XC3S50-4CP132I - 50K-Gate Spartan-3 FPGA | Xilinx
MPN: XC3S50-4CP132I ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.1 | $2.10 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
XC3S50-4CP132I Overview
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and programmable I/O resources can be configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic device and a configurable semiconductor. Spartan-3 devices target cost-sensitive embedded systems where parallel logic, state machines, protocol handling, data acquisition, and modest control functions must fit into a compact board area.
The verified sources report 50,000 system gates and 192 configurable logic blocks. The DigiKey result for the closely identified XC3S50-4CPG132I also reports 73,728 registers and 1,728 logic cells, but those figures were not explicitly supplied for XC3S50-4CP132I and therefore are not treated as target specifications here. The target belongs to the Spartan-3 family and is suitable for consumer, automotive, industrial, telecommunications, communications-hardware, and embedded-control applications.
The CP132 package uses ball terminals and is identified by sources as TFBGA or CSPBGA. Because it is a fine-pitch, 132-terminal surface-mount package, PCB layout quality directly affects assembly yield and long-term reliability. Its approximately 8 mm square body demands exact land-pattern, solder-mask, stencil, and component-placement verification against the manufacturer package drawing before fabrication.
Typical designs use configurable logic for acquisition control, sensor conditioning, digital filtering, communications, industrial interfaces, and compact embedded systems. Unlike a microcontroller, this FPGA performs parallel operations in hardware and can achieve deterministic latency after configuration. Designers must still supply configuration memory or another supported configuration source, clocking, decoupling, I/O standards, and a valid power-distribution network.
The primary procurement caution is lifecycle and exact-ordering-code validation. Multiple distributors reported inventory in October 2026, but long-term availability should be confirmed for the production quantity rather than inferred from a single marketplace listing. Rochester Electronics reported 22.534 units and a starting unit price of $2.10, while another marketplace result reported 5,641 pieces; these figures are source-specific and should not be treated as guaranteed consolidated stock.
This page consolidates verified package, capacity, market-availability, and cross-reference information with a strict analysis of whether any candidate is truly drop-in compatible. Unlike a generic distributor listing, it also distinguishes exact evidence from unavailable electrical, pin-level, lifecycle, and certification details so engineers can identify what still requires manufacturer-documentation review.
Drop-in alternatives for XC3S50-4CP132I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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Request AlternativesXC3S50-4CP132I Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Product Family | Spartan-3 |
| System Gates | 50,000 gates |
| Configurable Logic Blocks | 192 CLBs |
| Maximum Frequency | 630 MHz |
| Process Technology | 90 nm |
| Performance Grade | Grade -4 |
| Temperature Grade | Industrial |
| Terminal Count | 132 terminals |
| Terminal Form | Ball |
| Package Code | TFBGA |
| Package Shape | Square |
| Package Length | 8 mm |
| Mounting Type | Surface Mount |
| Core Supply Voltage | 1.2 V |
XC3S50-4CP132I 8 mm Pin Configuration Guide
Pin configuration for XC3S50-4CP132I (8 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC3S50-4CP132I.
Refer to the datasheet for full pin configuration.
Typical Applications
XC3S50-4CP132I is suitable for 6 applications: Industrial Acquisition and Control, Communications Interface Logic, Embedded Signal Processing, Automotive Electronic Control, Consumer and Communications Hardware, Compact Embedded System Peripherals.
Industrial Acquisition and Control
The XC3S50-4CP132I fits parallel acquisition, sequencing, and machine-control logic where deterministic hardware operation is more useful than a software-only loop. Its verified 50,000 system gates and 192 configurable logic blocks provide a defined Spartan-3 implementation baseline, while the grade -4 designation supports designs already qualified around this performance class. Place control counters, state machines, data capture logic, and interface conditioning directly in the FPGA to reduce processor loading. The primary qualification step is to map every required signal to the exact 132-ball pinout and verify I/O voltage, direction, timing, and configuration state against the complete AMD/Xilinx documentation.
Recommended
Communications Interface Logic
The Spartan-3 XC3S50-4CP132I can implement parallel-to-serial conversion, packet framing, filtering, or protocol state machines when its 132 terminals and configurable logic are sufficient. The verified 630 MHz figure describes a maximum performance point from a comparison source and must not be treated as the guaranteed rate of an external interface. Engineers should establish timing closure with the actual speed grade, I/O standards, board topology, and target clock. For new or legacy protocol upgrades, confirm that the selected AMD/Xilinx toolchain supports the bitstream, configuration method, and legacy Spartan-3 device database before committing the design to production.
