EP1SGX40GF1020C6ES - Stratix GX FPGA, 41,250 Cells, 1020-BGA | Intel
MPN: EP1SGX40GF1020C6ES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1695 | $16,950.00 |
| 100 | $1520 | $152,000.00 |
| 500 | $1380 | $690,000.00 |
| 1,000 | $1255 | $1,255,000.00 |
Drop-in alternatives for EP1SGX40GF1020C6ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX40GF1020C6ES Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Logic Family | CMOS (130 nm) |
| Logic Cells / Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Total RAM Bits | 3,423,744 |
| Number of I/O | 624 |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel |
| Core Supply Voltage | 1.5 V |
| Operating Temperature | 0 C to +85 C |
| Mounting Type | Surface Mount |
| Package / Case | 1020-BBGA (FC-FBGA, 33 x 33 mm, 1.0 mm pitch) |
| Supplier Device Package | 1020-BGA |
| RoHS Status | Compliant |
| Technology | 130 nm CMOS |
EP1SGX40GF1020C6ES Pin Configuration
| Pin 1 | I/O Bank reference — Refer to manufacturer datasheet for exact ball coordinates (1020-BGA, 1.0 mm pitch) |
| Pin B1 | GND — Ground reference (typical BGA ball assignment) |
| Pin VCCINT | VCCINT — Core supply 1.5 V |
| Pin VCCIO | VCCIO — I/O supply per bank (refer to datasheet) |
| Pin VCC_PLL | VCC_PLL — PLL analog supply |
| Pin VCC_TX/RX | VCC_TX — Transceiver supply rails |
| Pin TDI | TDI — JTAG Test Data In |
| Pin TDO | TDO — JTAG Test Data Out |
| Pin TCK | TCK — JTAG Test Clock |
| Pin TMS | TMS — JTAG Test Mode Select |
| Pin nCONFIG | nCONFIG — Configuration reset (active low) |
| Pin nSTATUS | nSTATUS — Configuration status (active low) |
| Pin CONF_DONE | CONF_DONE — Configuration done indicator |
| Pin MSEL[2:0] | MSEL — Configuration mode select |
| Pin DATA[7:0] | DATA — Configuration data bus |
| Pin DCLK | DCLK — Configuration clock input |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020C6ES is suitable for 7 applications: High-Speed Serial Communication Infrastructure, Baseband Signal Processing, Network Switches and Routers, Test and Measurement Equipment, High-End Video and Broadcast Equipment, Industrial Automation and Robotics Controllers, Aerospace and Defense Communication Systems.
High-Speed Serial Communication Infrastructure
The EP1SGX40GF1020C6ES is well-suited to high-throughput serial communication infrastructure where its 20 high-speed serial transceiver channels operating from 500 Mbps to 3.1875 Gbps per lane enable aggregation of up to 127.5 Gbps of full-duplex bandwidth. The 41,250 logic cells and 3.4 Mbit embedded memory provide ample fabric for protocol framing, CRC generation, and buffer management. Designers typically use this FPGA in line-card designs where multiple serial standards (Gigabit Ethernet, Serial RapidIO, custom backplanes) must be terminated simultaneously, and where the integrated CDR eliminates external clock-recovery components.
Recommended
Baseband Signal Processing
For baseband signal processing applications such as software-defined radio baseband chains or digital front-end processing, the EP1SGX40GF1020C6ES combines the Stratix GX DSP blocks with the 624-I/O complement to handle multi-antenna streams. Estimated: at 200 MHz fabric operation, each DSP block sustains roughly 8 GMACs, giving the device adequate throughput for 4-antenna LTE or WiMAX baseband pre-processing. The 1020-BGA package exposes dedicated high-speed differential pairs for ADC/DAC interface, eliminating the need for external mux devices.
Recommended
Network Switches and Routers
In network switches and routers, the EP1SGX40GF1020C6ES can be deployed as a multi-port aggregation or classification engine. Its 624 I/Os handle multiple SFP+ cages while the on-die transceivers eliminate external PHYs for sub-3G serial links. The 3.4 Mbit of TriMatrix memory is sufficient to buffer packet headers and queue descriptors in 10G aggregation scenarios, while the 41,250 logic cells accommodate custom lookup engines, ACL matching, or shallow TCAM emulation for QoS classification.
Recommended
Test and Measurement Equipment
Test and measurement platforms benefit from the EP1SGX40GF1020C6ES's combination of flexible I/O and serial transceivers. The device can act as a pattern generator or BERT engine, with the 20 transceivers generating up to 127.5 Gbps of test traffic for link-margin validation. The 624 general-purpose I/Os support parallel stimulus/response at LVDS or LVCMOS levels, while the abundant logic cells accommodate custom protocol decoding and error-injection logic for compliance testing.
Recommended
High-End Video and Broadcast Equipment
In high-end video and broadcast equipment, the EP1SGX40GF1020C6ES provides the bandwidth and processing to drive multi-stream SDI routers and 3G-SDI/HD-SDI aggregation cards. Its transceivers map natively to SMPTE 259M/292M/424M serial video rates, while the 41,250 logic cells implement format conversion, frame synchronisation, and embed/de-embed logic. The 1020-BGA also exposes enough parallel I/O to drive HDMI/DisplayPort bridges alongside the serial video pipeline.
