EPM3512AFI256-10N - 512-Macro MAX 3000A CPLD, 256-FBGA | Intel/Altera
MPN: EPM3512AFI256-10N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.5 | $12,250.00 |
| 1,000 | $21.75 | $21,750.00 |
Drop-in alternatives for EPM3512AFI256-10N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EPM3512AFC256-7N
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View Datasheet →EPM3512AFI256-10N Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Series | EPM3512 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Architecture | CMOS EEPROM-based, MAX architecture |
| Number of Macrocells | 512 |
| Number of Logic Array Blocks (LABs) | 16 |
| Usable Gates | Up to 10,000 |
| Number of User I/O | 208 |
| Total Pins | 256 |
| Pin-to-Pin Propagation Delay (tPD) | 10 ns |
| Maximum Counter Frequency | 227.3 MHz |
| Core Supply Voltage (VCCINT) | 3.3 V (3.0 V to 3.6 V) |
| I/O Supply Voltage (VCCIO) | 2.5 V or 3.3 V (5.0 V tolerant inputs) |
| MultiVolt I/O Support | 5.0 V / 3.3 V / 2.5 V |
| In-System Programmability | Yes - IEEE Std 1532 compliant |
| JTAG Boundary Scan | Yes - IEEE 1149.1 |
| Program Memory | EEPROM (non-volatile) |
| Package | 256-ball FineLine BGA (FBGA-256) |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40 °C to +85 °C (industrial) |
| RoHS Status | Compliant |
| Speed Grade | -10 (10 ns tPD) |
EPM3512AFI256-10N Pin Configuration
| Pin A1 | I/O — User I/O pin (bank 1) |
| Pin A2 | I/O — User I/O pin (bank 1) |
| Pin A3 | I/O — User I/O pin (bank 1) |
| Pin A4 | I/O — User I/O pin (bank 1) |
| Pin A5 | I/O — User I/O pin (bank 1) |
| Pin A6 | I/O — User I/O pin (bank 1) |
| Pin A7 | VCCIO — I/O supply voltage (bank 1) |
| Pin A8 | GND — Ground |
| Pin A9 | I/O — User I/O pin (bank 2) |
| Pin A10 | I/O — User I/O pin (bank 2) |
| Pin A11 | I/O — User I/O pin (bank 2) |
| Pin A12 | I/O — User I/O pin (bank 2) |
| Pin A13 | I/O — User I/O pin (bank 2) |
| Pin A14 | I/O — User I/O pin (bank 2) |
| Pin A15 | I/O — User I/O pin (bank 2) |
| Pin A16 | I/O — User I/O pin (bank 2) |
| Pin B1 | I/O — User I/O pin (bank 1) |
| Pin B2 | I/O — User I/O pin (bank 1) |
| Pin B3 | I/O — User I/O pin (bank 1) |
| Pin B4 | I/O — User I/O pin (bank 1) |
| Pin B5 | I/O — User I/O pin (bank 1) |
| Pin B6 | GND — Ground |
| Pin B7 | VCCINT — Core supply voltage (3.3 V) |
| Pin B8 | GND — Ground |
| Pin B9 | VCCIO — I/O supply voltage (bank 2) |
| Pin B10 | I/O — User I/O pin (bank 2) |
| Pin B11 | I/O — User I/O pin (bank 2) |
| Pin B12 | I/O — User I/O pin (bank 2) |
| Pin B13 | I/O — User I/O pin (bank 2) |
| Pin B14 | I/O — User I/O pin (bank 2) |
| Pin B15 | I/O — User I/O pin (bank 2) |
| Pin B16 | I/O — User I/O pin (bank 2) |
| Pin C1-C16 | I/O — User I/O pins (banks 1/2/3/4) |
| Pin D1-D16 | I/O — User I/O pins (banks 1/2/3/4) |
| Pin E1-E16 | I/O — User I/O pins (banks 1/2/3/4) |
| Pin F1-F16 | I/O / GND / VCC — User I/O, ground, and supply pins interspersed |
| Pin G1-G16 | GND / VCCINT / VCCIO — Power and ground balls |
| Pin H1-H16 | I/O / GND / VCC — User I/O, ground, and supply pins interspersed |
| Pin J1-J16 | I/O / JTAG — User I/O pins plus dedicated JTAG balls (TCK, TMS, TDO, TDI) |
| Pin K1-K16 | I/O / GND / VCC — User I/O, ground, and supply pins interspersed |
| Pin L1-L16 | I/O / VCC — User I/O pins plus supply balls |
| Pin M1-M16 | I/O / GND — User I/O pins plus ground balls |
| Pin N1-N16 | I/O — User I/O pins (banks 3/4) |
| Pin P1 | I/O — User I/O pin (bank 4) |
| Pin P2 | I/O — User I/O pin (bank 4) |
| Pin P3 | I/O — User I/O pin (bank 4) |
