M29F200FB55N3E2 - 2Mbit 5V NOR Flash 55ns TSOP-48 | Micron
MPN: M29F200FB55N3E2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.5 | $6.50 |
| 10 | $5.95 | $59.50 |
| 100 | $5.4 | $540.00 |
| 500 | $4.9 | $2,450.00 |
| 1,000 | $4.45 | $4,450.00 |
Drop-in alternatives for M29F200FB55N3E2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M29F200FB55N3F2
✅ Drop-In✓ In Stock
$4.2 / Unit
View Datasheet →M29F200FB55M3E2
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →M29F200FT55N3F2
✅ Drop-In✓ In Stock
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View Datasheet →M29F200FB5AN6E2
✅ Drop-In📋 Reference alternative (not in catalog)
MX29F200BMC-70
✅ Drop-In📋 Reference alternative (not in catalog)
M29F200FB55N3E2 Maximum Ratings & Electrical Characteristics
| Memory Type | NOR Flash, Parallel |
| Density | 2 Mbit (2097 kbits) |
| Organization | 256K x 8 / 128K x 16 |
| Number of Words | 128 K |
| Bits per Word | 16 bits |
| Access Time | 55 ns |
| Supply Voltage (VCC) | 5 V |
| Boot Block Architecture | Bottom Boot Block |
| Interface | Parallel, 8/16-bit selectable |
| Program/Erase Controller | Embedded byte/word program algorithms |
| Operating Temperature | -40C to +125C |
| Package Type | 48-pin TSOP I |
| Mounting Type | Surface Mount |
| Memory Cell Type | SLC NOR |
| Packaging | Tray |
M29F200FB55N3E2 48-pin tsop i Pin Configuration Guide
Complete pinout information for M29F200FB55N3E2 (48-pin tsop i package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M29F200FB55N3E2.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M29F200FB55N3E2 is suitable for 6 applications: Firmware Boot Code Storage, Industrial Control Systems, Telecommunications Line Cards, Set-Top Box and Consumer Electronics, Automotive Body Electronics, Test and Measurement Equipment.
Firmware Boot Code Storage
The M29F200FB55N3E2 serves as boot memory for 5V embedded processors because its bottom boot block places reset/boot code at the bottom of the address map where many CPUs begin execution. The 55 ns access time supports execute-in-place (XIP) operation directly from flash without copying code to RAM, and the parallel address/data bus connects to the CPU external memory controller without an intermediary controller. The embedded program/erase controller automates programming algorithms so field firmware updates need only simple command sequences and status polling. Designers should reserve the small boot blocks for immutable bootloader code and place application images in larger parameter blocks.
Recommended
Industrial Control Systems
Industrial PLCs, motor drives, and process controllers frequently retain 5V backplanes and I/O standards for noise immunity, making the M29F200FB55N3E2 a natural fit: its single 5V supply eliminates level-shifting on the memory bus, and the -40C to +125C industrial temperature range covers cabinet and floor-level environments. The 2 Mbit density typically holds a complete control firmware image plus configuration blocks. The embedded byte/word program controller allows safe field upgrades via the controller's status polling, and block protection guards parameter sectors against accidental erasure during brownout events.
Recommended
Telecommunications Line Cards
Legacy telecom line cards and network interface modules were designed around 5V parallel NOR flash, and the M29F200FB55N3E2 sustains these platforms through service-life extensions. The 55 ns access time meets typical telecom processor external bus timing, while word-wide (16-bit) operation halves address fetch counts versus byte mode. Its asymmetric boot block organization stores boot ROM, parameter tables, and downloadable firmware in distinct protected regions. Because these cards remain in service for decades, EOL part sourcing and the Macronix MX29F200B cross-brand second source are common supply-chain strategies documented on this page.
Recommended
Set-Top Box and Consumer Electronics
Set-top boxes, DVD players, and similar consumer platforms of the 5V era used parallel NOR like the M29F200FB55N3E2 for bootloader and menu firmware. The 128K x 16 organization provides 16-bit word access that pairs with common embedded CPUs, and 55 ns random access enables XIP execution from flash, saving RAM cost in cost-sensitive consumer hardware. The embedded program/erase controller supports manufacturing programming on automated handlers and OTA-style field updates by software command. SLC NOR cells provide the program/erase endurance expected for repeated firmware update cycles over the product lifetime.
