Samsung Electro-Mechanics

K6F2016U4E-EF70T - 2Mbit Async SRAM 70ns 48-TFBGA | Samsung

MPN: K6F2016U4E-EF70T βœ“ Active
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2.7 V to 3.3 V Vdss [DATA_NEEDED: ICC1] Id 48-TFBGA (6 x 7) Package SRAM - Asynchronous Memory
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Drop-in alternatives for K6F2016U4E-EF70T β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

K6F2016U4E-EF55T

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 48-TFBGA (6 x 7)
faster 55 ns tAA vs 70 ns (-21% access time), otherwise same die, organization, supply range and 48-ball footprint

πŸ“‹ Reference alternative (not in catalog)

K6F2016U4D-FF70T00

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Samsung Electronics
πŸ“¦ 48-TFBGA (6 x 7)
Asynchronous SRAM Β· 2 Mbit Β· 128K x 16 Β· 70 ns Β· 2.7 V to 3.3 V Β· Parallel Β· Full CMOS Β· 50 ns

βœ“ In Stock

$2.05 / Unit

View Datasheet β†’

K6F2016U4E-EF55

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 48-TFBGA (6 x 7)
55 ns speed grade, tray packing variant; faster tAA by 21%, otherwise identical

πŸ“‹ Reference alternative (not in catalog)

K6F2016U4D-FF55T00

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 48-TFBGA (6 x 7)
U4D family 55 ns grade; faster than 70 ns target, same package and organization, verify power specs

πŸ“‹ Reference alternative (not in catalog)

K6F2016U4E-EF70T Maximum Ratings & Electrical Characteristics

Memory Type SRAM - Asynchronous
Memory Size 2 Mbit
Organization 128K x 16
Interface Parallel
Access Time (tAA) 70 ns
Supply Voltage (VCC) 2.7 V to 3.3 V
Technology Full CMOS
Package 48-TFBGA (6 x 7)
Mounting Type Surface Mount
Control Signals CE, OE, WE
Refresh Requirement None (static RAM)

K6F2016U4E-EF70T 48-tfbga (6 x 7) Pin Configuration Guide

Complete pinout information for K6F2016U4E-EF70T (48-tfbga (6 x 7) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

48-tfbga (6 x 7) package pinout diagram for K6F2016U4E-EF70T

No detailed pinout data available for K6F2016U4E-EF70T.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for K6F2016U4E-EF70T Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

K6F2016U4E-EF70T is suitable for 6 applications: Battery-Powered Data Loggers, Industrial Automation Controllers, FPGA Design Buffers and Line Buffers, Networking and Telecom Equipment, Computer Peripherals and Office Equipment, Test and Measurement Instrumentation.

🧩

Battery-Powered Data Loggers

The K6F2016U4E-EF70T fits battery-powered data loggers because Samsung characterizes the K6F2016U4E family as a super-low-power, low-voltage full-CMOS static RAM: the full-CMOS cell draws near-zero current when the device is deselected, and no refresh is ever needed, unlike DRAM. In a logger, the 128K x 16 organization provides 256 Kbyte of fast scratch or history storage, and the 2.7V-3.3V supply matches a lithium cell or a 3.3V rail directly, eliminating a regulator stage. The 70 ns access time is far faster than any serial flash, so an MCU can sweep the log buffer quickly and return to sleep. Placed close to the MCU on a short parallel bus with 0.1 uF local decoupling, the SRAM adds negligible energy cost per logged sample, extending battery life in field instruments.

🏭

Industrial Automation Controllers

Industrial PLC I/O modules and motion controllers use asynchronous SRAM for deterministic, wait-state-free variable storage, and the K6F2016U4E-EF70T suits this role with its 70 ns address access time and industrial temperature range support noted in the Samsung datasheet. The 2 Mbit capacity holds ladder-logic working data, retentive registers, and fault-history buffers, while the 16-bit bus matches the word width of common 16/32-bit controllers without bus packing. Because access is fully asynchronous with simple CE/OE/WE controls, the memory requires no clock domain or FIFO logic, simplifying certification-driven designs. On a control board, keep the address bus under 10 cm where practical and use series termination on data lines to control ringing at backplane speeds; the 48-ball 6 x 7 TFBGA also survives vibration better than leaded packages.