| Pin P4 | I/O — User I/O pin (bank 4) |
| Pin P5 | I/O — User I/O pin (bank 4) |
| Pin P6 | GND — Ground |
| Pin P7 | VCCIO — I/O supply voltage (bank 4) |
| Pin P8 | GND — Ground |
| Pin P9 | VCCIO — I/O supply voltage (bank 3) |
| Pin P10 | I/O — User I/O pin (bank 3) |
| Pin P11 | I/O — User I/O pin (bank 3) |
| Pin P12 | I/O — User I/O pin (bank 3) |
| Pin P13 | I/O — User I/O pin (bank 3) |
| Pin P14 | I/O — User I/O pin (bank 3) |
| Pin P15 | I/O — User I/O pin (bank 3) |
| Pin P16 | I/O — User I/O pin (bank 3) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3512AFI256-10N is suitable for 6 applications: Industrial I/O Expansion and Glue Logic, Address Decoding and Bus Bridging, Power-Up and Reset Sequencing, Protocol Translation and Interface Bridging, Telecom Line-Card Glue Logic, Automotive Body and Chassis Electronics.
Industrial I/O Expansion and Glue Logic
The EPM3512AFI256-10N's 512 macrocells and 208 user I/O make it ideal for replacing dozens of 74-series glue-logic ICs in industrial controllers, PLCs, and motor-drive boards. Its 10 ns pin-to-pin delay keeps deterministic timing for encoder decoding, interlock logic, and interrupt steering. The MultiVolt I/O lets a single device bridge 5 V sensor inputs to 3.3 V MCU GPIOs without external level shifters, while EEPROM-based non-volatile storage means designs power up instantly - critical for safety circuits that must be live within microseconds. Designers typically target 30-50 % utilization (around 150-250 macrocells) to leave timing headroom for post-route fitter adjustments.
Recommended
Address Decoding and Bus Bridging
The 256-FBGA EPM3512AFI256-10N excels at address decoding for legacy parallel buses (ISA, PC/104, VME) and bridging between asynchronous memory/peripheral interfaces. Its 16 LABs and 512 macrocells deliver plenty of AND/OR terms for complex chip-select decode trees covering 24-32 address lines, and the 227.3 MHz counter frequency supports pipelined burst-mode decoders. Engineers typically instantiate one LAB per major address window with pipelined registered outputs to keep output-enable skew under 2 ns. JTAG boundary-scan support enables structural interconnect tests on assembled boards.
Recommended
Power-Up and Reset Sequencing
Multi-rail systems (FPGA + DDR + analog + RF) require deterministic sequencing to avoid latch-up and in-rush damage, and the EPM3512AFI256-10N is well suited as a centralized sequencer. Its non-volatile EEPROM storage boots in microseconds - far faster than any SRAM-based FPGA - and the 16 LABs each provide a dedicated macrocell flip-flop for individual rail-control state machines. The 208 user I/O can drive enable inputs on more than twenty separate regulators while monitoring PGOOD feedback. Designers commonly program 1-10 ms delays between rails using on-chip counter macros clocked by an internal or external oscillator.
Recommended
Protocol Translation and Interface Bridging
The EPM3512AFI256-10N is frequently used to translate between legacy parallel buses and modern high-speed serial interfaces (I2C, SPI, UART) on the same board. Its 5.0 V tolerant inputs let it accept signals from older logic while its 3.3 V outputs drive newer MCUs, eliminating external level-shifters. The 10 ns tPD and 227.3 MHz counter frequency support bit-banged serial protocols up to ~50 MHz, and the abundant macrocells allow dual-port register banks for data buffering between domains. Typical designs consume 200-350 macrocells to implement a full SPI-to-parallel bridge plus command interpreter.
