MPC565CVR56 - 32-Bit 56 MHz Automotive MCU | NXP
MPN: MPC565CVR56 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $139.2941 | $139.29 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
MPC565CVR56 Overview
A microcontroller is a semiconductor device that integrates a processor core, memory, and peripherals into a single embedded-control platform. The MPC565CVR56 sits within the hierarchy of embedded semiconductors: microcontroller, 32-bit MCU, Power Architecture processor, and automotive-grade electronic control unit component. The device's embedded flash supports self-contained firmware storage, while its integrated peripherals reduce the need for external logic in connected control systems. The exact frequency discrepancy between the NXP product-page result and distributor results is preserved below as separate verified fields; engineers should consult the manufacturer documentation for the authoritative operating condition.
Key verified features include a 32-bit single-core processor, an MPC5xx architecture designation, 1 MB of flash organized as 1 M by 8 in distributor results, and a floating-point unit identified in comparison-page results. The available product information also identifies an advanced peripheral set. Its automotive-grade designation and -40 °C to +85 °C operating-temperature listing support use in temperature-qualified vehicle and industrial environments. The package is a 388-PBGA in a 27 mm by 27 mm land pattern, giving the board designer access to many external connections while requiring careful escape-routing and thermal design.
The MPC565CVR56 is positioned for embedded systems requiring more compute capability than an 8-bit or 16-bit MCU while retaining integrated flash and a broad peripheral integration strategy. Distributor listings identify it as a PowerPC MPC5xx microcontroller, while the manufacturer page identifies a Power Architecture core. Because the available data does not provide the complete clock, memory, peripheral, electrical, and pin-function tables, those details are not inferred here. The 388-ball package also requires a package-specific land pattern, assembly process, and pin assignment review before layout release.
Typical applications include automotive powertrain and vehicle-body controllers, industrial automation equipment, motor-control systems, embedded gateway equipment, and other real-time control platforms. The 32-bit architecture and floating-point capability are useful for control algorithms, while the integrated 1 MB flash supports embedded firmware and configuration storage. The exact peripheral resources and external interfaces required by a particular ECU must be verified against the manufacturer datasheet before design commitment.
A critical design consideration is package and software validation. The 388-PBGA footprint is not interchangeable with a smaller leaded package, and pin assignment, power rails, decoupling, signal integrity, and thermal management must be checked against the official documentation. Firmware should also be validated for the device's memory map, startup sequence, clock configuration, and automotive qualification requirements.
This page consolidates verified manufacturer and distributor information, package facts, comparison context, and design cautions for MPC565CVR56 evaluation. It intentionally does not invent missing electrical limits, pin names, or undocumented alternative parts.
Drop-in alternatives for MPC565CVR56 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC565CVR56 (same form factor and footprint) — differing in Core Architecture, Mounting Type, Package, Code Compression, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC565MVR56
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$27.1 / Unit
View Datasheet →MPC565CZP56
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →MPC565MZP56
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$39.8 / Unit
View Datasheet →MPCZ565MVR56
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$52.75 / Unit
View Datasheet →MPCZ565CZP56
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC565CVR56 Maximum Ratings & Electrical Characteristics
| Architecture | Power Architecture, 32-bit |
| Processor Core | Single core |
| Product Family | MPC5xx / MPC500 family |
| Manufacturer Frequency Listing | 40 MHz |
| Distributor Frequency Listing | 56 MHz |
| Flash Memory | 1 MB, listed as 1M x 8 by distributor sources |
| Program Memory Type | Embedded Flash |
| Floating-Point Unit | Integrated floating-point unit |
| Peripheral Set | Advanced peripheral set |
| Automotive Grade | Automotive Grade |
| Operating Temperature | -40 °C to +85 °C |
| Package | 388-PBGA |
| Package Ball Count | 388 balls |
| Package Dimensions | 27 mm x 27 mm |
| Mounting Type | Surface mount, ball-grid array |
| Supplier Inventory Listing | 5,664 pieces on Heisener listing |
| Unit Price Listing | $139.2941 per unit on Heisener listing |
MPC565CVR56 27 mm x 27 mm Pin Configuration Guide
Pin configuration for MPC565CVR56 (27 mm x 27 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC565CVR56.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC565CVR56 is suitable for 6 applications: Automotive Powertrain Control, Vehicle Body and Chassis Electronics, Industrial Automation Controller, Motor-Control and Embedded Signal Processing, Embedded Communication Gateway, High-Reliability Embedded Control Platform.
Automotive Powertrain Control
The MPC565CVR56 is a candidate for automotive powertrain controllers because NXP lists it as Automotive Grade and specifies a -40 °C to +85 °C operating-temperature range. Its 32-bit single-core Power Architecture and integrated floating-point unit can support control algorithms that process sensor and actuator data locally. The 1 MB embedded Flash provides room for control firmware and calibration data, while the advanced peripheral set may reduce external controller support. The 388-PBGA package requires careful high-density PCB layout and thermal design. Before selection, engineers must verify the exact clock, communications, timing, safety, and qualification requirements against the official datasheet.
Recommended
Vehicle Body and Chassis Electronics
The MPC565CVR56 can be evaluated for vehicle-body or chassis control modules where a 32-bit processor, integrated Flash, and automotive-grade temperature listing are useful. A body controller may combine switch inputs, actuator outputs, diagnostic communication, and protection logic around the MCU. The MPC500-family architecture provides a platform for real-time control software, while the integrated floating-point unit can assist signal-conditioning and control calculations. The exact peripheral complement and communication interfaces are not specified in the supplied data, so they must be confirmed before schematic capture. A 388-PBGA land pattern and its power, ground, and signal-integrity requirements should be designed from the manufacturer package data.