πŸ”§

FPGA Design Buffers and Line Buffers

The K6F2016U4E-EF70T works well as external buffer memory for FPGAs in image line buffering, network packet staging, and test-instrument capture. A simple HDL memory controller drives the 17-bit address, 16-bit data, and CE/OE/WE signals directly; with a 70 ns tAA, sustained random-access rates around 10-14 MHz are achievable, and sequential bursts can run faster by pipelining address setup. The 2.7V-3.3V IO compatibility lets the SRAM share the FPGA 3.3V bank without level shifters, and the 48-ball TFBGA (6 x 7) footprint consumes under 1 square centimeter of board area. In imaging pipelines, 256 Kbyte stores multiple video lines at VGA width with headroom, and the full-CMOS standby behavior keeps idle power low between capture windows. Match trace lengths on the data bus to minimize skew.

🌐

Networking and Telecom Equipment

Line cards, switches, and telecom adapters historically use 3.3V asynchronous SRAM for lookup tables, descriptor rings, and queue metadata, and the K6F2016U4E-EF70T provides 2 Mbit of such storage with deterministic 70 ns latency - no refresh pauses and no variable timing. The 128K x 16 organization maps naturally to 16-bit hash entries or status words, and the parallel interface keeps lookup latency constant, which is valuable for packet-path determinism. The 48-ball 6 x 7 TFBGA offers a high board-density footprint for dense line-card layouts, and industrial temperature support covers telecom plant environments. Supply the part from a clean 3.3V rail with 0.1 uF plus 10 uF decoupling at the BGA vias; memory content is normally re-initialized at line-card boot, so battery retention is not required in this application.

πŸ–₯️

Computer Peripherals and Office Equipment

Printers, scanners, and point-of-sale peripherals use asynchronous SRAM as a fast working buffer between the main SoC and slower storage, and the K6F2016U4E-EF70T serves this need with its 2 Mbit, 128K x 16 array and 70 ns access. The 2.7V-3.3V supply aligns with the 3.3V peripheral board rails, and the CE/OE/WE control set connects directly to legacy parallel buses still common in printer engines. Distributor listings (Xecor, Chipdigger) explicitly cite computer peripherals and industrial automation as target uses for this part. Because peripheral boards are cost-sensitive, the widely stocked 70 ns grade avoids the premium of faster speeds, and the 6 x 7 mm BGA keeps the memory footprint small on two-layer or four-layer boards. Provide a defined power-on CE pull-up so the bus does not float during reset.

πŸ“Š

Test and Measurement Instrumentation

Bench instruments such as logic analyzers, data acquisition front ends, and function generators use fast SRAM for waveform storage and capture buffers, where the K6F2016U4E-EF70T's fixed 70 ns read latency simplifies real-time control logic compared with SDRAM refresh scheduling. The 16-bit data path stores ADC samples at 12-16 bit resolution without packing overhead, and 2 Mbit yields about 128K samples per channel segment. Industrial temperature support suits rack and bench environments alike, and the low standby current lets battery-powered handheld instruments preserve capture data between measurements. Design the capture controller so the SRAM address bus is driven from a counter for streaming writes and random reads, honoring datasheet CE pulse widths; add ground vias under the BGA to provide a clean return path for the 16-bit switching bus.