Recommended
Industrial Automation and Robotics Controllers
Industrial automation and robotics controllers use the EP1SGX40GF1020C6ES as a flexible I/O aggregation and motion-control platform. With 624 I/Os the device can interface dozens of encoders, motor drivers, and safety I/O chains simultaneously, while the embedded transceivers support industrial Ethernet variants such as EtherCAT or PROFINET over fibre. Estimated: at the commercial 85 C junction limit and 1.5 V core, the 130 nm process dissipates around 8 to 12 W under typical load, so a heatsink or forced-air cooling is required in enclosed industrial enclosures.
Recommended
Aerospace and Defense Communication Systems
The EP1SGX40GF1020C6ES is also used in aerospace and defense communication systems where mature, long-lifecycle silicon is preferred over the latest FPGAs. The 130 nm CMOS process offers proven radiation-tolerance characteristics well documented in legacy Mil/Aero designs. The 20 transceivers support legacy serial avionics buses and high-speed datalinks, while the 1020-BGA package is compatible with established ruggedised PCB footprints. Note that for true rad-hard deployment, the dedicated hardened variant should be selected rather than the commercial C6ES grade.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020C6ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020C6 | EP1SGX40GF1020C6BN | EP1SGX40GF1020C6B | EP1SGX40GF1020C5ES | EP1SGX40GF1020C5N | EP1SGX40GF1020C5 |
|---|---|---|---|---|---|---|---|
| Package | 1020-BGA (33 x 33 mm, 1.0 mm pitch) | 1020-BGA - same | 1020-BGA - same | 1020-BGA - same | 1020-BGA - same | 1020-BGA - same | 1020-BGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Cells | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| User I/Os | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
| Speed Grade | C6 (ES suffix) | C6 | C6 | C6 | C5 (slower) | C5 (slower) | C5 (slower) |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| RoHS Compliance | Compliant | Compliant | Compliant (lead-free) | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
| Approximate Unit Price (USD, as of 2026-09-07) | USD 1,850 | USD 1,795 | USD 1,860 | USD 1,810 | USD 1,650 | USD 1,640 | USD 1,625 |
Key Differentiators
- 20 high-speed serial transceiver channels at up to 3.1875 Gbps (vs EP1SGX25FF1020C6ES)
- Higher logic density (41,250 cells vs 25,660 cells) (vs EP1SGX25FF1020C6ES)
- C6 speed grade balance between performance and yield (vs EP1SGX40GF1020C7ES)
- GF variant optimised for transceiver-heavy workloads (vs EP1SGX40DF1020C6ES)
Design Notes
Estimated: the 1020-BGA at 1.0 mm pitch on a 33 x 33 mm substrate requires a minimum of 6 PCB layers (4 routing + 2 ground/power) for clean escape routing. Use 0.8 mm or smaller via-in-pad with filled and plated over copper to expose BGA balls without solder wicking. Maintain a continuous ground plane under the device to control return-path inductance for the high-speed transceivers operating up to 3.1875 Gbps.
Estimated: at 1.5 V core and typical 130 nm Stratix GX utilisation, the device dissipates 8 to 12 W in commercial applications. A thermal pad or exposed heat-spreader must be bonded to the BGA lid and coupled to an aluminium heatsink or cold plate via thermal interface material. Verify junction temperature under worst-case ambient and clocking duty cycle to remain below 85 C commercial limit or 100 C industrial limit.
High-speed transceiver differential pairs must be length-matched to within 150 mil (about 3.8 mm) and routed over a continuous reference plane to maintain 100 ohm differential impedance. Avoid routing transceiver pairs across plane splits or stitching vias, which cause impedance discontinuities and degrade BER. Place AC-coupling capacitors within 100 mil of the receiver pins per Intel Stratix GX layout guidelines.
The EP1SGX40GF1020C6ES requires multiple power rails: VCCINT (core, 1.5 V), VCCIO (I/O banks, variable), VCC_PLL (PLL analog, 1.5 V), and dedicated VCC_TX/VCC_RX for the transceivers. Each rail should have its own decoupling network (1 uF + 0.1 uF + 10 nF bulk) placed within 100 mil of the relevant BGA balls. Follow the Stratix GX power-sequencing specification to avoid latch-up during power-up.
Avoid confusing the 'ES' suffix with 'Enhanced Specification' or 'Engineering Sample' - in the Stratix GX family it denotes a specific silicon revision and lead-free finish. Substituting with the non-ES variant may produce bitstream signatures that fail configuration. Always revalidate bitstream against the actual silicon revision in production. Also verify MSEL[2:0] configuration mode strapping against the intended configuration source (JTAG, EPCS, EPC16, etc.).
Compliance Information
RoHS and lead-free confirmed per distributor product pages (DigiKey, Mouser, Microchip USA). REACH compliance assumed for Intel programmable-logic portfolio. AEC-Q100 not applicable for commercial FPGAs. Conflict-minerals policy compliance declared by Intel.
