RTAX4000DL-1CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX4000DL-1CQ352V ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for RTAX4000DL-1CQ352V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX4000D-CQ352V
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View Datasheet →RTAX4000DL-1CQ352B
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View Datasheet →RTAX4000S-1CQ352V
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View Datasheet →RTAX4000SL-1CQ352E
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View Datasheet →RTAX4000SL-CQ352PROTO
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View Datasheet →RTAX4000DL-1CQ352V Maximum Ratings & Electrical Characteristics
| System Gates | 4,000,000 |
| Logic Cells | 55,440 |
| CLB Organization | 36,960 CLBs |
| Technology | CMOS, antifuse (one-time programmable) |
| Family | RTAX-DSP (RTAX-S/SL and RTAX-DSP radiation-tolerant FPGAs) |
| Configuration | Live at power-up, true single-chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing |
| Package | CQ352 ceramic column package, 352 contacts |
| Speed Grade | -1 |
| Grade / Temperature | V (space, radiation-tolerant) |
| Program Type | OTP (one-time programmable) |
| Application Domain | Space-flight systems |
RTAX4000DL-1CQ352V cq352 ceramic column package, 352 contacts Pin Configuration Guide
Complete pinout information for RTAX4000DL-1CQ352V (cq352 ceramic column package, 352 contacts package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX4000DL-1CQ352V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX4000DL-1CQ352V is suitable for 6 applications: Satellite Payload Signal Processing, Spacecraft Bus Control and Telemetry, Deep-Space Probe Instruments, Launch Vehicle Avionics, Earth Observation Image Processing, Space-Grade Test and Validation Systems.
Satellite Payload Signal Processing
The RTAX4000DL-1CQ352V fits satellite payload chains because its RTAX-DSP fabric embeds multiply-accumulate blocks that implement FIR filters, FFTs, and image-compression kernels directly in silicon, offloading the 55,440-cell general fabric for control and framing. Its 4,000,000-gate density hosts complete baseband or imaging pipelines in a single chip, and antifuse configuration is immune to configuration-memory upset, removing the need for SEU-scrubbing configuration management. Deployed between an ADC and downlink formatter, the device processes sampled data deterministically with live-at-power-up startup - no configuration load time at orbit insertion. The trade-off versus SRAM space FPGAs is one-time programmability: the validated bitstream is frozen before launch, so verification must complete on PROTO hardware first.
Recommended
Spacecraft Bus Control and Telemetry
For spacecraft command and data handling, the RTAX4000DL-1CQ352V implements telemetry encoders, decoder chains, and bus interfaces (e.g., MIL-STD-1553 or SpaceWire glue logic) with 36,960 CLBs of configurable registers and state machines. True single-chip live-at-power-up operation means the controller is functional the instant power is applied - critical for autonomy during launch and safe-mode recovery, since there is no external boot PROM to fail. Embedded SRAM with built-in FIFO control buffers telemetry packets without external memory. The V-suffix flight screening and ceramic CQ352 package tolerate launch vibration and thermal cycling. Designers should partition the design so time-critical control paths are registered, taking advantage of the -1 speed grade timing verified on PROTO units first.
Recommended
Deep-Space Probe Instruments
Deep-space instruments face extreme total ionizing dose and heavy-ion fluence; the RTAX4000DL-1CQ352V's antifuse CMOS fabric is inherently immune to configuration upset, making it a standard choice for instrument sequencers and front-end DSP. The DL variant's embedded MAC resources run matched filtering and on-board compression, cutting downlink bandwidth by processing raw sensor data before transmission. Chip-wide highway routing and segmentable clocks let a single device coordinate multiple instrument channels with deterministic timing, while the 4M-gate capacity absorbs design growth over long development cycles. Because reprogramming after launch is impossible with OTP silicon, mission teams validate on the non-hermetic RTAX4000SL-CQ352PROTO and commit the flight bitstream only after full radiation and functional test campaigns.
Recommended
Launch Vehicle Avionics
Launch avionics demands deterministic startup and vibration-tolerant packaging; the RTAX4000DL-1CQ352V answers both with live-at-power-up single-chip configuration and a ceramic CQ352 column package qualified for flight environments. Flight computers use the 55,440 logic cells for redundant-voting flight control logic, telemetry framing, and destruct-sequence interlocks, while the DSP fabric accelerates guidance filtering loops. The absence of configuration readout eliminates a common single-point failure mode in high-shock environments. The -1 speed grade timing is identical on PROTO and flight units per the Microchip datasheet, so timing closure achieved in validation transfers directly to flight hardware. Teams should implement triple-modular redundancy in the fabric for single-event-transient mitigation even though configuration itself is upset-immune.