What is the Samsung K6F2016U4E-EF70T?
The Samsung K6F2016U4E-EF70T is a 2 Mbit asynchronous static RAM (SRAM) organized as 128K x 16 bits, operating from a 2.7V to 3.3V supply with a 70 ns access time. It is fabricated in Samsung's low-power full-CMOS process and comes in a 48-ball TFBGA package with a 6 x 7 mm footprint. Per the K6F2016U4E datasheet, the family also supports the industrial temperature range for flexible system design.
What are the key specifications of K6F2016U4E-EF70T that engineers should know?
Key specifications: 2 Mbit density in a 128K x 16 organization; 70 ns address access time (tAA); 2.7V to 3.3V VCC supply; full-CMOS asynchronous SRAM technology; parallel interface with CE, OE, and WE control signals; and a 48-ball TFBGA (6 x 7) surface-mount package. No refresh is required because data is retained statically. These numbers come from Samsung's K6F2016U4E family datasheet and distributor listings such as DigiKey.
What is the difference between K6F2016U4E-EF70T and K6F2016U4E-EF55T?
The only functional difference is speed grade: the EF70T has a 70 ns address access time, while the EF55T is the faster 55 ns grade. Both are 128K x 16, 2.7V-3.3V full-CMOS asynchronous SRAMs in the same 48-ball TFBGA (6 x 7) package and are pin-compatible drop-ins for each other. Choose the 55 ns grade only if your bus timing requires it; the 70 ns grade typically costs less and is easier to source.
What is the difference between K6F2016U4E and K6F2016U4D?
K6F2016U4D and K6F2016U4E are sibling Samsung low-power full-CMOS 128K x 16 asynchronous SRAM families in the 48-ball BGA footprint. The U4E family is the super-low-power version, while the U4D variant carries different power/processing codes. Per Samsung datasheet documentation for the K6F2016U4E, the U4E supports the industrial temperature range. Verify exact ICC and package details against the applicable Samsung datasheet before substituting one for the other in a low-power design.
What is the best drop-in replacement for K6F2016U4E-EF70T?
The most direct drop-in replacements are speed-grade siblings in the same Samsung family: K6F2016U4E-EF55T (55 ns, faster, pin-compatible) and the U4D-family part K6F2016U4D-FF70T00 (same 70 ns class, 128K x 16, 48-ball BGA). Because these share the same package footprint, organization, and pinout, no PCB rework is needed. Always confirm the ordering-code nuances on the Samsung datasheet, as suffix letters encode speed, package, and packing details.
Is there an Infineon (Cypress) equivalent for K6F2016U4E-EF70T?
A functional equivalent in 2 Mbit (128K x 16), 3.3V asynchronous SRAM exists in Infineon's former-Cypress portfolio (e.g., the CY62167EV30 family), but the provided cross-reference data does not confirm pin-to-pin compatibility with the Samsung 48-ball 6 x 7 TFBGA footprint. Treat any cross-brand equivalent as functionally similar only until the two ball maps are compared against both datasheets; do not assume drop-in replacement without verification.
When should I choose the 70 ns grade instead of 55 ns?
Choose the K6F2016U4E-EF70T (70 ns) when your bus cycle time comfortably exceeds 70 ns - typical for mid-speed MCUs, FPGA external memory at modest clock rates, and battery-backed data logging. Choose the 55 ns EF55T grade only when address-to-data turnaround must be under 70 ns, such as faster 32-bit buses or waitstate-minimized designs. The 70 ns grade offers the same 128K x 16 organization, 2.7V-3.3V operation, and 48-ball TFBGA package, usually at lower cost.
Is K6F2016U4E-EF70T suitable for battery-powered applications?
Yes. The K6F2016U4E family is described by Samsung as a super-low-power, low-voltage full-CMOS static RAM, which makes it well suited to battery-operated and battery-backed data retention designs. The full-CMOS cell gives near-zero static data retention current when deselected, and the 2.7V-3.3V supply matches single-cell lithium or 3.3V rail systems. For exact ICC1/ICC2 and data-retention figures, consult the K6F2016U4E datasheet electrical characteristics table for your speed grade.
Where can I download the K6F2016U4E-EF70T datasheet PDF?