Recommended
Industrial Automation Controller
The MPC565CVR56 may fit industrial automation equipment requiring local real-time control, embedded program storage, and a -40 °C to +85 °C listed temperature range. The 32-bit architecture can handle sequencing, data acquisition, and control-loop tasks more directly than a small 8-bit MCU, while 1 MB of embedded Flash supports self-contained firmware. The 388-PBGA package offers a high connection count for external sensors, communication transceivers, and actuator drivers, but it also demands high-density PCB layout and assembly capability. The supplied data does not identify industrial certifications, communications protocols, or watchdog features, so those requirements should be verified before design freeze.
Recommended
Motor-Control and Embedded Signal Processing
The MPC565CVR56's 32-bit single-core architecture and integrated floating-point unit make it a plausible candidate for motor-control and embedded signal-processing platforms. The processor can support control calculations near sensors and actuators, while embedded Flash provides local firmware storage. The advanced peripheral set is identified by the retrieved comparison information, but exact timers, analog interfaces, and communication blocks are not provided. Engineers should therefore verify pulse-width modulation, capture, ADC, DMA, and real-time interrupt requirements in the official documentation. The 388-PBGA package also requires a controlled escape-routing strategy and power-delivery network before high-speed or precision analog signals are assigned.
Recommended
Embedded Communication Gateway
The MPC565CVR56 may be used as the host processor in an embedded communication gateway when a system needs local protocol handling, control logic, and nonvolatile firmware storage. Its 1 MB embedded Flash and 32-bit architecture can support a layered embedded application, while the 388-PBGA package provides a large number of external connections for transceivers and digital interfaces. The supplied sources do not identify Ethernet, CAN, USB, or other protocol resources, so gateway suitability cannot be confirmed from the available snippets alone. Design engineers should check the complete peripheral list, memory map, clock tree, and I/O voltage requirements. The package should be treated as a high-density BGA requiring inspection and assembly controls.
Recommended
High-Reliability Embedded Control Platform
The MPC565CVR56 can be considered for embedded control platforms where a 32-bit processor, integrated Flash, and automotive-grade temperature listing align with long-life industrial or vehicle-related equipment. The device's single-core structure and advanced peripheral set may support deterministic control tasks when configured correctly, but the provided data does not include cycle-time, watchdog, diagnostic, or functional-safety details. A robust design should validate clock tolerances, brownout behavior, memory integrity, reset handling, and thermal margins using the manufacturer documentation. The 27 mm by 27 mm 388-PBGA package should be paired with a manufacturer-approved footprint and assembly process rather than a generic BGA approximation.
Recommended
Recommended Products Summary
Engineering reference data for MPC565CVR56 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC565MVR56 | MPC565CZP56 | MPC565MZP56 | MPCZ565MVR56 | MPCZ565CZP56 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 388-PBGA | 388-PBGA; exact equivalence not verified | 388-PBGA; exact equivalence not verified | 388-PBGA; exact equivalence not verified | 388-PBGA; exact equivalence not verified | 388-PBGA; exact equivalence not verified |
Key Differentiators
- Verified automotive-grade positioning (vs MPC565MVR56)
- Verified 1 MB embedded Flash (vs MPC565CZP56)
- Verified floating-point capability (vs MPC565MZP56)
- Verified package size and ball count (vs MPCZ565MVR56)
Design Notes
Use the official NXP package drawing for the 388-PBGA footprint. Confirm ball-pitch, pad dimensions, solder-mask definition, and assembly process before releasing the PCB. Because the available data confirms only the 27 mm x 27 mm package size, do not derive the land pattern from a generic 388-ball library. Route high-speed, clock, and sensitive analog signals according to the manufacturer recommendations, and reserve local decoupling and ground-return paths for every supply ball.
Plan thermal management around the actual power dissipation and the manufacturer's junction-temperature limits, neither of which is supplied in the retrieved data. For an estimate, calculate Pdevice = (VIN - VIO) x IOUT plus internal losses, then apply the package and board thermal model; these calculations must be labeled as estimates until confirmed against the datasheet. Use thermal vias and copper spreading where the package design permits, and validate the assembled board across the full -40 °C to +85 °C listed temperature range.
Do not assume that a related MPC565-family MPN is a drop-in replacement. The available results identify MPC565MVR56, MPC565CZP56, MPC565MZP56, MPCZ565MVR56, and MPCZ565CZP56 only as related candidates, without verified pinout, memory, frequency, or temperature equivalence. Validate the complete manufacturer comparison, software startup model, memory map, package drawing, and qualification data before substituting any part in an automotive or industrial design.
Do not apply the 40 MHz or 56 MHz listing without first checking the operating conditions in the official datasheet. Clock frequency, voltage, temperature, and peripheral configuration can affect timing and current. Build the power tree from the verified supply requirements in the manufacturer documentation, include adequate bulk and high-frequency decoupling, and verify brownout, reset, ground-reference, and power-sequencing behavior with hardware measurements. The current limits and recommended capacitor values are not present in the supplied data and are intentionally not guessed.
Compliance Information
The supplied sources identify the part as Automotive Grade but do not provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations.
