RTAX4000S-CG1272V - 4M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX4000S-CG1272V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12000 | $12,000.00 |
| 10 | $11500 | $115,000.00 |
| 100 | $11000 | $1,100,000.00 |
| 500 | $10600 | $5,300,000.00 |
| 1,000 | $10200 | $10,200,000.00 |
Drop-in alternatives for RTAX4000S-CG1272V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX4000SL-1CG1272V
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View Datasheet →RTAX4000SL-CG1272E
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View Datasheet →RTAX4000SL-CG1272B
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View Datasheet →RTAX4000S-LG1272V
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$9600 / Unit
View Datasheet →RTAX4000S-1LG1272V
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RTAX4000SL-1LG1272V
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View Datasheet →RTAX4000S-CG1272V Maximum Ratings & Electrical Characteristics
| Family | RTAX-S Radiation-Tolerant FPGA |
| Equivalent System Gates | 4,000,000 |
| Configurable Logic Blocks (CLBs) | 40320 |
| Logic Cells | 60480 |
| Technology | CMOS, anti-fuse OTP |
| Core Supply Voltage | 1.5 V nominal |
| Operating Temperature | -55C to +125C |
| Package | CBGA1272 (ceramic column grid array, 1272 terminals) |
| Terminal Pitch | 1.000 mm |
| Configuration Type | One-Time Programmable (anti-fuse) |
| Live at Power-Up | Yes |
| Embedded SRAM | Yes (with built-in FIFO control logic) |
| Clock Features | Segmentable clock conditioning circuits |
| Routing | Chip-wide highway routing |
| Primary Applications | Space flight systems |
RTAX4000S-CG1272V cbga1272 (ceramic column grid array, 1272 terminals) Pin Configuration Guide
Complete pinout information for RTAX4000S-CG1272V (cbga1272 (ceramic column grid array, 1272 terminals) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX4000S-CG1272V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX4000S-CG1272V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Avionics and Bus Control, Telemetry and Telecommand Interfaces, Instrument Data Acquisition, Launch Vehicle and Re-entry Electronics, Prototyping RTAX-S Designs Before OTP Commit.
Satellite Payload Data Processing
The RTAX4000S-CG1272V's 4,000,000 equivalent gates and 40,320 CLBs give payload designers enough capacity for high-throughput framing, compression, encryption, and channel coding in a single radiation-tolerant chip. The anti-fuse fabric is live at power-up, so payload logic is operational the moment spacecraft power is applied - no configuration boot delay. Embedded SRAM blocks with built-in FIFO control logic buffer high-rate instrument data, while chip-wide highway routing sustains wide datapaths. The -55C to +125C rating and CBGA1272 ceramic package meet spaceflight assembly and thermal requirements. Place the device between the payload sensor interface and the downlink chain; because the fabric is one-time programmable, freeze the logic design before flight hardware programming.
Recommended
Spacecraft Avionics and Bus Control
Spacecraft on-board computers, attitude-control interfaces, and power-management controllers benefit from the RTAX4000S-CG1272V's single-chip integration and 1.5 V low-power CMOS operation, which reduce mass, board area, and power budget compared with multi-chip rad-hard logic. Live-at-power-up operation guarantees bus logic is functional immediately after separation events or power cycles. The segmentable clock conditioning circuits allow multiple independent clock domains for telemetry, telecommand, and control loops. Operating from -55C to +125C, the device tolerates eclipse-driven thermal swings. Because the anti-fuse configuration is immune to configuration-memory upsets, designers need only register-level SEU mitigation (TMR) rather than full configuration scrubbing, simplifying the fault-management architecture.
Recommended
Telemetry and Telecommand Interfaces
Telemetry formatting and telecommand decoding demand deterministic timing and reliable startup - both inherent to the RTAX4000S-CG1272V's anti-fuse architecture. The 60,480-cell fabric implements CCSDS-style framing, convolutional or Reed-Solomon coding front-ends, and command decoders at 4M-gate scale. Chip-wide highway routing carries wide parallel status words from across the spacecraft to the telemetry formatter without performance degradation. With a 1.000 mm terminal pitch CBGA1272 package, the device supports the high pin count required to interface dozens of subsystems simultaneously. Designers typically pair it with rad-tolerant memory and CAN/UART bridge logic; apply TMR to command-valid registers since command path upsets are mission-critical single-point failures.
Recommended
Instrument Data Acquisition
Scientific instruments on Earth-observation and interplanetary missions use the RTAX4000S-CG1272V as the acquisition back-end, where its 4M gates implement multi-channel ADC interface logic, digital filtering, and lossless compression. The embedded SRAM with built-in FIFO control logic provides ping-pong buffering between acquisition channels and the spacecraft data bus without external FIFO devices, reducing parts count in the rad-tolerant BOM. The CMOS process keeps quiescent power low during long integration periods, and the -55C to +125C range accommodates instrument thermal cycles. Because the OTP fabric requires no boot flash near the detector, configuration-related noise and wiring are eliminated. Freeze the acquisition firmware early; reprogramming flight OTP devices is not possible.