The K6F2016U4E family datasheet covering the EF70T ordering code is available from Samsung Semiconductor documentation mirrors such as datasheet4u.com and alldatasheet.com, where it is listed as a 9-page document describing the 128K x 16 super-low-power full-CMOS static RAM. XAIPART also links the datasheet from this product page. Note that the datasheet covers the family; verify the EF70T suffix maps to your required speed, temperature, and packing options.
Where can I find the K6F2016U4E-EF70T pinout or ball map?
The K6F2016U4E-EF70T ball map is defined in the Samsung K6F2016U4E family datasheet, in the 48-ball BGA (6 x 7) package section, which lists each ball address (rows A-F, columns 1-7) for address, data, CE, OE, WE, VCC, VSS, and NC balls. Since the full verified ball map was not included in the data used to build this page, consult the Samsung datasheet PDF linked above rather than relying on third-party reproductions.
Where can I buy K6F2016U4E-EF70T online?
K6F2016U4E-EF70T is listed by DigiKey Marketplace (listed under Samsung Semiconductor, Inc.) and by secondary distributors such as Ampheo, Xecor, and Chipdigger. On XAIPART, request a quote for confirmed stock and lead time. Availability for legacy Samsung SRAM can fluctuate, so verify stock on the marketplace listing and compare lead times before committing a bill of materials, especially for production quantities.
What is the price of K6F2016U4E-EF70T?
Pricing for K6F2016U4E-EF70T is quote-based as of 2026-09-01 because distributor listings for this legacy Samsung SRAM frequently change and volume pricing varies by supplier. The price tiers on this page are request-quote; submit an RFQ with your quantity and delivery schedule to receive current pricing. Marketplace listings such as DigiKey may show spot stock at single-piece prices for immediate shipment.
Is K6F2016U4E-EF70T in stock, and what is the lead time?
DigiKey Marketplace has listed K6F2016U4E-EF70T with same-day shipping capability, and secondary distributors (Ampheo, Xecor, Chipdigger) advertise stock or short-lead-time supply as of 2026-09-01. However, legacy Samsung SRAM stock is volatile and frequently held by brokers rather than franchised distribution. For guaranteed delivery, request a formal quote with the manufacturer date code and traceability documentation you require.
How do I interface the K6F2016U4E-EF70T to an FPGA or microcontroller?
The K6F2016U4E-EF70T connects gluelessly via a 17-bit address bus, 16-bit bidirectional data bus, and three control lines: CE (chip enable), OE (output enable), and WE (write enable). For an FPGA, generate a simple asynchronous or synchronous memory controller that asserts CE and WE for writes and CE with OE for reads, respecting the 70 ns tAA and write pulse widths from the Samsung datasheet. Add series resistors (about 22 to 33 ohm) on data lines to reduce reflections at moderate bus speeds.
Is K6F2016U4E-EF70T RoHS compliant and lead-free?
The RoHS and REACH compliance status of K6F2016U4E-EF70T was not confirmed in the verified data used for this page and is marked as needing confirmation. Samsung's later-generation SRAMs in BGA packaging are generally RoHS-compliant, but because this is a legacy part produced across several eras, verify the compliance certificate or the Samsung product page for the exact ordering code before using it in a new RoHS-mandated design.
Hey Google, what can replace K6F2016U4E-EF70T?
The safest replacements are same-family Samsung parts: K6F2016U4E-EF55T (55 ns, same 48-ball TFBGA, pin-compatible) and K6F2016U4D-FF70T00 (same speed class and organization). Cross-brand 2 Mbit 128K x 16, 3.3V asynchronous SRAMs such as Infineon's CY62167EV30 family are functional equivalents, but confirm ball-map compatibility against both datasheets before assuming a drop-in swap on the same PCB footprint.
K6F2016U4E-EF70T vs K6F2016U4E-EF55T - which is better for an MCU data buffer?
For an MCU data buffer, the EF70T is usually the better choice: most MCU external memory buses with one or two waitstates easily meet 70 ns timing, and the slower grade is more widely stocked and typically less expensive. Pick the EF55T only if your bus timing analysis shows address-to-data windows tighter than 70 ns. Both parts share the identical 128K x 16 organization, 2.7V-3.3V supply, and 48-ball 6 x 7 TFBGA package, so the decision is purely speed versus cost.