Recommended
Telecom Line-Card Glue Logic
Telecom line cards use the EPM3512AFI256-10N for TDM bus switching, clock muxing, and per-channel framing logic where instant-on EEPROM configuration is mandatory. The 256-FBGA footprint is footprint-compatible with the 512-macro density needed for 32-64 channel framing engines, and 10 ns propagation delay meets typical 50 MHz TDM clock domains with margin. Industrial -40 to +85 °C temperature grade ensures operation in NEBS-compliant enclosures. ISP via IEEE 1532 enables in-the-field firmware upgrades without removing the line card from service.
Recommended
Automotive Body and Chassis Electronics
Although not AEC-Q100 qualified, the EPM3512AFI256-10N is used in non-safety automotive body modules (window lifters, seat controllers, HVAC panels) where industrial temperature grade and high I/O count suffice. Its deterministic 10 ns timing enables precise multi-axis stepper control, LIN bus decoding, and body-controller multiplexing. The MultiVolt I/O interfaces directly with 12 V battery-backed rails through external resistors, and JTAG ISP allows end-of-line firmware calibration. Designers should derate junction temperature by at least 20 °C for underhood-adjacent enclosures.
Recommended
Recommended Products Summary
Engineering reference data for EPM3512AFI256-10N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3512AFC256-10N | EPM3512AFC256-10 | EPM3512AFI256-10 | EPM3512AFC256C | EPM3512AFC256-7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 512 |
| User I/O | 208 | 208 | 208 | 208 | 208 | 208 |
| Speed Grade (tPD) | 10 ns (-10) | 10 ns (-10) | 10 ns (-10) | 10 ns (-10) | Faster C-bin (~7.5-10 ns) | 7.5 ns (-7) |
| Operating Temperature | -40 °C to +85 °C (industrial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | -40 °C to +85 °C (industrial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) |
| Terminal Finish | Pb-free (N suffix) | Pb-free | Pb-free | SnPb (leaded) | Pb-free | Pb-free |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Key Differentiators
- Industrial -40 to +85 °C temperature grade (vs EPM3512AFC256-10N)
- 10 ns tPD deterministic timing (vs EPM3512AFC256-7N)
- Pb-free RoHS-compliant terminal finish (vs EPM3512AFI256-10)
Design Notes
Estimated: FineLine BGA-256 with 1.0 mm ball pitch requires 4-layer PCB minimum with 0.5 oz copper outer layers for reliable soldering. Use 0.4 mm via-in-pad microvias or dog-bone fan-outs with 0.2 mm trace/space rules. Place four 0.1 µF and two 10 µF decoupling capacitors within 5 mm of VCCINT/VCCIO balls - one cap pair per power ball cluster. Matched-length traces on high-speed JTAG (TCK) and global clocks minimize skew below 200 ps.
Estimated: At maximum 227.3 MHz internal toggle across all 512 macrocells, ICCINT peaks around 250 mA and ICCIO around 100 mA per bank (worst-case switching activity). Derate the 3.3 V regulator by 30 % for safe margin and provide bulk 100 µF tantalum plus 10 µF ceramic storage. The MultiVolt I/O banks (VCCIO) can be powered independently from 2.5 V or 3.3 V supplies, allowing one CPLD to drive mixed-voltage peripherals without level shifters - confirm VCCIO ramp matches VCCINT to within 1 ms to avoid I/O latch-up during power-up.
Estimated: New MAX 3000A designs must be targeted with Quartus II (legacy MAX+PLUS II support ends at v10.x). Floating I/O pins draw ~50 µA each and add to quiescent ICC - always tie unused pins to defined logic via the Quartus "Weak Pull-Up" or "Weak Pull-Down" setting. Do not drive JTAG TCK faster than 10 MHz for ISP - the IEEE 1532 state machine can lose sync above this rate. When migrating designs from -10 to -7 speed grade, re-run timing analysis because setup/hold margins change non-linearly.
Compliance Information
RoHS-compliant per the "N" suffix (Pb-free matte-tin) designation in the Altera ordering information. Not AEC-Q100 qualified - use AEC-Q100-grade CPLDs (e.g., MAX II automotive variants) for safety-critical automotive applications. Halogen-free status not explicitly stated in available data.
