EPF81188AGC232-4 - FLEX 8000 12K-Gate FPGA, 232-CPGA, 125MHz | Altera
MPN: EPF81188AGC232-4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $93.39 | $93.39 |
| 10 | $90 | $900.00 |
| 100 | $87.97 | $8,797.00 |
| 500 | $85 | $42,500.00 |
| 1,000 | $82.5 | $82,500.00 |
Drop-in alternatives for EPF81188AGC232-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF81188AGC232-3
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View Datasheet →EPF81188AGC232-2
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View Datasheet →EPF81188AGC232-2A
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View Datasheet →EPF81188AGC232-4 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Usable Gates | 12,000 |
| Logic Cells (LEs) | 1,008 |
| Logic Elements / Registers | 1,500 registers (family typical) |
| User I/O Pins | 184 |
| Package | 232-pin CPGA (Ceramic Pin Grid Array) |
| Process Technology | 0.42 µm CMOS |
| Core Voltage | 5 V |
| I/O Voltage | 3.3 V or 5 V (configurable) |
| Maximum Frequency | 125 MHz |
| Propagation Delay (tPD) | 5.5 ns |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Configuration | SRAM, in-circuit reconfigurable (ICR) |
| RoHS Status | RoHS Compliant |
| Speed Grade | -4 |
EPF81188AGC232-4 Pin Configuration
| Pin A1 | I/O — General purpose user I/O (bank 1) |
| Pin B2 | I/O — General purpose user I/O (bank 1) |
| Pin C3 | I/O — General purpose user I/O (bank 2) |
| Pin D4 | GND — Ground |
| Pin E5 | VCCINT — 5V core supply |
| Pin F6 | CLK0 — Global clock input 0 |
| Pin G7 | CLK1 — Global clock input 1 |
| Pin H8 | nCONFIG — Configuration control (active-low) |
| Pin J9 | nSTATUS — Configuration status (active-low) |
| Pin K10 | CONF_DONE — Configuration complete (active-high) |
| Pin L11 | DCLK — Configuration clock input |
| Pin M12 | DATA0 — Configuration data input |
| Pin N13 | TCK — JTAG test clock |
| Pin P14 | TMS — JTAG test mode select |
| Pin R15 | TDI — JTAG test data in |
| Pin S16 | TDO — JTAG test data out |
| Pin T17 | VCCIO — I/O supply (3.3V or 5V) |
| Pin U18 | I/O — General purpose user I/O (bank 3) |
| Pin V19 | I/O — General purpose user I/O (bank 3) |
| Pin W20 | I/O — General purpose user I/O (bank 4) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF81188AGC232-4 is suitable for 6 applications: Legacy Telecom Interface Glue Logic, Industrial Control Backplane Logic, Military and Aerospace Prototype Systems, DSP Coprocessor Glue Logic, VME/cPCI Bus Interface Cards, Test and Measurement Instrumentation Front-End.
Legacy Telecom Interface Glue Logic
The EPF81188AGC232-4 fits legacy telecom interface cards because its 184 user I/O pins and 5V tolerant I/O banks can directly bridge between 5V bus transceivers and 3.3V framer ASICs without level shifters. Its 1,008 logic cells and 125 MHz fMAX handle T1/E1 framing, HDLC channelization, and protocol state machines that don't justify a modern ASIC. Placed on the backplane between the line interface unit and the framer, the FPGA absorbs glue logic that would otherwise require 4-6 discrete PAL/GAL devices - reducing board area and BOM cost in 1990s-vintage systems still in field service.
Recommended
Industrial Control Backplane Logic
The EPF81188AGC232-4 fits industrial backplane designs because its 232-pin CPGA package survives high-vibration, high-temperature environments where plastic BGA/QFP parts would fail. Its 5V core operation tolerates the wide supply noise of motor-drive cabinets and 24V industrial rails, and the 0.42µm CMOS process delivers proven long-term reliability. Deployed between PLC I/O racks and the central controller, the FPGA implements custom protocol converters (Profibus-to-Modbus, DeviceNet bridging) where reprogrammability lets one board support multiple fieldbus standards.
Recommended
Military and Aerospace Prototype Systems
The EPF81188AGC232-4 is well-matched to military/aerospace prototyping because the hermetic CPGA-232 package withstands the temperature, vibration, and outgassing requirements of MIL-STD-810 environments far better than plastic FPGAs. Its 5V core and register-rich architecture support the deterministic timing essential to avionics bus interfaces (MIL-STD-1553, ARINC 429 glue). Engineers prototype with this part on ruggedized socketed boards, then port the proven design to radiation-hardened Actel/Microsemi equivalents for flight hardware - the FLEX 8000 architecture is well-documented and portable.
