EP1SGX40CF672I5 - Stratix GX FPGA, 41,250 LE, 672-BGA | Intel
MPN: EP1SGX40CF672I5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $460 | $4,600.00 |
| 100 | $425 | $42,500.00 |
| 500 | $395 | $197,500.00 |
| 1,000 | $370 | $370,000.00 |
Drop-in alternatives for EP1SGX40CF672I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40CF672C7
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$165 / Unit
View Datasheet →EP1SGX40CF672C6
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View Datasheet →EP1SGX40CF672C5
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$171 / Unit
View Datasheet →EP1SGX40CF672I5 Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Logic Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Number of Terminals | 672 |
| Package Code | BGA |
| Package Shape | Square |
| Surface Mount | Yes |
| Process Technology | 0.13 um CMOS |
| Nominal Supply Voltage | 1.5 V |
| Supply Voltage Range | 1.425 V to 1.575 V |
| Operating Temperature Range | -40 C to +100 C (Industrial) |
| Embedded Transceivers | 3.125 Gbps multi-gigabit transceivers |
| Embedded Memory | TriMatrix memory blocks |
| Speed Grade | I5 (industrial) |
EP1SGX40CF672I5 square Pin Configuration Guide
Complete pinout information for EP1SGX40CF672I5 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40CF672I5.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40CF672I5 is suitable for 6 applications: 10 Gigabit Ethernet Line Cards, SONET/SDH Framer Equipment, Serial RapidIO Switches, Broadcast Video Processing, PCI Express Endpoint Cards, Industrial Control Backplanes.
10 Gigabit Ethernet Line Cards
The EP1SGX40CF672I5's 3.125 Gbps embedded multi-gigabit transceivers are ideal for 10 Gigabit Ethernet XAUI (four lanes at 3.125 Gbps) and backplane KR/KR4 applications. Forty-one thousand logic elements plus dedicated DSP blocks handle MAC framing, CRC insertion, and traffic shaping while the on-chip PLLs synthesize the precise 156.25 MHz reference clock from a single oscillator. Compared to a discrete SERDES plus FPGA solution, the integrated transceivers cut PCB area by roughly 40 percent and reduce BOM cost. Place AC-coupling capacitors near the TX pins, maintain 100 ohm differential impedance, and use the Quartus II XAUI PHY IP for protocol compliance.
Recommended
SONET/SDH Framer Equipment
Telecom framer designs rely on the EP1SGX40CF672I5's deterministic latency and 3.125 Gbps transceivers to implement OC-48/STM-16 and OTU-1 serial links with section/line/path overhead processing. The TriMatrix embedded memory buffers payload data while 4,125 CLBs deliver pointer processing, scrambler/descrambler logic, and BIP-8 error counters in real time. The industrial temperature range supports central-office environments. Use the Quartus II PLL megafunction to generate gapped clock domains required for STS-1/VC-4 multiplexing, and implement protection switching in dedicated logic to minimize handoff latency.
Recommended
Serial RapidIO Switches
Serial RapidIO (SRIO) switches for wireless baseband and DSP clustering benefit from the EP1SGX40CF672I5's hot-swappable, low-latency multi-gigabit serial links. The 3.125 Gbps transceivers support SRIO physical layer 1x/4x modes while the rich logic fabric implements the logical layer transaction forwarding and congestion management. On-chip DSP blocks accelerate CRC-24 generation and ACK/NACK flow control. The PBGA package provides low-jitter power distribution for the transceiver PLLs, which is critical for maintaining the 100 ppm frequency accuracy required by the SRIO specification. Use the Altera SRIO IP core for envelope detection and idle sequence generation.
Recommended
Broadcast Video Processing
High-definition broadcast video routers and processing engines use the EP1SGX40CF672I5 to handle SDI, HD-SDI, and emerging 3G-SDI standards. The transceivers drive SMPTE 424M/425M at 2.97 Gbps while the 4,125 CLBs perform real-time deinterlacing, scaling, and chroma-keying. TriMatrix memory stores multiple video frames for buffering and time-base correction. The industrial temperature grade supports outdoor encoder housings and remote broadcast van deployments. Pair the FPGA with an external video ADC/DAC and configure the on-chip PLLs to generate the 148.5 MHz pixel clock required for 1080p60 formats.
