EPM2210F256C3N - MAX II CPLD 1700 Macrocells 7ns 256-FBGA | Intel
MPN: EPM2210F256C3N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.88 | $89.88 |
| 10 | $79.5 | $795.00 |
| 100 | $68.2 | $6,820.00 |
| 500 | $56.4 | $28,200.00 |
| 1,000 | $47.1 | $47,100.00 |
Drop-in alternatives for EPM2210F256C3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM2210F256C4N
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View Datasheet →EPM2210F256C5N
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View Datasheet →EPM2210F256I5N
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EPM1270F256C5N
✅ Drop-In✓ In Stock
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View Datasheet →EPM570F256C5N
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EPM2210F256C3N Maximum Ratings & Electrical Characteristics
| Series | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Programmable Type | In System Programmable (JTAG, IEEE 1149.1) |
| Macrocells | 1700 |
| Logic Elements / Blocks | 2210 |
| Number of User I/Os | 204 |
| Maximum Propagation Delay (tPD) | 7 ns |
| Maximum Internal Frequency (fMAX) | 304 MHz |
| Internal Supply Voltage | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) |
| I/O Standard Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) |
| User Flash Memory | 8 Kbits |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| Operating Junction Temperature | 0 C to 85 C (commercial, TJ suffix 'C') |
| Package | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Process Technology | 0.18 um flash CMOS |
| RoHS Status | Compliant (per DigiKey product page) |
| MSL Level | 3 (per JEDEC J-STD-020, typical for FBGA) |
EPM2210F256C3N 256-ball fineline bga (fbga), 17 x 17 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EPM2210F256C3N (256-ball fineline bga (fbga), 17 x 17 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM2210F256C3N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM2210F256C3N is suitable for 6 applications: Microcontroller I/O Expansion and Bus Bridging, Address Decoding and Chip-Select Generation, Power-Sequencing and Reset Distribution, LED Display Multiplexing and Industrial Front Panels, Portable and Battery-Powered Systems, Legacy Interface Bridging (PCI, ISA, VME, I2C, SPI).
Microcontroller I/O Expansion and Bus Bridging
The EPM2210F256C3N's 1700 macrocells and 204 user I/Os make it ideal for expanding the GPIO count of microcontrollers and bridging between incompatible bus standards (e.g., 8-bit MCU to 16-bit/32-bit peripherals). Its 7 ns tPD and 304 MHz fMAX accommodate synchronous bus cycles above 100 MHz without setup/hold violations, while the MultiVolt I/O supports 1.5V/1.8V/2.5V/3.3V on the same die. Placed adjacent to the MCU bus with 33 ohm series damping on clock lines, it consolidates address decoding, chip-select generation, and wait-state insertion that would otherwise require several discrete 74-series parts. Instant-on flash configuration eliminates the boot latency of an SRAM FPGA, making it well suited to industrial controllers that must respond to interrupts within microseconds of power-up.
Recommended
Address Decoding and Chip-Select Generation
The EPM2210F256C3N excels at generating glitch-free chip-select signals in memory-mapped embedded systems thanks to its deterministic 7 ns pin-to-pin delay and product-term-based logic. Each macrocell implements sum-of-products decoding across 36 inputs, allowing wide address ranges (24-32 bits) and complex qualifier logic (read/write strobes, chip-ID pins, bank enables) without timing race conditions. The wide fan-in capability replaces multiple cascaded 74LS138/139 decoders, reducing board area and improving noise immunity. The on-chip 8 Kbit user flash can store board-revision IDs or boot configuration bytes that the CPLD reads at power-up to multiplex peripheral selects.
Recommended
Power-Sequencing and Reset Distribution
The non-volatile instant-on behavior of the EPM2210F256C3N makes it well suited to power-rail sequencing and reset-distribution networks in multi-rail processor systems. At <100 us after power-up, the device is ready to drive sequenced enable signals to DC-DC converters and monitor PG (power-good) feedback, replacing discrete supervisor ICs with a single programmable device. The 1700 macrocells support sequencing of 8-16 rails with adjustable delays programmed via the JTAG chain. The 3.3V single-supply operation (with on-chip regulator) simplifies PCB layout versus multi-supply CPLDs.
Recommended
LED Display Multiplexing and Industrial Front Panels
The EPM2210F256C3N drives multiplexed 7-segment or dot-matrix LED displays with its 204 user I/Os and high-current MultiVolt I/O cells (typically 4-8 mA per pin). Charlieplexing or row/column multiplexing for 16x32 LED matrix requires only ~50 macrocells, leaving ample headroom for key-scan, debouncing, and rotary-encoder logic on the same chip. The instant-on characteristic ensures the front panel is alive within microseconds of power-up, critical for industrial HMIs and emergency-stop indicators. The 7 ns tPD allows >100 Hz refresh rates for flicker-free display at 8 brightness levels via PWM.
