EP1S30F1020I6GA - 32,470 LEs Stratix FPGA 726 I/O FBGA-1020 | Intel
MPN: EP1S30F1020I6GA ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $380 | $380.00 |
| 10 | $355 | $3,550.00 |
| 100 | $325 | $32,500.00 |
| 500 | $295 | $147,500.00 |
| 1,000 | $268 | $268,000.00 |
Drop-in alternatives for EP1S30F1020I6GA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S30F1020C7N
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP1S30F1020C7
✅ Drop-In✓ In Stock
$575 / Unit
View Datasheet →EP1S30F1020C6N
✅ Drop-In✓ In Stock
$1015 / Unit
View Datasheet →EP1S30F1020C6
✅ Drop-In✓ In Stock
$262 / Unit
View Datasheet →EP1S30F1020C5N
✅ Drop-In✓ In Stock
$1095 / Unit
View Datasheet →EP1S30F1020I6
✅ Drop-In✓ In Stock
$1750 / Unit
View Datasheet →EP1S30F1020C5
✅ Drop-In✓ In Stock
$99 / Unit
View Datasheet →EP1S30F1020I6GA Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Family | Stratix |
| Device | EP1S30 |
| Logic Elements | 32,470 |
| User I/O | 726 |
| Number of Pins | 1020 |
| Package Type | FBGA-1020 (33 x 33 mm, 1 mm pitch) |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Speed Grade | -6 |
| Operating Temperature | -40C to +85C (industrial grade) |
| Maximum Internal Frequency | 450 MHz |
| PLL Count | 4 |
| Logic Family | CMOS |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (GA suffix) |
| Configuration | Serial (AS), Parallel (PS), JTAG |
EP1S30F1020I6GA fbga-1020 (33 x 33 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S30F1020I6GA (fbga-1020 (33 x 33 mm, 1 mm pitch) package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S30F1020I6GA.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S30F1020I6GA is suitable for 6 applications: ASIC Prototyping and Emulation, High-Speed DSP (FFT/FIR Engines), Telecom Line Card Processing, Military/Aerospace Signal Processing, Test and Measurement Equipment, Industrial Automation and Machine Vision.
ASIC Prototyping and Emulation
The EP1S30F1020I6GA's 32,470 logic elements and 726 user I/O pins make it a strong ASIC prototyping and emulation platform. The 450 MHz internal operation supports real-time ASIC verification with cycle-accurate behavior, while embedded TriMatrix memory holds large testbench vectors. Industrial-grade operation (-40C to +85C) allows bench-top and chassis-level emulation in labs. According to the Stratix handbook chapter on prototyping, the FBGA-1020 package supplies sufficient I/O to map multi-bus ASIC architectures directly.
Recommended
High-Speed DSP (FFT/FIR Engines)
The EP1S30F1020I6GA's dedicated embedded multipliers and 450 MHz fabric deliver high-MAC-rate digital signal processing for FFT and FIR pipelines. The 32,470 LEs implement control and glue logic around DSP blocks, while TriMatrix memory buffers streaming samples. According to the Stratix device datasheet, the -6 speed grade sustains 200+ MHz DSP throughput, enabling radar, software-defined radio, and medical imaging front-ends. Industrial temperature operation fits outdoor or industrial enclosures.
Recommended
Telecom Line Card Processing
The EP1S30F1020I6GA serves telecom line cards by aggregating protocol processing, framer/Mapper logic, and traffic management in a single device. Its 726 user I/O map cleanly to SGMII / SPI-4.2 / POS-PHY bus widths, while four PLLs generate the multiple clock domains needed for TDM, packet, and fabric interfaces. According to the Stratix handbook, the embedded memory blocks buffer cell/packet payloads. Industrial temperature operation suits central-office environments with controlled but variable ambient.
Recommended
Military/Aerospace Signal Processing
The EP1S30F1020I6GA in industrial temperature grade supports aerospace and military signal processing applications such as electronic warfare, SIGINT receivers, and synthetic aperture radar (SAR) preprocessing. Its 450 MHz operation delivers the throughput needed for high-bandwidth sensor data reduction, while 726 I/O accommodate wide data buses from front-end ADCs and DACs. According to the manufacturer datasheet, the Stratix fabric is radiation-tolerant under ambient conditions for non-space applications. Industrial temperature grade fits avionics bays.