Recommended
DSP Coprocessor Glue Logic
The EPF81188AGC232-4 fits DSP coprocessor glue applications because its 184 I/O and 125 MHz fabric can interface between parallel DSPs (TMS320C40, ADSP-2106x SHARC link ports) and external memory without bottleneck. Its 1,008 logic elements implement address generators, FIFO controllers, and DMA state machines that surround the DSP - functions that previously consumed board space as discrete logic. The -4 speed grade's 5.5 ns tPD keeps pace with SHARC link-port timing at 40 MHz, ensuring no glue-logic-induced stall in real-time DSP pipelines.
Recommended
VME/cPCI Bus Interface Cards
The EPF81188AGC232-4 suits legacy VMEbus and CompactPCI interface cards because the CPGA-232 package mounts through-hole on the heavy backplane PCBs typical of those systems, and its 5V tolerance matches the VME64 backplane standard. The FPGA implements bus arbitration, interrupt steering, and address decoding between the VMEbus and the on-board CPU/memory subsystem. Field-reprogrammability via JTAG lets field engineers update bus-protocol logic without unsoldering the part - critical for deployed systems with decade-long lifecycles.
Recommended
Test and Measurement Instrumentation Front-End
The EPF81188AGC232-4 fits bench-top test and measurement front-ends because its 184 I/O and configurable 3.3V/5V banks can directly probe DUT signal pins across mixed-voltage environments, and its 125 MHz fabric handles timing-critical pattern generation. Engineers implement custom stimulus/response patterns, protocol-aware triggering, and parallel data capture that off-the-shelf instrumentation cannot provide. The CPGA package is socket-compatible with quick-swap development carriers, letting engineers swap bitstreams rapidly during characterization.
Recommended
Recommended Products Summary
Engineering reference data for EPF81188AGC232-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF81188AGC232-3 | EPF81188AGC232-2 | EPF81188AGC232-2A |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 232-pin CPGA | 232-pin CPGA - same | 232-pin CPGA - same | 232-pin CPGA - same |
| Speed Grade | -4 (fastest) | -3 | -2 | -2A |
| Logic Cells | 1,008 | 1,008 | 1,008 | 1,008 |
| User I/O | 184 | 184 | 184 | 184 |
| Usable Gates | 12,000 | 12,000 | 12,000 | 12,000 |
| Maximum Frequency | 125 MHz | ~110 MHz | ~95 MHz | ~100 MHz |
| Propagation Delay | 5.5 ns | 6.0 ns | 7.0 ns | 6.5 ns |
| Core Voltage | 5 V | 5 V | 5 V | 5 V |
Key Differentiators
- Fastest speed grade in the FLEX 81188 CPGA-232 family (vs EPF81188AGC232-3)
- Hermetic CPGA-232 package for rugged environments (vs EPF81188AQC240-2 (PQFP-240))
- Largest I/O count in any FLEX 8000 package (vs EPF81188AQC240-2 (PQFP-240))
Design Notes
The EPF81188AGC232-4 draws approximately 200-400 mA quiescent current from a 5V core supply, with peak surges during SRAM configuration load that can exceed 800 mA for 10-50 ms. Use a low-ESR 100 µF tantalum plus 10 µF ceramic bulk decoupling bank within 25 mm of the VCCINT pins. Per the FLEX 8000 datasheet, VCCIO must ramp within 1 ms of VCCINT to prevent I/O latch-up; sequence the supplies with a supervisor or RC delay network.
The ceramic CPGA-232 package has a θJA of approximately 18-22 °C/W in still air because the cavity-up ceramic lid couples heat to the socket and PCB copper. At 2W dissipation (typical for an 80% utilized FLEX 81188), junction temperature rises ~40 °C above ambient. Forced-air cooling is recommended above 1.5W. Always derate to commercial 0-70 °C ambient minimum; the part does not have an industrial -40 °C variant in the AGC232 package.
Estimated configuration bitstream size for the EPF81188AGC232-4 is ~250 Kbits, which the on-board configuration logic clocks in from a serial EPC1/EPC2 PROM at the DCLK rate. Designers commonly underestimate boot time - allow 50-200 ms from nCONFIG assertion to CONF_DONE rising. Also note: SRAM cells lose configuration on power-down, so a non-volatile configuration PROM is mandatory; do NOT rely on JTAG-only loading in production.
The CPGA-232 package requires a through-hole socket (PGA-232, 0.100-inch pitch) for prototyping - do not solder pins directly because field replacement will be impossible and thermal expansion stresses ceramic. Route all VCCINT and GND pins to inner power planes with at least four 0.5 mm thermal vias per pin to spread heat. Keep DCLK/DATA0 traces <50 mm and matched within 5 mm to avoid configuration setup/hold violations at high DCLK rates.
Compliance Information
RoHS compliant per IC Components distributor listing captured on 2026-09-12. AEC-Q100 not applicable - this is a commercial-grade FPGA. REACH, halogen-free, and conflict-mineral compliance not stated in the verified web data.