Recommended
Earth Observation Image Processing
Earth-observation payloads push raw high-resolution sensor data through compression and sharpening pipelines; the RTAX4000DL-1CQ352V implements CCSDS image-compression and 2D convolution engines in its embedded DSP blocks, with the 4-million-gate fabric handling camera timing, DDR-style buffering control, and downlink framing. Embedded SRAM with FIFO control logic stages image lines without external frame buffers, reducing board mass - a direct benefit for smallsat platforms. Radiation tolerance is essential at sun-synchronous and polar orbits where trapped-proton fluence is high, and the antifuse fabric eliminates configuration-upset resets mid-image. A single device replacing multiple ASICs and SRAM-FPGA mitigation logic shortens qualification. The one-time-programmable constraint means the full imaging chain must be validated on PROTO silicon before flight-unit programming.
Recommended
Space-Grade Test and Validation Systems
Ground support equipment and radiation-test vehicles use the RTAX4000DL-1CQ352V to mirror flight logic exactly: because PROTO units share the flight parts' timing attributes, the same CQ352 footprint supports bench testers, beam-line SEU monitors, and thermal-vacuum test beds. The DL DSP fabric reproduces flight datapath behavior bit-accurately, letting test engineers inject stimulus and compare outputs against flight expectations. With 55,440 logic cells, one tester device can emulate multiple flight units plus instrumentation. Using engineering devices such as the RTAX4000SL-1CQ352E in test equipment preserves scarce flight-screened stock while retaining package-compatible sockets. Design the tester with independent clock domains per device under test so segmented clock resources isolate faults during destructive radiation runs.
Recommended
Recommended Products Summary
Engineering reference data for RTAX4000DL-1CQ352V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX4000D-CQ352V | RTAX4000DL-1CQ352B | RTAX4000S-1CQ352V | RTAX4000SL-1CQ352E | RTAX4000SL-CQ352PROTO |
|---|---|---|---|---|---|---|
| Package | CQ352 ceramic (352 contacts) | CQ352 ceramic - same | CQ352 ceramic - same | CQ352 ceramic - same | CQ352 ceramic - same | CQ352 non-hermetic prototype |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 |
| Logic Cells | 55,440 | 55,440 | 55,440 | 55,440 | 55,440 | 55,440 |
| CLBs | 36,960 | 36,960 | 36,960 | 36,960 | 36,960 | 36,960 |
| DSP Fabric | Yes (DL = RTAX-DSP) | No (D-series) | Yes (DL) | No (S-series) | No (SL-series) | No (SL-series) |
| Screening Level | V (flight) | V (flight) | B flow | V (flight) | E (engineering) | PROTO (validation) |
| Speed Grade | -1 | -1 | -1 | -1 | -1 | same timing as flight units |
| Configuration Technology | CMOS antifuse (OTP), live at power-up | Antifuse OTP | Antifuse OTP | Antifuse OTP | Antifuse OTP | Antifuse OTP |
Key Differentiators
- Embedded DSP multiply-accumulate fabric (vs RTAX4000D-CQ352V)
- Flight (V) screening in hermetic ceramic package (vs RTAX4000SL-CQ352PROTO)
- Maximum RTAX4000 logic organization in single chip (vs RTAX2000DL-1CQ352V)
- Antifuse live-at-power-up configuration (vs SRAM space FPGAs (cross-brand, e.g. Virtex-QV class))
Design Notes
The RTAX-DSP family is one-time programmable: once a flight unit is programmed, the bitstream is permanent. Per the Microchip datasheet, PROTO prototype units in non-hermetic ceramic packages carry the same timing attributes as flight RTAX-S/SL and RTAX-DSP units - use them (e.g., RTAX4000SL-CQ352PROTO) for full functional and timing validation before any flight-unit programming. Budget schedule time for this validate-then-program cycle; skipping it risks scrapping irreplaceable flight silicon.
Even though the antifuse configuration fabric is immune to configuration upset, user logic remains susceptible to single-event transients in combinatorial paths. Apply triple-modular redundancy (TMR) on critical registers and control state machines, and use the family's segmentable clock resources to isolate clock domains per function. Verify SEU mitigation strategy with Microchip radiation reports referenced on the RTAX4000DL product page before PDR sign-off.
The CQ352 ceramic column package requires a matching 352-pad land pattern with column-pitch tolerance control; confirm the land pattern from the Microchip package drawing rather than generic CGA footprints. Provide low-impedance core and I/O decoupling close to supply pins, and follow the power-supply sequencing guidance in the RTAX-S/SL and RTAX-DSP datasheet. Because the package is hermetic flight hardware, avoid reflow rework - design first-pass assembly processes around it.
Compliance Information
Space-grade hermetic ceramic device; no RoHS/REACH declarations found in verified web data. AEC-Q100 not applicable (space qualification regime, not automotive). Request manufacturer compliance certificates for mission documentation.