M1AFS1500-2FG256I - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
MPN: M1AFS1500-2FG256I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $210.5 | $210.50 |
| 10 | $195 | $1,950.00 |
| 100 | $178 | $17,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $152 | $152,000.00 |
Drop-in alternatives for M1AFS1500-2FG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1AFS1500-2FG256
✅ Drop-In✓ In Stock
$280.68 / Unit
View Datasheet →M1AFS1500-1FG256I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$205 / Unit
View Datasheet →M1AFS1500-1FG256
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$191.42 / Unit
View Datasheet →M1AFS1500-FG256I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$341.46 / Unit
View Datasheet →AFS1500-2FG256I
✅ Drop-In📋 Reference alternative (not in catalog)
M1AFS1500-2FGG256
✅ Drop-In✓ In Stock
$124.5 / Unit
View Datasheet →M1AFS1500-2FG256I Maximum Ratings & Electrical Characteristics
| Family | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 1500000 |
| Logic Cells | 38400 |
| Embedded Processor | ARM Cortex-M1 (M1 variant) |
| Speed Grade | -2 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm Flash-based CMOS |
| Configuration Memory | On-chip Flash (non-volatile, secure) |
| Package | 256-ball FBGA (LBGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Analog Subsystem | Mixed-signal FPGA with configurable analog blocks and ADC |
| Clock Management | Integrated clock generation and management circuitry |
| Packaging | Tray |
M1AFS1500-2FG256I 256-ball fbga (lbga) Pin Configuration Guide
Complete pinout information for M1AFS1500-2FG256I (256-ball fbga (lbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS1500-2FG256I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS1500-2FG256I is suitable for 6 applications: Industrial Automation and Motor Control, Aerospace and Defense Systems, Power Supply and Battery Management, Medical Instrumentation, Test and Measurement Equipment, Secure Embedded Control and IoT Gateways.
Industrial Automation and Motor Control
The M1AFS1500-2FG256I fits industrial automation because it combines 38,400 logic cells for multi-axis PWM generation and encoder decoding with an ARM Cortex-M1 core that executes the control loop, all with deterministic, instant-on flash configuration. Its mixed-signal analog subsystem can monitor DC bus voltage, motor temperature, and current-shunt signals through the on-chip ADC inputs without an external monitor IC. The industrial -40C to +100C rating matches factory floor requirements, and the 1.5V core keeps dynamic power manageable in dense cabinets. Designs typically implement fieldbus interfaces (CAN, RS-485) in fabric while the Cortex-M1 runs protocol stacks, consolidating control onto one chip and shrinking board area versus MCU-plus-CPLD two-chip solutions.
Recommended
Aerospace and Defense Systems
Flash-based Fusion FPGAs are a strong match for aerospace and defense because the on-chip flash configuration cannot be read back and is immune to configuration upset at power-on, unlike SRAM FPGAs that need external configuration devices. The M1AFS1500-2FG256I provides 1.5 million gates for interface bridging, telemetry formatting, and payload sequencing, while the Cortex-M1 core runs supervisory firmware on the same die. The integrated analog subsystem supports in-flight housekeeping of voltages and temperatures via the 30 scalable analog inputs. The industrial temperature grade and monolithic single-chip integration reduce component count, a key reliability driver where every solder joint and device counts toward system MTBF.
Recommended
Power Supply and Battery Management
The Fusion family was architected for power management: its analog subsystem continuously measures supply rails, battery stack voltages, and board temperature through up to 30 analog input channels, while the programmable fabric implements PWM controllers, state machines, and digital filters. The M1AFS1500-2FG256I's Cortex-M1 executes charging algorithms and communication protocols, and because configuration is flash-based, the controller is active within microseconds of power application - important for hot-swap and brown-out recovery in server and telecom power shelves. Digital closure of control loops in fabric offers cycle-accurate timing that software-only MCUs cannot match, improving transient response in multi-rail power systems.
Recommended
Medical Instrumentation
Medical diagnostic and monitoring equipment benefits from the M1AFS1500-2FG256I's combination of deterministic logic and integrated analog sensing. The device can sequence front-end gain stages, generate acquisition timing with sub-microsecond precision, and monitor internal rail voltages and enclosure temperature through the on-chip ADC - supporting the self-test routines that IEC 60601-style safety designs require. The Cortex-M1 core handles user-interface logic and communication to a host, while the 1.5M-gate fabric implements real-time digital filtering of biosignals. Flash configuration ensures the instrument is fully operational the instant power is applied, and the secure bitstream helps protect proprietary measurement algorithms from extraction.