Recommended
Launch Vehicle and Re-entry Electronics
Launch vehicle avionics and re-entry systems require logic that is guaranteed operational through shock, vibration, and thermal extremes - conditions met by the RTAX4000S-CG1272V's ceramic CBGA1272 package and -55C to +125C rating. The live-at-power-up anti-fuse fabric removes boot-time risk during flight, and single-chip integration shrinks the critical electronics volume. Flight sequencing, stage-separation interlocks, and redundancy voting logic fit comfortably in the 60,480-cell fabric with timing margin from speed-grade variants. Because flight profiles are short but unforgiving, designers favor the SL latch-up-improved variants in high-fluence regimes; the same footprint allows S-to-SL migration without board respin. Verify screening flow certificates for each lot before assembly.
Recommended
Prototyping RTAX-S Designs Before OTP Commit
Because RTAX4000S devices are one-time programmable, design teams prototype in a reprogrammable medium before committing flight units. Microchip and Aldec jointly offer an RTAX/RTSX prototype adaptor built on flash-based ProASIC3E technology that emulates RTAX-S designs reprogrammably, letting engineers iterate timing, pin assignments, and SEU mitigation schemes at lower per-iteration cost. On this page, XAIPART recommends the commercial Axcelerator-family cousin A3PE3000-1FGG896 for board-level prototyping of logic that will ultimately map to the RTAX4000S fabric, since RTAX-S is derived from the Axcelerator architecture. Always re-run place-and-route in Libero for the target RTAX device and re-verify timing before programming flight OTP parts.
Recommended
Recommended Products Summary
Engineering reference data for RTAX4000S-CG1272V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX4000SL-1CG1272V | RTAX4000SL-CG1272E | RTAX4000S-LG1272V | RTAX4000SL-1LG1272V |
|---|---|---|---|---|---|
| Package | CBGA1272 (1.000 mm pitch) | CBGA1272 - same | CBGA1272 - same | LG1272 land grid - same 1272 ballout | LG1272 land grid - same 1272 ballout |
| Brand | Microchip Technology (Actel/Microsemi legacy) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 |
| Logic Cells | 60480 | 60480 | 60480 | 60480 | 60480 |
| Core Supply Voltage | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Latch-up Immunity (SEL) | Standard RTAX-S level | Enhanced (SL) | Enhanced (SL) | Standard RTAX-S level | Enhanced (SL) |
| Speed Grade | [DATA_NEEDED] | Speed grade 1 (-1) | Standard | [DATA_NEEDED] | Speed grade 1 (-1) |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
| Configuration | Anti-fuse OTP, live-at-power-up | Anti-fuse OTP, live-at-power-up | Anti-fuse OTP, live-at-power-up | Anti-fuse OTP, live-at-power-up | Anti-fuse OTP, live-at-power-up |
Key Differentiators
- Standard vs latch-up-improved fabric (vs RTAX4000SL-1CG1272V)
- Ceramic column attachment (vs RTAX4000S-LG1272V)
- No DSP blocks vs RTAX4000D (vs RTAX4000D-CQ352V)
Design Notes
The RTAX4000S fabric is anti-fuse one-time programmable: once programmed, the device cannot be reconfigured. Freeze the logic design, complete timing closure in Libero, and validate on the Aldec RTAX prototype adaptor (flash-based ProASIC3E) before committing flight devices. Also note the mechanical trap documented by Microchip: the CG1272/LG1272 bodies on RTAX-DSP (RTAX4000D) devices are slightly larger than the CG/LG1272 bodies on RTAX4000S/SL devices - do not assume package interchangeability across S and D families despite matching terminal counts.
The RTAX4000S operates from a nominal 1.5 V core supply on a CMOS process selected for low static power in orbit. Budget I/O power separately: with a 1272-terminal package, heavily used I/O banks at high toggle rates can dominate total device power. Provide generous power-plane decoupling at the CBGA1272 ball field and analyze core-current transients during clock-domain switching. Verify supply sequencing requirements in the RTAX-S datasheet power-up section, since anti-fuse devices have specific ramp-rate constraints at power application.
With 1.000 mm terminal pitch and up to 1272 connections, the CBGA1272 requires careful signal-integrity planning: group fast-switching I/O away from sensitive analog references, assign series termination on long单-ended nets, and simulate reflections on the ceramic-substrate escape pattern. Apply single-event-effect mitigation - triple-module redundancy on state registers and SEU-hardened FIFO flags in embedded SRAM - since the configuration fabric is immune to upsets but user flip-flops are not. Cross-check I/O bank voltage assignments against the datasheet before pin-lock.
Compliance Information
Space-grade ceramic-packaged device; standard commercial compliance declarations (RoHS/REACH) are not typically published for this product class - consult Microchip for screening and material declarations per lot.
