SCM605C2S2 - Nuvoton SoC LQFP-216 RoHS | Nuvoton
MPN: SCM605C2S2 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
SCM605C2S2 Overview
A system-on-chip integrates a processor core, memory controllers, peripheral interfaces, and often mixed-signal blocks onto a single die, sitting at the top of the semiconductor hierarchy: SoC -> integrated circuit -> semiconductor device. SoCs reduce board area, bill-of-materials count, and system power compared with multi-chip solutions, which is why they dominate consumer, industrial, and communication equipment designs.
. Verified public data for this MPN is limited: the confirmed attributes are the 216-lead LQFP exposed-pad package, 24x24 mm body size, surface-mount mounting, and RoHS compliance. Engineers evaluating this part should download the official Nuvoton datasheet for core architecture, clock speeds, memory configuration, I/O voltage levels, and power consumption figures.
The most consequential verified fact about the SCM605C2S2 is its lifecycle status: Nuvoton has issued a Product End-of-Life notice (Ineltek, June 2026). Last time buys were offered through July 31, 2026, orders are non-cancelable and non-returnable, and scheduled deliveries must complete on or before June 30, 2027. New designs should not adopt this part.
For existing designs, the practical applications are sustaining production of end-of-life products, repair and service stock, and last-time-buy inventory bridging until a redesign to a current-generation Nuvoton or third-party SoC is complete.
Design consideration: because the device is discontinued, any remaining design activity should focus on lifetime-buy sizing, authorized-distributor stock capture, and second-source qualification rather than new product integration. Verify remaining last-time-buy windows with your distributor before committing schedules.
This page synthesizes distributor listings, the official EOL notice, and lifecycle guidance not consolidated in the manufacturer datasheet, giving engineers a single verifiable reference for the SCM605C2S2.
Drop-in alternatives for SCM605C2S2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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| Manufacturer | Nuvoton Technology |
| Package | LQFP-216-EP (24x24 mm) |
| Mounting Type | Surface Mount (SMT) |
| RoHS Status | Compliant |
| Lifecycle Status | EOL - last time buy through 2026-07-31 |
| Final Delivery Deadline | 2027-06-30 |
| Order Terms | Non-cancelable, non-returnable |
| EOL Notice Date | 2026-06-15 |
SCM605C2S2 lqfp-216-ep (24x24 mm) Pin Configuration Guide
Pin configuration for SCM605C2S2 (lqfp-216-ep (24x24 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for SCM605C2S2.
Refer to the datasheet for full pin configuration.
Typical Applications
SCM605C2S2 is suitable for 6 applications: Legacy Product Sustainment, Repair and Service Inventory, Last-Time-Buy Bridge to Redesign, Consumer Electronics Platforms, Industrial Control Equipment, Embedded Networking Devices.
Legacy Product Sustainment
The primary remaining application for the SCM605C2S2 is sustaining production of end-products already designed around it. Because Nuvoton discontinued the device (EOL notice June 2026, last-time-buy through July 31, 2026, final delivery June 30, 2027), OEMs must size lifetime buys to cover the full remaining service life of their end products, including field-failure replacement demand. A common rule of thumb is to purchase the greater of two years of forecast production plus 2-3% service stock, subject to Nuvoton's right to limit last-time-buy quantities. Orders are non-cancelable and non-returnable, so forecast accuracy directly controls financial exposure.
Recommended
Repair and Service Inventory
Field-service organizations and contract manufacturers maintaining boards that use the SCM605C2S2 need a buffer of replacement devices for rework and repair. The LQFP-216-EP (24x24 mm) package requires a competent rework station with a 0.5 mm-pitch capable hot-air or vapor-phase profile; the exposed pad must be reflowed to the ground plane for reliable operation. Because the part is discontinued, service stock acquired now from residual authorized or documented broker inventory becomes the sole future source - authenticate incoming broker parts via marking, decap sampling on a statistical basis, and full traceability paperwork before accepting them into service inventory.