Engineering reference data for K6F2016U4E-EF70T β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the K6F2016U4E-EF70T when you need 2 Mbit of 3.3V asynchronous SRAM with a 70 ns budget, super-low standby power, and a compact 48-ball 6 x 7 TFBGA - typical for MCU/FPGA buffers, data loggers, and industrial controllers where bus cycle times exceed 70 ns. Choose the K6F2016U4E-EF55T instead when your timing analysis demands sub-70 ns access; it is pin-compatible, so the same layout serves both grades. Choose the K6F2016U4D-FF70T00 as a supply-chain fallback within the same footprint, but verify its ICC specifications against the U4E datasheet since it is not the super-low-power line. The trade-off hierarchy is: speed grade first (55 ns vs 70 ns), then power family (U4E vs U4D), then packing (Tape & Reel T-suffix for production, tray for prototyping). Cross-brand equivalents exist functionally but were not confirmed as pin-to-pin in the verified data, so treat any non-Samsung swap as a redesign, not a drop-in. Pricing is request-quote as of 2026-09-01.

Comparison with Alternatives

Parameter This Product K6F2016U4E-EF55T K6F2016U4D-FF70T00 K6F2016U4E-EF55
Package 48-TFBGA (6 x 7) 48-TFBGA (6 x 7) - same 48-TFBGA (6 x 7) - same 48-TFBGA (6 x 7) - same
Brand Samsung Samsung Samsung Samsung
Density 2 Mbit 2 Mbit 2 Mbit 2 Mbit
Organization 128K x 16 128K x 16 128K x 16 128K x 16
Access Time (tAA) 70 ns 55 ns 70 ns class 55 ns
Supply Voltage 2.7 V to 3.3 V 2.7 V to 3.3 V 2.7 V to 3.3 V 2.7 V to 3.3 V
Power Class Super low power (full CMOS) Super low power (U4E family) Low power (U4D family) Super low power (U4E family)
Packing Tape & Reel (T suffix) Tape & Reel Tape & Reel Tray (non-T suffix)
Unit Price (qty 1) Request quote (as of 2026-09-01) [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]

Key Differentiators

  • Super-low-power full-CMOS standby behavior (vs K6F2016U4D-FF70T00)
  • Cost-effective 70 ns speed grade (vs K6F2016U4E-EF55T)
  • Board-space efficient 6 x 7 mm BGA (vs K6F2016U4E-EF55)

Design Notes

Place a 0.1 uF ceramic capacitor at each VCC ball pair of the 48-ball TFBGA, within 2 mm of the via fanout, plus one 10 uF bulk capacitor per device. Fan out the BGA with via-in-pad or dog-bone escapes on a four-layer board; dedicate one internal layer as a solid ground plane so the 16-bit data bus has a low-inductance return path. Keep the address and data bus under 10 cm between the SRAM and the controller where practical to bound flight-time skew at moderate bus rates.

At bus cycle times approaching the 70 ns grade, reflections are usually manageable, but still add 22-33 ohm series resistors on data and address lines longer than 8 cm to damp ringing, especially on two-layer boards without an adjacent ground plane. Ensure CE is pulled up (deselected) during controller reset so the SRAM never drives the bus while the FPGA or MCU is tri-stated; bus contention during power-up is a common failure mode in shared-parallel-bus designs.

Ordering-code suffixes on this family carry meaning: EF encodes process/power options, the two digits encode speed grade (55 = 55 ns, 70 = 70 ns), and T indicates Tape & Reel packing. Ordering the non-T suffix delivers trays instead of reels, which affects pick-and-place feeders. Also verify the datasheet timing table for your specific speed grade rather than assuming: write pulse widths and data hold times differ between the 55 ns and 70 ns versions of the K6F2016U4E family.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Compliance status was not stated in the verified distributor or datasheet excerpts for this legacy Samsung SRAM; request a compliance certificate from the supplier.

Data verified on: 2026-09-01 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Samsung Samsung Semiconductor K6F2016U4E-EF70T K6F2016U4E K6F2016U4D-FF70T00 K6F2016U4E-EF55T SRAM static random-access memory asynchronous SRAM full CMOS 128K x 16 2 Mbit 48-TFBGA BGA surface mount tAA access time 2.7V to 3.3V supply industrial temperature range RoHS data acquisition industrial automation battery-backed memory
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