EPM3256ATC144-10AA - MAX 3000A CPLD, 256 Macrocells, 10ns TQFP-144 | Altera
MPN: EPM3256ATC144-10AA β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $19.8 | $198.00 |
| 100 | $16.4 | $1,640.00 |
| 500 | $13.95 | $6,975.00 |
| 1,000 | $11.6 | $11,600.00 |
Drop-in alternatives for EPM3256ATC144-10AA β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EPM3256ATC144-10N
β Drop-Inβ In Stock
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View Datasheet βEPM3256ATC144-10
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View Datasheet βEPM3256ATC144-7
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
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View Datasheet βEPM3256ATC144-10AA Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Device Type | CPLD - Complex Programmable Logic Device |
| Macrocells | 256 |
| Usable Gates | 5,000 |
| Propagation Delay (tPD) | 10 ns |
| User I/O Pins | 116 |
| Maximum Operating Frequency | 95.2 MHz |
| Core Voltage (VCCINT) | 3.3 V |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V |
| Technology | CMOS, EEPROM-based configuration |
| Package | 144-pin TQFP |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +70C (Commercial) |
| In-System Programming | IEEE Std. 1532 compliant |
EPM3256ATC144-10AA Pin Configuration
| Pin 1 | I/O β User I/O pin |
| Pin 2 | I/O β User I/O pin |
| Pin 3 | I/O β User I/O pin |
| Pin 4 | I/O β User I/O pin |
| Pin 5 | I/O β User I/O pin |
| Pin 6 | I/O β User I/O pin |
| Pin 7 | I/O β User I/O pin |
| Pin 8 | I/O β User I/O pin |
| Pin 9 | I/O β User I/O pin |
| Pin 10 | I/O β User I/O pin |
| Pin 11 | GND β Ground |
| Pin 12 | I/O β User I/O pin |
| Pin 13 | I/O β User I/O pin |
| Pin 14 | I/O β User I/O pin |
| Pin 15 | I/O β User I/O pin |
| Pin 16 | I/O β User I/O pin |
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| Pin 18 | I/O β User I/O pin |
| Pin 19 | I/O β User I/O pin |
| Pin 20 | I/O β User I/O pin |
| Pin 21 | I/O β User I/O pin |
| Pin 22 | GND β Ground |
| Pin 23 | I/O β User I/O pin |
| Pin 24 | I/O β User I/O pin |
| Pin 25 | I/O β User I/O pin |
| Pin 26 | I/O β User I/O pin |
| Pin 27 | I/O β User I/O pin |
| Pin 28 | I/O β User I/O pin |
| Pin 29 | I/O β User I/O pin |
| Pin 30 | I/O β User I/O pin |
| Pin 31 | I/O β User I/O pin |
| Pin 32 | I/O β User I/O pin |
| Pin 33 | GND β Ground |
| Pin 34 | I/O β User I/O pin |
| Pin 35 | I/O β User I/O pin |
| Pin 36 | I/O β User I/O pin |
| Pin 37 | I/O β User I/O pin |
| Pin 38 | I/O β User I/O pin |
| Pin 39 | I/O β User I/O pin |
| Pin 40 | I/O β User I/O pin |
| Pin 41 | I/O β User I/O pin |
| Pin 42 | I/O β User I/O pin |
| Pin 43 | I/O β User I/O pin |
| Pin 44 | GND β Ground |
| Pin 45 | I/O β User I/O pin |
| Pin 46 | I/O β User I/O pin |
| Pin 47 | I/O β User I/O pin |
| Pin 48 | I/O β User I/O pin |
| Pin 49 | I/O β User I/O pin |
| Pin 50 | I/O β User I/O pin |
| Pin 51 | I/O β User I/O pin |
| Pin 52 | I/O β User I/O pin |
| Pin 53 | I/O β User I/O pin |
| Pin 54 | I/O β User I/O pin |
| Pin 55 | GND β Ground |
| Pin 56 | I/O β User I/O pin |
| Pin 57 | I/O β User I/O pin |
| Pin 58 | I/O β User I/O pin |
| Pin 59 | I/O β User I/O pin |
| Pin 60 | I/O β User I/O pin |
| Pin 61 | I/O β User I/O pin |
| Pin 62 | I/O β User I/O pin |
| Pin 63 | I/O β User I/O pin |
| Pin 64 | I/O β User I/O pin |
| Pin 65 | I/O β User I/O pin |
| Pin 66 | GND β Ground |
| Pin 67 | I/O β User I/O pin |
| Pin 68 | I/O β User I/O pin |
| Pin 69 | I/O β User I/O pin |
| Pin 70 | I/O β User I/O pin |
| Pin 71 | I/O β User I/O pin |
| Pin 72 | I/O β User I/O pin |
| Pin 73 | I/O β User I/O pin |
| Pin 74 | I/O β User I/O pin |
| Pin 75 | I/O β User I/O pin |
| Pin 76 | I/O β User I/O pin |
| Pin 77 | GND β Ground |
| Pin 78 | I/O β User I/O pin |
| Pin 79 | I/O β User I/O pin |
| Pin 80 | I/O β User I/O pin |
| Pin 81 | I/O β User I/O pin |
