EP1SGX25FF1020C7N - Stratix GX 25K LE FPGA, 1020-FBGA | Intel
MPN: EP1SGX25FF1020C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85.5 | $855.00 |
| 100 | $76 | $7,600.00 |
| 500 | $68 | $34,000.00 |
| 1,000 | $62.5 | $62,500.00 |
Drop-in alternatives for EP1SGX25FF1020C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX25FF1020C7N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Series | Stratix |
| Logic Elements / Cells | 25,660 |
| Number of LABs / CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| Number of User I/O | 607 |
| Supply Voltage (Core) | 1.5 V (1.425 V to 1.575 V) |
| Process Technology | 130 nm CMOS |
| Operating Temperature | 0 C to 85 C (TJ, commercial) |
| Package | 1020-BBGA, FC-FBGA (33 x 33 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Logic Family | CMOS |
| Packaging | Tray |
| Lead Free / RoHS | Lead free (per datasheet suffix N) |
| Speed Grade | 7 (commercial) |
| Number of Pins / Balls | 1020 |
EP1SGX25FF1020C7N 1020-bbga, fc-fbga (33 x 33 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1SGX25FF1020C7N (1020-bbga, fc-fbga (33 x 33 mm, 1 mm pitch) package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25FF1020C7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25FF1020C7N is suitable for 6 applications: Telecom Line Cards, High-Speed Serial Backplanes, Baseband Signal Processing, Test and Measurement Equipment, ASIC Prototyping, Industrial Imaging and Video Processing.
Telecom Line Cards
The EP1SGX25FF1020C7N fits telecom line cards because it integrates multi-gigabit transceivers (up to 3.125 Gbps) alongside 25,660 logic elements, eliminating external PHY chips. Its 1,944,576 bits of embedded RAM support packet buffering and lookup tables for switching fabrics. The 1020-ball FC-FBGA provides 607 user I/Os for parallel backplane connections, while the commercial 0-85 C temperature range suits CO (central office) environments. Designers route SPI-4.2 or XAUI channels directly into the built-in transceivers and implement traffic managers in the programmable fabric. Power sequencing for VCCINT, VCCIO, and PLL supplies follows the Stratix GX handbook reference design.
Recommended
High-Speed Serial Backplanes
The EP1SGX25FF1020C7N is well suited to high-speed serial backplanes because built-in transceivers handle Serial RapidIO, PCI Express, and XAUI directly without external SerDes. With 25,660 logic elements, designers can implement protocol bridges and link-layer logic in the fabric. The 1020-ball FC-FBGA package supports controlled-impedance routing required for multi-Gbps channels, and the 1.5 V core keeps board power budgets reasonable for multi-board systems. Designers typically pair the FPGA with external clock buffers and reference clock distribution networks, and use the embedded PLLs for jitter-clean clock synthesis at 156.25 MHz or 312.5 MHz line rates.
Recommended
Baseband Signal Processing
The EP1SGX25FF1020C7N suits baseband signal processing because its 25,660 logic elements plus embedded RAM blocks can implement FFTs, Viterbi decoders, and channel equalizers in hardware. Combined with built-in transceivers, designers can place ADC/DAC data directly into the FPGA at multi-gigabit rates, eliminating glue logic. The 130 nm CMOS process delivers predictable timing closure for DSP pipelines, while 1,944,576 RAM bits hold coefficient tables and sample buffers. Quartus II DSP Builder accelerates MATLAB-to-FPGA flows for wireless baseband prototyping in 3G/4G systems.
Recommended
Test and Measurement Equipment
The EP1SGX25FF1020C7N fits test and measurement instruments because its built-in multi-gigabit transceivers accept high-speed serial test patterns directly, while the 25,660 logic elements implement stimulus generation, response capture, and protocol-aware analysis. The 1020-ball FC-FBGA supports the high pin count needed for parallel bus probes, parallel DAC interfaces, and trigger distribution. Embedded RAM (1,944,576 bits) captures deep waveform traces. Engineers use Quartus II with SignalTap logic analyzer for in-system debug of protocol compliance testers for SATA, PCIe, and Ethernet.
Recommended
ASIC Prototyping
The EP1SGX25FF1020C7N is ideal for ASIC prototyping because designers can map ASIC RTL into the 25,660 logic elements and embedded memory for functional verification at near-real-time speeds. The built-in transceivers let prototype boards reuse the same SerDes interfaces as the target ASIC, validating PCB signal integrity. The 1020-ball FC-FBGA supports large pin counts typical of networking ASICs. Quartus II Design Partitions and incremental compile enable team-based RTL development. When the ASIC is ready, the FPGA prototype is replaced with the netlist, preserving all verification test vectors.
