NDL46PFP-8KET
MPN: NDL46PFP-8KET| Qty | Unit Price | Extended |
|---|---|---|
| Contact us for volume pricing | ||
Drop-in alternatives for NDL46PFP-8KET — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with NDL46PFP-8KET (same form factor and footprint) — differing in Package, Data Rate, Supply Voltage, Memory Type, Interface.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
NDL46PFG-8KIT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →MT41K256M16HA-125
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View Datasheet →K4B4G1646E-BYMA
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →H5TC4G63AFR-PBA
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →NT5CC256M16DP-DI
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →IS46TR16256A-125KBLA2
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$7.2 / Unit
View Datasheet →NDL46PFP-8KET Specifications
| No specifications available |
NDL46PFP-8KET standard Pin Configuration Guide
Pin configuration for NDL46PFP-8KET (standard package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for NDL46PFP-8KET.
Refer to the datasheet for full pin configuration.
Typical Applications
NDL46PFP-8KET is suitable for 3 applications: Embedded Systems, IoT Devices, Industrial Control.
Embedded Systems
Core processing in embedded applications using NDL46PFP-8KET.
IoT Devices
Smart connected devices powered by NDL46PFP-8KET.
Industrial Control
Automation and control systems using NDL46PFP-8KET.
No FAQ available for this product.
Engineering reference data for NDL46PFP-8KET — comparison, design guidance, and compliance information.
Comparison with Alternatives
| Parameter | This Product | NDL46PFG-8KIT | MT41K256M16HA-125 | K4B4G1646E-BYMA |
|---|---|---|---|---|
| Package | 96-FBGA (7.5x13.5) | 96-FBGA (7.5x13.5) | 96-FBGA (7.5x13.5) | 96-FBGA (7.5x13.5) |
| Brand | Insignis Technology | Insignis Technology | Micron Technology | Samsung Electronics |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Data Bus Width | 16 bit | 16 bit | 16 bit | 16 bit |
| Supply Voltage | 1.35V / 1.5V | 1.35V / 1.5V | 1.35V / 1.5V | 1.35V / 1.5V |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Dual voltage support (1.35V/1.5V) (vs MT41K256M16HA-125)
- Low power consumption (vs K4B4G1646E-BYMA)
- Compact 96-FBGA package (vs H5TC4G63AFR-PBA)
Design Notes
For high-speed DDR3L signals, maintain controlled impedance of 50 ohms for data lines and 40 ohms for address/command lines. Keep trace lengths matched within 50 mils for each byte lane. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin. Use a solid ground plane and avoid splitting it under the memory device.
The NDL46PFP-8KET operates up to 95°C case temperature. Ensure adequate airflow or heatsinking in high-ambient environments. The 96-FBGA package has a thermal resistance of approximately 20°C/W (theta_JA) with proper PCB copper. For high-density designs, consider thermal vias under the package to improve heat dissipation.
At 1600 Mbps, signal integrity is critical. Use series termination resistors (22-33 ohms) on data lines if needed. Follow the layout guidelines in the DDR3 JEDEC standard (JESD79-3F) for routing and termination. Avoid vias on high-speed signals where possible, and use ground vias adjacent to signal vias to reduce crosstalk.
Compliance Information
RoHS compliant per distributor data. Not AEC-Q100 qualified. Lead-free per datasheet.
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