EPF81188AGC232-4N - 12K-Gate FLEX 8000 FPGA, 5V, CPGA-232 | Altera
MPN: EPF81188AGC232-4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $93.39 | $93.39 |
| 10 | $90.5 | $905.00 |
| 100 | $87.97 | $8,797.00 |
| 500 | $85.2 | $42,600.00 |
| 1,000 | $82 | $82,000.00 |
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View Datasheet →EPF81188AGC232-4N Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Logic Elements / Cells | 1,008 cells |
| Usable Gates | 12,000 |
| Maximum Registers | 1,500 |
| Maximum Operating Frequency | 125 MHz |
| Propagation Delay | 5.5 ns (speed grade -4) |
| Process Technology | 0.42 µm CMOS |
| Supply Voltage (VCCINT) | 5 V |
| Package | 232-pin CPGA (Ceramic Pin Grid Array) |
| Configuration Method | Serial (EPC1/EPC2) or JTAG (IEEE 1149.1) |
| In-Circuit Reconfigurable | Yes (ICR) |
| Operating Temperature Grade | Industrial / Military (per -N suffix) |
| Mounting Type | Through-hole (CPGA socket or solder) |
| RoHS Status | Compliant (lead-free per distributor listing) |
| Programming Interface | JTAG / Altera ByteBlaster compatible |
EPF81188AGC232-4N 232-pin cpga (ceramic pin grid array) Pin Configuration Guide
Complete pinout information for EPF81188AGC232-4N (232-pin cpga (ceramic pin grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF81188AGC232-4N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF81188AGC232-4N is suitable for 6 applications: Legacy Telecom Interface Glue Logic, Industrial Control and Factory Automation, Military and Avionics Data Acquisition, In-System Reconfigurable Instrumentation, Legacy Replacement for TTL/CMOS Glue Logic, Educational FPGA and Retro-Computing Platforms.
Legacy Telecom Interface Glue Logic
The EPF81188AGC232-4N is well-suited for legacy telecom interface designs requiring 5V TTL-compatible glue logic between E1/T1 framers, channel banks, and backplane transceivers. Its 12K usable gates and 1,500 registers provide sufficient capacity for HDLC controllers, timeslot crossbar switches, and alarm-state machines common in mid-1990s to early-2000s central-office equipment. The 5V I/O eliminates level shifters when interfacing with legacy bipolar and CMOS telecom ICs, while 125 MHz Fmax comfortably supports 8.192 Mbps E1 and 2.048 MHz backplane timing. The CPGA-232 ceramic package supports extended temperature operation required for outdoor cabinet equipment. Designers should pair the FPGA with an EPC1/EPC2 configuration PROM and route JTAG to a 10-pin header for field firmware updates.
Recommended
Industrial Control and Factory Automation
In factory automation and PLC systems, the EPF81188AGC232-4N integrates discrete logic functions such as motor-step pulse generators, encoder quadrature decoders, and safety-interlock sequencers into a single reprogrammable device. The 1,008 logic cells handle typical ladder-logic-to-FPGA conversions with substantial headroom, while the 5V I/O directly drives 24V-tolerant industrial signal-conditioning front-ends through simple resistor dividers. In-circuit reconfigurability allows end-of-line customization of machine variants without re-spinning PCBs, reducing inventory SKUs. The ceramic CPGA package provides the mechanical robustness required for high-vibration industrial environments. Pair the FPGA with opto-isolated I/O and a watchdog timer, and use Quartus II 13.0sp1 for design entry.
Recommended
Military and Avionics Data Acquisition
The EPF81188AGC232-4N's ceramic CPGA-232 package and industrial/military temperature grade make it a strong fit for avionics data-acquisition front-ends, flight-data recorders, and military communication subsystems. Its 12K-gate density comfortably implements ARINC 429 bus controllers, MIL-STD-1553 command/response handlers, and multi-channel analog-to-digital data formatters in a single device. The 5V supply tolerates the wide input-voltage variations common in 28V aircraft power systems after pre-regulation. In-circuit JTAG reconfigurability supports field software updates for deployed assets where physical access is limited. Designers should apply derating per MIL-HDBK-217 for reliability prediction, and pair the FPGA with radiation-tolerant companion devices for space applications.
Recommended
In-System Reconfigurable Instrumentation
Test and measurement instrumentation benefits from the EPF81188AGC232-4N's in-circuit reconfigurability (ICR) via JTAG, enabling field upgrades of signal-processing firmware without opening the instrument chassis. The 1,008 logic cells implement digital filters, FFT pre-processors, and trigger sequencers for oscilloscopes and logic analyzers in the 100 MHz-class bandwidth range. 5V I/O directly interfaces with legacy probe amplifiers and front-panel connectors, simplifying analog front-end design. The 125 MHz Fmax provides timing margin for 100 MHz sample-rate designs. Engineers should include a JTAG header on every board and validate configuration bitstream checksums against flash-resident golden images for fail-safe recovery.
Recommended
Legacy Replacement for TTL/CMOS Glue Logic
The EPF81188AGC232-4N replaces dozens of 74-series TTL and 4000-series CMOS packages in legacy designs that are being modernized for inventory reduction or obsolescence avoidance. A single FLEX 8000 device can integrate 50-100 discrete logic packages, dramatically reducing PCB area and assembly cost. The 5V I/O is bit-for-bit compatible with TTL and CMOS logic levels, requiring no interface changes. Designers migrating discrete logic should adopt synchronous design practices with Quartus II and verify that metastability characteristics meet system requirements. Note that FLEX 8000 is SRAM-based and must be configured at every power-up; design the boot sequence around an EPC1 or EPC2 configuration PROM.