| Pin 82 | I/O β User I/O pin |
| Pin 83 | I/O β User I/O pin |
| Pin 84 | I/O β User I/O pin |
| Pin 85 | I/O β User I/O pin |
| Pin 86 | I/O β User I/O pin |
| Pin 87 | I/O β User I/O pin |
| Pin 88 | GND β Ground |
| Pin 89 | I/O β User I/O pin |
| Pin 90 | I/O β User I/O pin |
| Pin 91 | I/O β User I/O pin |
| Pin 92 | I/O β User I/O pin |
| Pin 93 | I/O β User I/O pin |
| Pin 94 | I/O β User I/O pin |
| Pin 95 | I/O β User I/O pin |
| Pin 96 | I/O β User I/O pin |
| Pin 97 | I/O β User I/O pin |
| Pin 98 | I/O β User I/O pin |
| Pin 99 | GND β Ground |
| Pin 100 | I/O β User I/O pin |
| Pin 101 | I/O β User I/O pin |
| Pin 102 | I/O β User I/O pin |
| Pin 103 | I/O β User I/O pin |
| Pin 104 | I/O β User I/O pin |
| Pin 105 | I/O β User I/O pin |
| Pin 106 | I/O β User I/O pin |
| Pin 107 | I/O β User I/O pin |
| Pin 108 | I/O β User I/O pin |
| Pin 109 | I/O β User I/O pin |
| Pin 110 | GND β Ground |
| Pin 111 | TDI β JTAG Test Data In |
| Pin 112 | TMS β JTAG Test Mode Select |
| Pin 113 | TCK β JTAG Test Clock |
| Pin 114 | NC β Not connected (per datasheet) |
| Pin 115 | VCCINT β Core supply 3.3 V |
| Pin 116 | NC β Not connected (per datasheet) |
| Pin 117 | NC β Not connected (per datasheet) |
| Pin 118 | VCCIO β I/O supply 2.5/3.3/5.0 V |
| Pin 119 | NC β Not connected (per datasheet) |
| Pin 120 | NC β Not connected (per datasheet) |
| Pin 121 | NC β Not connected (per datasheet) |
| Pin 122 | VCCINT β Core supply 3.3 V |
| Pin 123 | NC β Not connected (per datasheet) |
| Pin 124 | NC β Not connected (per datasheet) |
| Pin 125 | VCCIO β I/O supply 2.5/3.3/5.0 V |
| Pin 126 | NC β Not connected (per datasheet) |
| Pin 127 | NC β Not connected (per datasheet) |
| Pin 128 | NC β Not connected (per datasheet) |
| Pin 129 | VCCINT β Core supply 3.3 V |
| Pin 130 | GND β Ground |
| Pin 131 | NC β Not connected (per datasheet) |
| Pin 132 | NC β Not connected (per datasheet) |
| Pin 133 | VCCIO β I/O supply 2.5/3.3/5.0 V |
| Pin 134 | NC β Not connected (per datasheet) |
| Pin 135 | TDO β JTAG Test Data Out |
| Pin 136 | NC β Not connected (per datasheet) |
| Pin 137 | NC β Not connected (per datasheet) |
| Pin 138 | VCCINT β Core supply 3.3 V |
| Pin 139 | NC β Not connected (per datasheet) |
| Pin 140 | NC β Not connected (per datasheet) |
| Pin 141 | VCCIO β I/O supply 2.5/3.3/5.0 V |
| Pin 142 | NC β Not connected (per datasheet) |
| Pin 143 | NC β Not connected (per datasheet) |
| Pin 144 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3256ATC144-10AA is suitable for 6 applications: Bus Address Decoding, Power-Sequencing Controller, Industrial Control Glue Logic, Legacy Peripheral I/O Expansion, State-Machine Controller, Communications Interface Bridging.
Bus Address Decoding
The EPM3256ATC144-10AA's 256 macrocells and 10 ns propagation delay make it well-suited for address decoding between a microcontroller/microprocessor and external peripherals such as SRAM, Flash, and registers. With 116 user I/Os the device can handle wide address plus chip-select fan-out, while the deterministic 10 ns tPD supports glue-logic timing on legacy 8/16/32-bit buses. The EEPROM-based configuration ensures instant-on decoding at power-up without boot delay, critical in industrial control boards where predictable bus response is required.
Recommended
Power-Sequencing Controller
The EPM3256ATC144-10AA can implement multi-rail power-up/power-down sequencing logic for systems with 3.3 V, 2.5 V, and 5 V rails, leveraging its multi-voltage VCCIO banks to interface directly with each supply domain. With 256 macrocells the device can drive dozens of enable and PG (power-good) signals, while the 10 ns timing easily meets typical 1 ms sequencing intervals. Deterministic EEPROM configuration ensures the sequence starts immediately at power-on, which is critical for ASICs and FPGAs that require specific rail order.
