M7AFS600-1FG484 - Fusion FPGA 600K Gates 484-BGA | Microchip
MPN: M7AFS600-1FG484 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $232.75 | $2,327.50 |
| 100 | $213.15 | $21,315.00 |
| 500 | $196 | $98,000.00 |
| 1,000 | $181.3 | $181,300.00 |
Drop-in alternatives for M7AFS600-1FG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M7AFS600-FG484I
✅ Drop-In✓ In Stock
$273.98 / Unit
View Datasheet →M7AFS600-FGG484I
✅ Drop-In✓ In Stock
$219.2 / Unit
View Datasheet →M7AFS600-2FGG484I
✅ Drop-In✓ In Stock
$243.75 / Unit
View Datasheet →M1AFS600-1FGG484K
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →AFS600-FG484K
✅ Drop-In📋 Reference alternative (not in catalog)
M7AFS600-1FG484 Maximum Ratings & Electrical Characteristics
| Manufacturer Part Number | M7AFS600-1FG484 |
| Family | Fusion FPGA |
| System Gates | 600000 |
| Logic Elements (DigiKey listing) | 110592 |
| Embedded Processor | ARM CoreMP7 |
| User I/O | 172 |
| Process Technology | 130 nm CMOS, 7-layer metal, Flash-based |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | Flash (nonvolatile, Live at Power-Up) |
| Maximum Operating Frequency | 1282.05 MHz (speed grade listing) |
| Package | 484-ball FBGA (FG484), 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Number of Balls | 484 |
| Speed Grade | -1 |
| Logic Family | CMOS |
| Packaging | Tray |
M7AFS600-1FG484 484-ball fbga (fg484), 1.0 mm pitch Pin Configuration Guide
Complete pinout information for M7AFS600-1FG484 (484-ball fbga (fg484), 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M7AFS600-1FG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M7AFS600-1FG484 is suitable for 6 applications: Industrial Automation and Control, Secure Embedded Systems, Aerospace and Defense Prototyping, Medical Instrumentation, Power and Sensor Management, Communications and Networking Line Cards.
Industrial Automation and Control
The M7AFS600-1FG484 fits industrial automation because its 600K-gate Fusion fabric and embedded ARM CoreMP7 let a single 484-FBGA device replace a microcontroller plus glue logic plus ASIC. Flash-based nonvolatile configuration means the controller is Live at Power-Up, so motor drives and PLC I/O modules begin operating within microseconds of power application - a real advantage where SRAM FPGA configuration latency (tens of milliseconds plus external PROM read time) is unacceptable. The 172 user I/Os cover parallel fieldbus interfaces, encoder inputs, and sensor banks without external expansion logic. The Flash fabric is also inherently more SEU-tolerant than SRAM cells, improving reliability in electrically noisy factory environments. Place the device on a clean 1.5V core rail with local bulk and 0.1uF per-bank decoupling, and route field-side I/O through proper isolation to protect the FPGA banks.
Recommended
Secure Embedded Systems
Flash-based FPGAs like the M7AFS600-1FG484 are preferred in secure embedded systems because the bitstream resides in nonvolatile Flash on the die rather than being loaded from an external SRAM configuration device at every boot. This removes the classic SRAM-FPGA attack surface of intercepting the configuration stream and eliminates the external PROM entirely. The 600K-gate Fusion fabric with the ARM CoreMP7 processor supports custom cryptographic engines, secure boot state machines, and board-level authentication logic in one chip. The 484-FBGA package also buries ball connections, complicating board-level probing versus fine-pitch QFP parts. Designers should enable the device's FlashLock security features in Libero and plan JTAG access control on the PCB. For long-lifecycle industrial and defense-adjacent programs, the nonvolatile architecture also simplifies supply chain by removing the configuration memory BOM line.
Recommended
Aerospace and Defense Prototyping
The Microsemi (now Microchip) FPGA lineage makes the M7AFS600-1FG484 a natural prototyping vehicle for aerospace and defense programs that later migrate to RTAX or radiation-tolerant silicon. The 600K-gate Fusion fabric and 130-nm Flash process support DSP datapaths, telemetry framing, and bus interfaces (1553, CAN, UART meshes) using the 172 available user I/Os. Flash-based Live-at-Power-Up operation matters in avionics, where systems must be operational within strict power-up timing budgets without a separate configuration controller. While the commercial-grade -1 FG484 part itself is not flight-qualified, its logic, pin map, and Libero design flow carry forward into Microsemi space-grade families such as the RTAX2000S series, reducing redesign risk. Prototype with the FG484 package, then port the verified RTL to the CQ352 or CG624 ceramic packages used by the space-grade parts.
Recommended
Medical Instrumentation
Medical diagnostic and monitoring equipment benefits from the M7AFS600-1FG484's combination of instant-on Flash configuration and reprogrammable logic. Patient-monitoring front ends, laboratory analyzers, and imaging subsystems use the 600K-gate fabric for sensor-interface state machines, filtering datapaths, and display/touch interfacing, while the ARM CoreMP7 runs the application supervisory code. The Live-at-Power-Up property allows safety-critical monitor logic to be active before a host processor finishes booting, supporting watchdog and interlock functions required in medical devices. The 172 user I/Os interface directly with ADCs, membrane keyboards, and communication modules without glue logic. Designers should observe the usual medical-device practices: brown-out supervision on the 1.5V core rail, isolated communication interfaces toward patient-connected circuits, and documented verification of the FPGA bitstream under the device's full environmental range per the Fusion datasheet.