Recommended
Industrial Imaging and Video Processing
The EP1SGX25FF1020C7N fits industrial imaging and video processing because its 25,660 logic elements can implement real-time pipelines for image enhancement, color space conversion, and object detection, while embedded memory buffers line-scan or area-scan data. The 607 user I/Os in the 1020-ball FC-FBGA accept Camera Link, LVDS, or HDMI inputs directly. Designers build frame grabbers, machine vision controllers, and broadcast video processors on this part, using Quartus II Video and Image Processing (VIP) Suite IP cores for fast development. The commercial 0-85 C temperature range suits factory floor deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25FF1020C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25FF1020C7 | EP1SGX25FF1020C7ES | EP1SGX25FF1020C6N | EP1SGX25FF1020C6 | EP1SGX25FF1020C6ES | EP1SGX25DF1020C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel (Stratix II GX) |
| Package | 1020-BBGA, FC-FBGA (33x33 mm) | 1020-BBGA, FC-FBGA - same | 1020-BBGA, FC-FBGA - same | 1020-BBGA, FC-FBGA - same | 1020-BBGA, FC-FBGA - same | 1020-BBGA, FC-FBGA - same | 1020-BBGA, FC-FBGA - same package, pinout differs |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | [DATA_NEEDED - Stratix II GX density] |
| Speed Grade | 7 (commercial) | 7 | 7 (ES) | 6 (slower) | 6 (slower) | 6 (slower, ES) | 7 |
| Family | Stratix I GX | Stratix I GX | Stratix I GX | Stratix I GX | Stratix I GX | Stratix I GX | Stratix II GX |
| User I/O | 607 | 607 | 607 | 607 | 607 | 607 | [DATA_NEEDED - Stratix II GX I/O count] |
| Process / Core Voltage | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 90 nm / 1.2 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Lead Free (RoHS) | Yes (N suffix) | Yes (non-N variant) | Yes | Yes (N suffix) | Yes (non-N variant) | Yes | Yes |
Key Differentiators
- Highest speed grade in the Stratix I GX FF1020 family (vs EP1SGX25FF1020C6N)
- Lead-free RoHS-compliant assembly by default (vs EP1SGX25FF1020C7 (non-N suffix))
- Identical pinout and die as the engineering sample variant (vs EP1SGX25FF1020C7ES)
- Stratix I GX architecture (not Stratix II) for legacy design reuse (vs EP1SGX25DF1020C7N (Stratix II GX))
Design Notes
Power sequencing for the EP1SGX25FF1020C7N must follow the Stratix GX handbook: VCCINT (1.5 V core) before or simultaneously with VCCIO bank supplies, with PLL analog VCC (VCC_PLL) requiring clean low-noise regulation. The transceiver PLLs require dedicated filtering. Power estimation should use Quartus II PowerPlay with realistic toggle rates (typically 20-40% for serial traffic); early estimates suggest 5-15 W total board dissipation. Use a multi-phase DC-DC converter with output accuracy within 3% to meet VCCINT tolerance (1.425 V to 1.575 V).
The 1020-ball FC-FBGA (33 x 33 mm) package dissipates significant heat under full transceiver and fabric utilization. Theta-JA for this package is approximately 12-15 C/W with adequate board airflow. Design a board-level thermal solution with thermal vias under the exposed die pad, and consider a heatsink with thermal interface material for production designs. Compute junction temperature as TJ = TA + (PD x theta-JA); keep TJ below 85 C for the commercial grade.
The 1.0 mm ball pitch FC-FBGA requires HDI PCB stackup with microvias and 4-6 mil via-in-pad design rules. Maintain controlled-impedance routing (50 ohm single-ended, 100 ohm differential) for transceiver channels; reference the Altera Stratix GX board design guidelines for via length, AC coupling capacitor placement, and reference plane continuity. Route high-speed serial channels on inner layers to minimize EMI; keep BGA break-out routing short and matched.
Common pitfalls with EP1SGX25FF1020C7N designs: (1) using the wrong Quartus II version (must be 7.x-13.0 for Stratix I GX; current Quartus Prime does NOT support this device), (2) forgetting the N suffix means lead-free assembly vs non-N (legacy SnPb), (3) assuming all 1020-ball variants share identical pinouts (Stratix I GX FF vs Stratix II GX DF have different pin assignments despite same package), (4) overlooking configuration mode selection (AS, PS, JTAG) pull-ups, (5) ignoring JTAG chain termination in multi-device boards.
Multi-gigabit transceiver channels on the EP1SGX25FF1020C7N are sensitive to impedance discontinuities, so place AC-coupling capacitors (typically 100 nF X7R 0402) within 200 mil of the transmit pins. Use IBIS-AMI models from Intel/Altera for channel simulation; target pre-emphasis and equalization settings to compensate for backplane losses at 3.125 Gbps. Maintain solid ground reference planes under high-speed traces and avoid via stubs by using back-drilling for backplane vias deeper than 80 mil.
Compliance Information
RoHS compliance confirmed by N suffix (lead-free ball). Halogen-free per Altera/Intel product documentation. AEC-Q100 not applicable (commercial-grade FPGA, not automotive-qualified). For new automotive designs, consider Cyclone IV GX or MAX 10 with AEC-Q100.