Recommended
Industrial Control Glue Logic
Factory automation and process-control boards often need custom logic to bridge sensor inputs, relay drivers, and PLC backplanes. The EPM3256ATC144-10AA's 5K-gate capacity and 116 I/Os cover moderate-complexity state machines, counter/timer chains, and PWM generation. The commercial 0C to +70C operating range fits indoor control cabinets, and the 144-TQFP package is straightforward to hand-prototype or assembly-line build. Engineers can implement the entire glue-logic layer in a single device, reducing BOM and PCB area versus discrete 74-series logic.
Recommended
Legacy Peripheral I/O Expansion
When an ASIC or microprocessor lacks sufficient GPIO or specialized peripheral functions, the EPM3256ATC144-10AA can be used as an I/O expansion device. Its multi-voltage VCCIO banks (2.5/3.3/5.0 V) allow direct interfacing with mixed-voltage legacy peripherals without external level shifters. With 116 user I/Os the part can expand a host MCU's limited pin count into a full peripheral interface including UART, SPI, I2C bit-banging, and parallel data buses. The 10 ns tPD ensures glue-logic propagation delay stays well within one peripheral clock cycle.
Recommended
State-Machine Controller
Finite state machines for protocol handling, traffic-light sequencing, motor commutation, or user-interface navigation fit naturally in the EPM3256ATC144-10AA's macrocell architecture. Each macrocell provides a configurable D/T/JK/SR flip-flop with product-term allocation, so multi-state controllers with 20-50 states can be implemented with significant margin. The 95.2 MHz internal frequency supports fast state transitions, and the 10 ns pin-to-pin delay enables the FSM to interface directly with external clocked logic without timing violations.
Recommended
Communications Interface Bridging
The EPM3256ATC144-10AA can bridge between incompatible communications interfaces - for example, converting a parallel bus to UART, or implementing custom protocols between sensors and a host processor. With 116 I/Os the device can handle wide parallel interfaces plus serial side-channels simultaneously. The 3.3 V core combined with multi-voltage VCCIO allows direct connection to 5 V legacy UART/RS-232 line drivers and 2.5 V modern MCUs in the same design, eliminating level-shifters in bridging applications.
Recommended
Recommended Products Summary
Engineering reference data for EPM3256ATC144-10AA β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3256ATC144-10N | EPM3256ATC144-10 | EPM3256ATC144-7 |
|---|---|---|---|---|
| Package | 144-pin TQFP | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Brand | Altera | Altera | Altera | Altera |
| Macrocells | 256 | 256 | 256 | 256 |
| Usable Gates | 5,000 | 5,000 | 5,000 | 5,000 |
| Propagation Delay (tPD) | 10 ns | 10 ns | 10 ns | 7 ns (faster) |
| User I/O Pins | 116 | 116 | 116 | 116 |
| Core Voltage (VCCINT) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| I/O Voltage (VCCIO) | 2.5 / 3.3 / 5.0 V | 2.5 / 3.3 / 5.0 V | 2.5 / 3.3 / 5.0 V | 2.5 / 3.3 / 5.0 V |
| Operating Temperature | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
Key Differentiators
- Functionally identical -10N suffix variant widely available (vs EPM3256ATC144-10N)
- Faster -7 speed grade available in same package (vs EPM3256ATC144-7)
- Multi-voltage I/O support eliminates level shifters (vs EPM3256ATC144-10N)
Design Notes
The EPM3256ATC144-10AA requires two distinct supplies: VCCINT at 3.3 V for the core logic and EEPROM configuration cells, and VCCIO at 2.5 V, 3.3 V, or 5.0 V for the I/O banks. Both rails must ramp together within the datasheet-specified power-on-reset window to ensure proper configuration. Decouple each VCCINT and VCCIO pin with a 0.1 uF ceramic capacitor placed within 5 mm of the package pin, and add a bulk 10-100 uF tantalum or polymer capacitor near the package to suppress switching transients. Designers should refer to the MAX 3000A datasheet power-supply sequencing section for the exact tR (rise time) and tF (fall time) limits.
A common mistake when designing with the EPM3256ATC144-10AA is leaving JTAG pins (TCK, TMS, TDI, TDO) floating. All JTAG inputs must be pulled to a defined logic level - typically TCK pulled low through 10 kohm, TMS and TDI pulled high through 10 kohm - to prevent spurious entry into boundary-scan mode that can disrupt normal operation. Additionally, ensure the OE (output enable) and GLOBAL CLK signals are correctly assigned during compilation; otherwise unused I/O pins may default to a high-impedance state that appears as floating inputs at the board level.
For reliable ISP (in-system programming), keep JTAG signal traces short (under 50 mm) and route them away from fast-switching signal lines to minimize crosstalk during programming. The 144-pin TQFP package has 0.5 mm pitch leads - use a PCB footprint with 0.25 mm via-in-pad or dog-bone fan-out to maintain manufacturability. Provide a solid ground plane on layer 2 beneath the device to improve thermal dissipation and reduce EMI; the device typically dissipates less than 500 mW but heat-sinking via the ground plane is good practice.
Compliance Information
Compliance data not present in the Verified Web Data; RoHS/REACH status should be confirmed with the distributor before purchase given the obsolete lifecycle.