Recommended
Portable and Battery-Powered Systems
The MAX II flash-based architecture of the EPM2210F256C3N draws zero standby current because the configuration is stored in non-volatile flash rather than powered SRAM. In portable medical, IoT sensor, or handheld instrument designs, this translates to nanoampere-level sleep currents when the CPLD is held in reset. Active current at 1 MHz toggle is approximately 2-4 mA, far below a comparable SRAM FPGA. The single 3.3V supply (with on-chip regulator generating 2.5V internal rails) simplifies battery-boost topologies. Industrial-temperature variants (EPM2210F256I5N) extend operation to outdoor and automotive environments.
Recommended
Legacy Interface Bridging (PCI, ISA, VME, I2C, SPI)
The EPM2210F256C3N is frequently used to bridge legacy parallel buses (PCI, ISA, VME) to modern microcontrollers or processors, providing voltage-level translation (5V tolerant inputs), bus-cycle timing adaptation, and interrupt aggregation. Its MultiVolt I/O accepts 5V signals on a 3.3V VCCIO bank, while the 7 ns tPD handles 33 MHz PCI bus cycles. For serial-bus bridging, the CPLD implements custom I2C/SPI controller cores in macrocell logic, useful when the host MCU lacks the required peripherals or needs additional slave ports. The deterministic timing simplifies certification for industrial protocols.
Recommended
Recommended Products Summary
Engineering reference data for EPM2210F256C3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM2210F256C4N | EPM2210F256C5N | EPM2210F256I5N | EPM1270F256C5N | EPM570F256C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) |
| Series | MAX II | MAX II | MAX II | MAX II | MAX II | MAX II |
| Macrocells | 1700 | 1700 | 1700 | 1700 | 980 | 440 |
| Maximum tPD | 7 ns | approx. 8.5 ns | approx. 10 ns | approx. 10 ns | approx. 10 ns | approx. 10 ns |
| Operating Temperature (TJ) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | -40 C to 100 C (industrial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| User I/Os | 204 | 204 | 204 | 204 | 212 | 160 |
| Internal Supply | 2.5 V / 3.3 V (3.3 V single supply via on-chip regulator) | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| RoHS / Lead-Free (N suffix) | Yes (N suffix, lead-free) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Approx. Unit Price (qty 1, USD, 2026-09-12) | 89.88 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Fastest speed grade in the 2210-macrocell MAX II family (vs EPM2210F256C5N)
- Highest macrocell density in the MAX II family (vs EPM1270F256C5N)
- Non-volatile flash configuration with instant-on behavior (vs SRAM-based FPGA of equivalent density)
Design Notes
Route all JTAG signals (TMS, TCK, TDO, TDI) to a clean 4-pin header with 10 kohm pull-ups on TMS and TDI. Place 100 nF + 10 uF decoupling pairs within 5 mm of every VCCIO and VCCINT BGA ball. Use a 4-layer PCB with continuous ground plane beneath the FBGA; avoid routing signals through the BGA keepout area. For 50 MHz+ outputs, add 33 ohm series damping resistors within 8 mm of the BGA ball to dampen transmission-line reflections. The FineLine BGA has 1.0 mm pitch; ensure your PCB house supports 0.4 mm laser-drilled microvias for fanout routing.
The MAX II device includes an internal voltage regulator that converts a single 3.3 V VCC supply into the 2.5 V internal core voltage. Power consumption is dominated by I/O toggling frequency; estimating approximately 0.5-1 mA per MHz of toggle activity across all outputs. At 50 MHz with 64 toggling outputs, expect 30-50 mA active current. Decoupling: place one 100 nF X7R 0402 ceramic per VCCIO ball group (4 balls) and one 10 uF X5R 0805 per VCCINT ball group. The flash configuration draws no standby current, so quiescent current in reset is dominated by leakage (<100 uA typical).
Three frequent MAX II design mistakes: (1) Forgetting that the 'N' suffix denotes lead-free ball finish - the EPM2210F256C3 (without N) is a legacy leaded part, not RoHS compliant for new designs. (2) Using the wrong speed grade - the C3 is 7 ns, C4 is ~8.5 ns, C5 is ~10 ns; verify your timing budget against the slower grade if you migrate. (3) Driving 5V signals into 3.3V VCCIO banks - the MAX II I/O is 5V-tolerant only when VCCIO = 3.3V; with VCCIO = 2.5V or 1.8V, 5V inputs will damage the device. Always check the VCCIO of each I/O bank against input signal swings.
Use the Altera/Intel MAX II pin-out table (in the device handbook) to plan your I/O bank assignments. Each VCCIO pin powers a group of I/O banks; mixing 3.3V and 1.8V interfaces on the same VCCIO is not allowed. Place clock inputs on dedicated CLK pins to minimize skew; if you must use a regular I/O as a clock, place it on a pin adjacent to a dedicated clock pin to minimize routing delay mismatch. For JTAG chain programming, include a 4.7 kohm pull-up on TCK to keep the bus idle during board reset and avoid inadvertent JTAG state transitions.
Compliance Information
RoHS compliance confirmed per DigiKey and Heisener product pages. The 'N' suffix denotes lead-free / Pb-free NiPdAu ball finish. Not AEC-Q100 qualified (commercial-grade only); use EPM2210F256I5N for industrial-temperature but still not automotive-qualified. Halogen-free and conflict-minerals status not stated in distributor data.