Recommended
Embedded Signal Processing
XC3S50-4CP132I can implement fixed digital filters, counters, correlation functions, and data-format conversion in parallel hardware when its 192 verified CLBs are adequate. Parallel FPGA logic can provide repeatable latency and avoid recurring processor overhead, but the supplied evidence does not expose complete block-RAM, DSP, or multiplier specifications. Therefore, calculate worst-case logic, memory, clock, and I/O utilization in the actual design rather than extrapolating from the 50,000-gate headline. If throughput exceeds the available resources, move to a larger density grade or add a companion processor without changing the surrounding board architecture unnecessarily.
Recommended
Automotive Electronic Control
The XC3S50-4CP132I is associated by verified sources with automotive applications, and its industrial ordering suffix is relevant to equipment outside the passenger compartment. A 90 nm, 50K-class programmable logic device can support sensor arbitration, actuator sequencing, diagnostics, and communication bridging when the exact automotive qualification requirements are satisfied. However, no AEC-Q100 status was supplied for this order code, so it cannot be assumed qualified for a safety- or high-reliability automotive program. Qualification should include environmental stress, supply-chain traceability, configuration-memory strategy, diagnostics, and exact operating-temperature limits from the manufacturer.
Recommended
Consumer and Communications Hardware
The XC3S50-4CP132I can serve as a compact logic engine in consumer accessories or communications hardware requiring reconfigurable parallel functions without the cost of a larger FPGA. Its 132-ball, approximately 8 mm square package limits board area, but the fine-pitch footprint increases assembly sensitivity. Production engineers must verify stencil apertures, solder-mask-defined pads, via-in-pad policy, component placement, and reflow profiles against the exact package drawing. Configuration storage, boot sequencing, clock startup, and field upgrade behavior also need early validation because the supplied search data does not establish a universal configuration-memory implementation for this MPN.
Recommended
Compact Embedded System Peripherals
XC3S50-4CP132I can implement bridges, protocol adapters, timer blocks, and glue logic around a host microcontroller in compact embedded systems. The Spartan-3 architecture permits deterministic parallel hardware behavior, while the 192 verified CLBs define a practical starting point for modest logic consolidation. A migration should not be attempted solely from gate count: compare available I/O, configuration pins, clock inputs, memory, voltage standards, and tool-generated pin constraints. The verified stock pages support initial sourcing, but exact operating-temperature and lifecycle classifications remain unresolved and should be confirmed before long-term production commitments.
Recommended
Recommended Products Summary
Engineering reference data for XC3S50-4CP132I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Package | 132-ball TFBGA/CSPBGA, approximately 8 mm square |
| Brand | Xilinx |
| Device Type | Field Programmable Gate Array (FPGA) |
| Product Family | Spartan-3 |
| System Gates | 50,000 gates |
| Configurable Logic Blocks | 192 CLBs |
| Maximum Frequency | 630 MHz |
| Process Technology | 90 nm |
| Performance Grade | Grade -4 |
| Temperature Designation | Industrial |
| Core Supply Voltage | 1.2 V |
| Terminal Count | 132 terminals |
Design Notes
Treat the CP132 package as a fine-pitch BGA layout problem. Use the exact AMD/Xilinx package drawing rather than the abbreviated TFBGA or CSPBGA search labels. Cross-check ball numbering, body size, solder-mask opening, pad geometry, assembly house capabilities, and stencil thickness before release. The supplied data identifies 132 terminals and an approximately 8 mm square body, but it does not provide verified coordinates or a pin map.
Validate every power, ground, configuration, clock, and user-I/O connection against the complete manufacturer pinout and DC electrical specification. The comparison evidence reports a 1.2 V core supply, but I/O supply ranges and current limits are unavailable. Place regulator outputs and decoupling where the package drawing and layout guidance require them, then keep sensitive clock and configuration paths away from switching nodes. Do not infer rails solely from the package code.
Do not substitute XC3S50-4CPG132I or XC3S50-5CPG132C solely because their listings use 132-TFBGA notation. Equal nominal dimensions do not prove identical balls, supplies, I/O standards, timing grade, temperature class, or configuration behavior. Obtain the package drawings and compare every constrained pin, power rail, startup state, and timing specification. Run synthesis, implementation, and timing analysis with the exact replacement device before approving it as drop-in.
Plan configuration and clock startup before committing the board layout. The supplied data does not identify the supported configuration memory or boot interface, so those connections cannot be designed from this page. Obtain the exact configuration guideline, define deterministic reset and startup states, and isolate configuration lines from aggressive adjacent signals. If using an external PROM or processor-assisted configuration, verify voltage compatibility and documented write-enable or programming signals.
Compliance Information
The supplied web results do not extract target-specific RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. Industrial temperature designation alone must not be interpreted as automotive qualification.
