verified Web Data; the C7/C6/C5 variants with the "N" suffix denote lead-free finishes per Altera ordering nomenclature. AEC-Q100 is not applicable (FPGA, not an automotive-qualified IC).