Recommended
Last-Time-Buy Bridge to Redesign
For product lines that cannot redesign immediately, SCM605C2S2 last-time-buy inventory serves as a bridge while a replacement SoC is qualified. A realistic bridge program spans 12-24 months: capture stock before the July 31, 2026 cutoff, qualify a migration device (a current Nuvoton SoC/MCU family member or an equivalent third-party SoC), and stagger the PCB respin so that new production transitions to the replacement part before bridge inventory is exhausted. Since Nuvoton limits last-time-buy quantities by capacity and material availability, orders should be placed early in the window and delivery scheduled as late as allowed (before June 30, 2027) to minimize holding cost.
Recommended
Consumer Electronics Platforms
The Nuvoton SCM605 SoC family historically targeted embedded control and consumer electronics platforms where an integrated SoC reduces BOM count versus discrete MCU-plus-peripheral solutions. In such systems the SCM605C2S2 functions as the main controller, with the 216-pin LQFP-EP providing sufficient I/O for display, keypad, audio, and communication interfaces. Verified public data does not enumerate the peripheral set, so engineers servicing these platforms should consult the official datasheet. For new consumer designs, an active Nuvoton MCU family with long-term availability commitments is strongly preferred given the confirmed discontinuation of this part and the absence of any drop-in successor.
Recommended
Industrial Control Equipment
Industrial controllers built on the SCM605C2S2 face the classic EOL dilemma: long field lifetimes (10-20 years) versus a component lifecycle far shorter than the equipment lifecycle. The LQFP-216-EP surface-mount package with exposed pad supports the thermal and vibration robustness expected in factory environments, but no supply exists beyond committed last-time-buy deliveries (due by June 30, 2027). Industrial OEMs should quantify remaining build quantities now, add the difference to lifetime-buy calculations, and initiate a form-fit-function migration study to an active-life-cycle SoC, budgeting for firmware porting, recertification, and a control-plan update at the contract manufacturer.
Recommended
Embedded Networking Devices
SoCs of the SCM605 class are used in embedded networking and communication equipment, where integrated peripherals handle data path and control functions. In these designs the SCM605C2S2 typically pairs with external DRAM, serial flash, PHY devices, and a system-power tree. Since the part is discontinued, networking equipment vendors should audit every board SKU using it, consolidate demand across SKUs into a single last-time-buy or residual-stock purchase, and qualify a pin-compatible or redesign replacement in parallel. The 24x24 mm LQFP-216 footprint means a mechanical-compatible but pin-different successor still requires a full schematic and layout update - plan at least one respin cycle in the migration schedule.
Recommended
Recommended Products Summary
Engineering reference data for SCM605C2S2 — comparison, design guidance, and compliance information.
Selection Guide
Design Notes
The single most important design consideration for the SCM605C2S2 is lifecycle risk, not electrical design. Per the Nuvoton EOL letter (June 15, 2026, via Ineltek), last-time-buy orders closed July 31, 2026, all orders are non-cancelable and non-returnable, and final deliveries must occur by June 30, 2027. Nuvoton reserves the right to limit quantities by capacity and material availability. Do not start any new design on this part, and do not treat broker stock as a reliable supply path without full authentication.
The LQFP-216-EP package has a 24x24 mm body and an exposed pad on the underside. For reliable assembly and thermal performance, the PCB footprint must include the exposed-pad land pattern connected to a ground plane via an array of thermal vias (typical practice: 0.3 mm vias on a ~1.2 mm grid, filled and capped where available). Follow the footprint dimensions in the official Nuvoton datasheet exactly - the exposed pad is often the primary ground return and omitting its connection can cause both thermal and signal-integrity failures.
No verified supply-voltage or power-consumption figures for the SCM605C2S2 were available in the retrieved data. Before any power-tree work - whether for a repair, respin, or migration - extract the core/IO voltage rails, sequencing requirements, and per-rail current limits directly from the official Nuvoton datasheet. When migrating to a replacement SoC, re-verify rail sequencing, because modern devices frequently add core rails or change sequencing order, which is a common cause of failed bring-up after EOL migrations.
Compliance Information
RoHS compliance stated in the JLCPCB Assembly listing (LQFP-216-EP(24x24) SMT ROHS). REACH, lead-free, halogen-free, and conflict-minerals statuses not stated in verified data.