Recommended
Power and Sensor Management
The Fusion family was specifically architected for system power and sensor management, and the M7AFS600-1FG484 is the largest-density 484-ball member of that lineage. Beyond the programmable fabric, Fusion devices integrate mixed-signal resources suited to board-level telemetry: analog monitoring inputs, voltage and temperature sensing, RTC support, and clock management - allowing a single chip to supervise backplane voltages, thermal zones, and fan control while the 600K gates implement the management state machine. The ARM CoreMP7 handles protocol layers such as IPMI-style messaging or custom supervisory buses. Flash-based instant-on behavior means power-rail supervision is active within microseconds of auxiliary power arriving, closing the common window where SRAM-FPGA managers are blind during boot. Allocate the analog resources per the Fusion datasheet and keep sense routing short, kelvin-connected, and away from switching-regulator nodes for accuracy.
Recommended
Communications and Networking Line Cards
The M7AFS600-1FG484 serves in communications equipment for control-plane and moderate-throughput datapath tasks on line cards and blades. Its 172 user I/Os and 484-ball FBGA footprint provide enough parallel bandwidth for backplane management buses, front-panel interfaces, and PHY control, while 600K gates implement framing, CRC, and packet-parsing logic alongside the ARM CoreMP7 supervisory processor. Flash-based Live-at-Power-Up configuration allows the FPGA to arbitrate and monitor the card before the host CPU boots, which is valuable for hot-swap backplanes that must detect and enumerate cards immediately. For high-speed serial fabrics, pair the fabric with external SERDES devices since Fusion provides no multi-gigabit transceivers. Maintain signal integrity on bank routing by length-matching parallel buses and providing per-bank 0.1uF plus bulk decoupling on all VCCI rails listed in the Fusion datasheet.
Recommended
Recommended Products Summary
Engineering reference data for M7AFS600-1FG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M7AFS600-FG484I | M7AFS600-FGG484I | M7AFS600-2FGG484I | AFS600-FG484K |
|---|---|---|---|---|---|
| Package | 484-FBGA (FG484), 1.0 mm pitch | 484-FBGA (FG484) - same footprint | 484-FBGA (FGG484, lead-free) - same footprint | 484-FBGA (FGG484, lead-free) - same footprint | 484-FBGA (FG484) - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology (legacy Actel/Microsemi) |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Speed Grade | -1 | Standard | Standard | -2 (faster) | Standard |
| User I/O | 172 | 172 | 172 | 172 | 172 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Rating | Commercial (no I suffix) | Industrial (I) | Industrial (I) | Industrial (I) | Commercial |
| Configuration Memory | Flash (nonvolatile, LAPU) | Flash (nonvolatile, LAPU) | Flash (nonvolatile, LAPU) | Flash (nonvolatile, LAPU) | Flash (nonvolatile, LAPU) |
| Embedded Processor | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 |
Key Differentiators
- Nonvolatile Flash configuration with Live-at-Power-Up (vs SRAM-based FPGAs (no cross-brand drop-in exists))
- Industrial temperature availability in the same footprint (vs M7AFS600-FG484I)
- Higher timing performance option within the same design (vs M7AFS600-2FGG484I)
- Single-chip integration with ARM CoreMP7 (vs Discrete MCU + CPLD approach)
Design Notes
The M7AFS600-1FG484 requires a 1.5V core supply per the Fusion family datasheet. Estimated: with 600K gates and moderate utilization, dynamic core current can reach the ampere range depending on switching activity - size the 1.5V rail with bulk capacitance (at least 100uF ceramic plus local 0.1uF per power ball group) and verify current with Microchip's power estimation tool for your actual design. Sequence I/O bank rails per datasheet recommendations to avoid latch-up during multi-rail power-up, and use a supervisor with adequate brown-out thresholds.
The 484-ball FBGA with 1.0 mm pitch requires a multilayer PCB - minimum 6 layers is typical for escape routing, using via-in-pad or dog-bone fanout on a 0.5 mm-minimum trace escape grid. Follow the Fusion datasheet ball-map assignments exactly; do not reassign I/O banks in layout without re-running place-and-route, because bank voltage domains differ. Provide solid ground and core-power planes under the die area to minimize simultaneous-switching noise on the 172 user I/Os.
A frequent mistake is treating the M7AFS600-1FG484 like an SRAM FPGA: it is Flash-based and Live at Power-Up, so no external configuration PROM or configuration controller is needed, and adding one wastes BOM cost and board area. Conversely, do not assume cross-brand substitution: no Xilinx, Intel, or Lattice device is pin-compatible with the FG484 footprint, so design-change-level effort is required for second sources. Finally, note that the commercial-grade (no I suffix) part is not suitable for -40C to +85C industrial designs - select the M7AFS600-FG484I ordering code instead.
Route parallel buses between the FPGA and external memories or peripherals with matched lengths, and honor the I/O standards configured in Libero for each bank when setting termination. The 130-nm Flash fabric edges are moderate speed, but simultaneous switching on wide buses can still cause ground bounce on the 1.0 mm-pitch BGA; keep adjacent switching signals on different ground-return balls where possible and reserve series termination resistors near the FPGA on fast single-ended nets.
Compliance Information
Compliance status must be confirmed on the Microchip product page compliance documents. The G-suffixed ordering codes (e.g., M7AFS600-1FGG484, M7AFS600-FGG484I) denote the lead-free/RoHS package variant of the same die.