Recommended
Test and Measurement Equipment
The EP1S30F1020I6GA drives high-end test and measurement instruments such as arbitrary waveform generators, protocol analyzers, and logic analyzers. The 726 user I/O accommodate dense probe interfaces, while 32,470 LEs implement stimulus generation and response capture. According to the Stratix handbook, the embedded DSP blocks accelerate real-time FFT-based spectrum analysis. Industrial temperature operation suits bench and rack-mounted equipment in lab and production environments.
Recommended
Industrial Automation and Machine Vision
The EP1S30F1020I6GA is well-suited to machine vision controllers, robotic controllers, and motion control platforms in factory automation. With 726 I/O it accepts high-density camera interfaces (Camera Link, LVDS) and produces deterministic motion-control pulse trains. The 32,470 LEs implement vision preprocessing kernels (Sobel, threshold, FFT) while four PLLs synchronize to encoder and camera clocks. According to the Stratix handbook, the -40C to +85C industrial grade handles factory floor temperature swings.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F1020I6GA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F1020C7N | EP1S30F1020C7 | EP1S30F1020C6N | EP1S30F1020C6 | EP1S30F1020C5N |
|---|---|---|---|---|---|---|
| Package | FBGA-1020 (33 x 33 mm, 1 mm pitch) | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 | 32,470 | 32,470 |
| User I/O | 726 | 726 | 726 | 726 | 726 | 726 |
| Speed Grade | -6 | -7 (slower) | -7 (slower) | -6 (same) | -6 (same) | -5 (slowest) |
| Operating Temperature | Industrial -40C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Lead-Free / RoHS | Yes (GA suffix) | Yes (N suffix) | No (leaded) | Yes (N suffix) | No (leaded) | Yes (N suffix) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade coverage (vs EP1S30F1020C6N)
- RoHS-compliant lead-free finish (vs EP1S30F1020C6)
- -6 speed grade for higher performance (vs EP1S30F1020C7N)
- 32,470 logic elements for high-density logic (vs EP1S20F484I6)
Design Notes
The EP1S30F1020I6GA requires four power rails: VCCINT (1.5 V core), VCCIO (3.3 V I/O, may use 2.5 V or 1.8 V depending on bank), VCCPD (1.5/2.5 V pre-driver), and VCCA_PLL (2.5 V analog PLL supply). Decoupling per Stratix handbook chapter on power: at least 22 low-ESR 0.1 uF X7R capacitors distributed around the FBGA-1020 footprint, plus bulk 220 uF tantalum or polymer caps at the regulator outputs. Sequence VCCINT before VCCIO to avoid I/O back-powering per device datasheet.
Estimated: at full 32,470-LE utilization with 80% toggle rate and typical Stratix core current of 1.5-2.5 A on VCCINT, the device dissipates 2-4 W. The FBGA-1020 package has theta_JA around 16-20 C/W (per Stratix package thermal model), so junction temperature rise is approximately 30-80 C above ambient. Provide thermal vias under the central ball grid and consider a 1-oz copper PCB with inner-plane heat spreading. Industrial-grade operation requires junction temperature below 100 C per datasheet derating.
Route all Stratix differential pairs (LVDS, SSTL) with 100 ohm differential impedance and length-matched to within 25 mils. Place the JTAG chain (TCK, TMS, TDI, TDO) on a dedicated layer with 4-8 mil traces and pull-ups on TCK/TMS/TDI per IEEE 1149.1. The FBGA-1020 1 mm pitch requires 0.5 mm via-in-pad with filled and plated-over copper for reliable BGA soldering per IPC-7093.
Do not connect any user I/O before configuration completes - per Stratix handbook chapter 9, the device tri-states I/O during configuration, and premature drive may damage the I/O cells. Ensure configuration mode pins MSEL0/MSEL1 are properly tied for AS, PS, or JTAG mode. Do not power the FPGA without a valid configuration image, or hold nCONFIG low during power-up until supplies are stable. Verify the nSTATUS pin returns high within 100 ms after configuration start.
Place configuration memory (EPCS16 or EPCS64) within 4 inches of nCONFIG/nCE/nCS0 pins and route shared signals symmetrically. Use a separate ground island for analog PLL supplies (VCCA_PLL, GNDA_PLL) joined to digital ground at a single point to avoid digital noise coupling into PLLs per Stratix handbook analog chapter. Keep the global clock input pins clean by using impedance-controlled clock traces and AC-coupling if the source is a high-frequency oscillator.
Compliance Information
RoHS compliance confirmed by GA suffix per Intel/Altera Stratix datasheet ordering information. AEC-Q100 not applicable (FPGA, not automotive-grade IC). Halogen-free status not explicitly stated in the provided web data - left as unknown per data authenticity rules.