Recommended
Educational FPGA and Retro-Computing Platforms
The EPF81188AGC232-4N is well-documented in textbooks, vintage computing communities, and university FPGA courses teaching SRAM-based programmable logic fundamentals. Its 12K-gate capacity is large enough to implement a complete 8-bit retro CPU (such as a Z80 or 6502 soft-core) while remaining small enough to fully route on the FLEX 8000 fabric. The 5V supply matches vintage TTL peripherals commonly paired with retro-computing projects, eliminating level-shifting complexity. The CPGA-232 package can be socketed on through-hole adapter boards, simplifying prototyping. Note that design entry requires legacy Quartus II 13.0sp1 or MAX+PLUS II, both freely available from Intel FPGA's legacy software archive.
Recommended
Recommended Products Summary
Engineering reference data for EPF81188AGC232-4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF81188AGC232-4 | EPF81188AGC232-3 | EPF81188AGC232-2A | EPF81188AGC232-2 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 232-pin CPGA | 232-pin CPGA - same | 232-pin CPGA - same | 232-pin CPGA - same | 232-pin CPGA - same |
| Speed Grade | -4N (~5.5 ns) | -4 (~5.5 ns) | -3 (~3.5 ns, faster) | -2A (~3.0 ns, faster) | -2 (~2.5 ns, fastest) |
| Usable Gates | 12,000 | 12,000 | 12,000 | 12,000 | 12,000 |
| Logic Cells | 1,008 | 1,008 | 1,008 | 1,008 | 1,008 |
| Maximum Registers | 1,500 | 1,500 | 1,500 | 1,500 | 1,500 |
| Maximum Frequency | 125 MHz | 125 MHz | [DATA_NEEDED: higher Fmax than 125 MHz] | [DATA_NEEDED] | [DATA_NEEDED] |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| Temperature Grade | Industrial / Military (per -N) | Commercial | Commercial | Commercial | Commercial |
Key Differentiators
- Same 232-pin CPGA package and pinout across all FLEX 8000 speed grades (vs EPF81188AGC232-3)
- Industrial/military temperature grade via -N suffix (vs EPF81188AGC232-4)
- Faster speed-grade upgrade paths available within the same package (vs EPF81188AGC232-3)
Design Notes
The EPF81188AGC232-4N requires a clean 5V VCCINT supply within 4.75V to 5.25V. Place 0.1 µF ceramic decoupling capacitors within 5 mm of every VCC pin and a single 10 µF bulk tantalum or ceramic capacitor near the package to suppress switching noise. The 232-pin CPGA has multiple VCC and GND pins distributed across the array; verify all are decoupled per the FLEX 8000 datasheet pinout table, since missing connections can cause intermittent logic errors. Estimated: with 1,008 cells at typical 5V/10 MHz operation, the device draws approximately 200-500 mA; design the regulator with at least 1A headroom for inrush during configuration.
FLEX 8000 devices are SRAM-based and lose configuration on every power-down. A configuration PROM (EPC1, EPC2, or microprocessor-driven serial interface) must be present at every system boot. A common pitfall is omitting the nCONFIG pull-up or nSTATUS pull-down resistor, causing the device to fail configuration intermittently. Per Altera AN 33 (Configuring FLEX 8000 Devices), the nCONFIG line must see a clean logic-low-to-high transition after VCC stabilizes; design the reset supervisor with sufficient delay (typically >100 ms) to ensure proper boot. JTAG chain order matters when multiple devices share the TCK/TMS lines - verify with IDCODE scanning before in-system programming.
The ceramic CPGA-232 package offers lower thermal resistance than equivalent plastic packages, but the EPF81188AGC232-4N can still dissipate 1-2 W at full utilization. In enclosed industrial enclosures without forced airflow, verify junction temperature using the package's theta_JA from the FLEX 8000 datasheet. For the -N industrial/military variant operating at -40C to +100C ambient, ensure the worst-case junction temperature stays below 125C. Consider thermal vias under the package footprint and provide 1-2 square inches of internal copper plane for heat spreading. Forced-air cooling is recommended when utilization exceeds 70% or switching activity exceeds 30%.
The 232-pin CPGA package requires either a through-hole socket (PGA sockets are available from Mill-Max, Augat, or 3M) or direct soldering to a multi-layer PCB with plated through-holes on 2.54 mm pitch grid. For new designs, prefer socketing to allow field replacement of the obsolete FPGA. For PCB layout, allocate at least 4 layers to provide dedicated ground and power planes; the FLEX 8000's FastTrack interconnect is sensitive to ground-bounce on heavily-loaded outputs. Place configuration PROMs within 50 mm of the FPGA to minimize serial configuration timing margins. JTAG signals should be routed with 4.7 kΩ pull-ups on TCK, TMS, and TDI to prevent floating inputs during reset.
Compliance Information
Lead-free / RoHS compliant per IC Components distributor listing (2026-09-12). Halogen-free status and conflict-minerals compliance not explicitly stated in available distributor data; marked as 'unknown' rather than assumed. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade qualified IC; designers targeting automotive should verify Altera/Intel's automotive-grade portfolio separately.