Recommended
PCI Express Endpoint Cards
Edge-card and adapter designers leverage the EP1SGX40CF672I5's PCIe-compatible transceiver macros and configurable PCIe hard IP blocks for endpoint implementations up to x8 lanes at 2.5 Gbps. The 41,250 logic elements support TLP payload processing, MSI interrupt generation, and DMA engines. TriMatrix memory buffers packet headers and data payloads. Industrial temperature grade suits server-room environments. Use the Quartus II PCIe Compiler to configure the hard IP block, place reference clock buffers near the PCIe REFCLK pins, and route the PERn/PETn signals with 85 ohm differential impedance and length matching within 5 mils.
Recommended
Industrial Control Backplanes
Programmable Logic Controllers (PLCs) and distributed control systems adopt the EP1SGX40CF672I5 for high-speed deterministic backplane communication. The transceivers support proprietary and standard serial protocols at 1-3.125 Gbps, replacing legacy parallel backplanes that suffer from skew and EMI. Logic elements implement protocol stacks and real-time control loops, while TriMatrix memory buffers telemetry data for diagnostic logging. Industrial temperature grade ensures reliable operation in factory-floor environments from -40C to +100C. Implement ECC on configuration memory and use the CRC megafunction for packet integrity on noisy factory networks.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40CF672I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40CF672C7 | EP1SGX40CF672C6 | EP1SGX40CF672C5 |
|---|---|---|---|---|
| Package | 672-BGA (PBGA) | 672-BGA (PBGA) - same | 672-BGA (PBGA) - same | 672-BGA (PBGA) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Logic Elements | 41,250 | 41,250 (same silicon) | 41,250 (same silicon) | 41,250 (same silicon) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | I5 (industrial) | C7 (faster) | C6 (slower) | C5 (slowest) |
| Core Supply Voltage | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Embedded Transceivers | 3.125 Gbps multi-gigabit | 3.125 Gbps multi-gigabit | 3.125 Gbps multi-gigabit | 3.125 Gbps multi-gigabit |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Key Differentiators
- Industrial temperature grade -40C to +100C (vs EP1SGX40CF672C7 (commercial 0-85C))
- Full 41,250 LE plus all transceiver channels in 672-BGA (vs EP1SGX25CF672I6 (25,660 LE))
- Integrated 3.125 Gbps transceivers eliminate external SERDES (vs Discrete SERDES + smaller FPGA approach)
Design Notes
Transceiver channels require 100-ohm differential impedance routing with intra-pair length matching within 5 mils. Place AC-coupling capacitors (typically 100 nF X7R) near the transmitter pins; do NOT place them near the receiver pins for PCIe or SRIO. Maintain at least 4-5W spacing from digital switching signals to avoid coupling into the transceiver analog supply planes.
Use a four-layer stack-up with dedicated analog and digital power/ground planes for the transceiver rails. Decouple VCC_PLL and VCC_TRANS with bulk (10 uF tantalum), mid-frequency (1 uF X5R), and high-frequency (100 nF X7R) capacitors placed adjacent to each pin pair. Sequence the core and analog supplies to avoid in-rush currents greater than 3A during configuration.
Do not exceed the industrial operating temperature range by placing the device near heat sources without adequate airflow. Configuration memory must be loaded from a valid source (EPCS, EPC2, or microcontroller) within 100 ms of power-up; an invalid configuration file can cause the device to enter assertion of CONF_DONE low. Use the Quartus II programming file generator to produce .pof and .jic formats.
Compliance Information
RoHS, REACH, lead-free, and halogen-free compliance status is not explicitly stated in the verified web data; request the Intel material declaration for binding compliance statements. AEC-Q100 is not applicable for a high-density FPGA intended for industrial and infrastructure use.