Recommended
Automotive Body Electronics
Body control modules, instrument clusters, and gateway ECUs from the 5V automotive generation used industrial-temperature parallel NOR. The M29F200FB55N3E2's -40C to +125C operating range aligns with component-level automotive ambient requirements, and its 5V supply matches classic 5V automotive MCU buses without translators. Bottom boot blocks hold the safety-relevant bootloader in a protected region, while parameter blocks store calibration and DTC data. Automotive programs must confirm AEC-Q100 qualification status of the exact ordering code and consider the FB55N3F2 variant for current-production supply continuity.
Recommended
Test and Measurement Equipment
Bench instruments, data loggers, and modular measurement systems benefit from the M29F200FB55N3E2's deterministic 55 ns random access for storing calibration tables, instrument firmware, and non-volatile settings directly executable or instantly addressable by the host CPU. The 5V parallel bus simplifies interfacing to legacy instrument processors, and the asymmetric boot block map separates resident firmware from user-save areas. The embedded erase/program controller performs sector operations autonomously, letting the instrument continue measurement tasks during background firmware updates, with status-bit polling indicating completion.
Recommended
Recommended Products Summary
Engineering reference data for M29F200FB55N3E2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M29F200FB55N3F2 | M29F200FT55N3F2 | M29F200FB5AN6E2 | MX29F200BMC-70 |
|---|---|---|---|---|---|
| Package | 48-TSOP I | 48-TSOP I - same | 48-TSOP I - same | 48-TFSOP - consistent terminals | 48-TSOP I - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Macronix International |
| Density | 2 Mbit | 2 Mbit | 2 Mbit | 2 Mbit | 2 Mbit |
| Organization | 256K x 8 / 128K x 16 | 256K x 8 / 128K x 16 | 256K x 8 / 128K x 16 | 256K x 8 / 128K x 16 | 256K x 8 / 128K x 16 |
| Access Time | 55 ns | 55 ns | 55 ns | [DATA_NEEDED] | 70 ns |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| Boot Block Location | Bottom | Bottom | Top | Bottom | [DATA_NEEDED] |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | EOL | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | Active production |
Key Differentiators
- Fastest access time in the 2 Mbit 5V NOR class (vs MX29F200BMC-70)
- Bottom boot block for CPUs that reset into low addresses (vs M29F200FT55N3F2)
- Identical-drop-in Micron family continuation (vs M29F200FB55N3F2)
Design Notes
The M29F200FB55N3E2 is a single-supply 5V device; program and erase operations draw elevated current from VCC, so budget the 5V rail for worst-case program/erase current in addition to read current. Decouple VCC with a 0.1 uF ceramic capacitor placed within a few millimeters of each VCC pin, plus bulk capacitance on the board. Never allow VCC to droop below specification during a program/erase burst, as interrupted erase operations can corrupt block contents.
Verify the boot block direction before substitution: 'FB' parts (bottom boot) and 'FT' parts (top boot) share the same 48-TSOP I footprint and nearly identical ordering codes, so a purchasing substitution of M29F200FT55N3F2 for M29F200FB55N3E2 will place bootloader blocks at the wrong end of the address map and produce a non-booting system despite being pin-to-pin identical. Also confirm the BYTE pin strap matches your intended 8-bit or 16-bit bus mode.
Route the parallel address and data buses with matched lengths where the CPU bus exceeds roughly 50 MHz effective toggle rates; at 55 ns access timing most legacy buses are lenient, but keep series termination near the driver on heavily loaded address lines to control ringing. Provide test points on data lines for in-circuit programming fixtures, since EOL parts like this are often programmed offline before reflow.
Because the part is EOL, implement block protection during manufacturing programming to guard against spurious writes during power brownouts, and include a software-level flash driver that verifies status-bit completion rather than fixed delays. For supply assurance, validate the Macronix MX29F200BMC-70 cross-brand source command set against your driver, since protection and command details differ between vendors.
Compliance Information
Compliance status was not stated in the provided web data. Confirm RoHS/REACH status on the Micron part-detail page for the exact ordering code; the E2 suffix generation of the M29F family is generally understood to be RoHS-era, but this must be verified before claiming compliance.