Recommended
Test and Measurement Equipment
Bench and rack instruments need flexible, updatable logic, and the M1AFS1500-2FG256I delivers it with in-system programmable flash: instrumentation firmware can reconfigure the fabric in the field without opening the unit. The 38,400 logic cells implement trigger engines, timebase counters, and interface bridges (USB, LAN, PCI) while the Cortex-M1 core runs command interpreters and calibration routines. The mixed-signal ADC channels add self-calibration and thermal-drift compensation with no extra ICs. Because flash configuration is non-volatile, the instrument powers into a known state instantly, and the secure bitstream protects vendor IP - a practical advantage over SRAM FPGAs that require external boot devices and longer startup sequences.
Recommended
Secure Embedded Control and IoT Gateways
For industrial IoT gateways and secure embedded controllers, the M1AFS1500-2FG256I offers a single-chip solution: flash-based configuration is inherently write-protected against readback attacks, the Cortex-M1 executes application firmware, and the fabric implements custom accelerators, cryptography wrappers, and multi-protocol I/O. The analog subsystem supervises supply integrity and can detect tamper conditions such as voltage glitching on monitored rails. With 1.5 million gates, one device can host an Ethernet or CAN bridge plus preprocessing logic that would otherwise need an MCU plus separate FPGA. Instant-on behavior means the gateway is reachable within milliseconds of power-up, improving availability metrics in remote, unattended installations.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS1500-2FG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS1500-2FG256 | M1AFS1500-1FG256I | AFS1500-2FG256I | M1AFS1500-2FGG256 |
|---|---|---|---|---|---|
| Package | 256-ball FBGA | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA (lead-free ball variant) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M |
| Logic Cells | 38400 | 38400 | 38400 | 38400 | 38400 |
| Speed Grade | -2 | -2 | -1 (slower) | -2 | -2 |
| Temperature Range | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| ARM Cortex-M1 Core | Yes | Yes | Yes | No (non-M1 variant) | Yes |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Embedded ARM Cortex-M1 processor in the fabric (vs AFS1500-2FG256I)
- Faster -2 speed grade for timing closure margin (vs M1AFS1500-1FG256I)
- Industrial temperature rating for harsh environments (vs M1AFS1500-2FG256)
- Mixed-signal integration versus SRAM FPGA competitors (vs Xilinx Spartan-6 (functional equivalent))
Design Notes
The M1AFS1500-2FG256I requires a 1.5V core supply plus I/O bank rails selected per bank in Libero. Estimated: at 1.5M gates with moderate utilization and 50 MHz toggling, core current is typically in the hundreds of milliamps - run Microchip's power calculator (inside Libero SoC) with your actual design before sizing the regulator. Allow headroom of at least 30% above calculated core current, and add bulk (22-47 uF) plus 0.1 uF ceramic decoupling at each VCC ball group per the Fusion datasheet power supply recommendations.
The 256-ball FBGA with fine ball pitch requires a controlled-impedance multilayer board; Microchip recommends via-in-pad or blind/buried vias for the inner ball rows. Define the footprint directly from the Libero package file rather than third-party symbols, since many balls are multi-function and their assignment shifts with your design. Follow the Fusion datasheet PCB layout guidelines for analog input routing - keep the ADC monitor input traces short, guarded, and away from switching nodes to preserve measurement accuracy.
Do not assume the non-M1 AFS1500-2FG256I is software-identical: designs using the Cortex-M1 will not fit it, and the Libero toolchain treats the M1 fabric differently. Second, verify speed grade in timing simulation - a -1 device cannot be substituted for a -2 in timing-critical paths even though the footprint is identical. Finally, flash-based FPGAs reprogram via JTAG only through Libero/FlashPro; plan your production programming fixture and security lock settings before tape-out.
The 256-ball FBGA relies on the PCB for heat dissipation. Estimated: with typical Fusion power in the 1-2 W range, thermal resistance depends heavily on copper; provide solid power and ground planes and, for designs approaching 2 W, add thermal vias under the package per Microchip's thermal application notes. Verify junction temperature stays below the datasheet maximum across your worst-case ambient, especially in the industrial -40C to +100C environment this device is rated for.
Compliance Information
RoHS compliant and lead free per distributor listings (chipdig datasheet summary: Lead Free / RoHS Compliant). REACH, halogen-free, and conflict-minerals declarations should be requested from Microchip compliance documentation.
