AMD

XC7K70T-2FBG676I - Kintex-7 FPGA 65600 Cells | AMD

MPN: XC7K70T-2FBG676I βœ“ Active
In Stock Ships in 1-3 business days
1V Vdss LVCMOS, LVDS, HSTL, SSTL Rds(on) 676-BBGA, FCBGA Package -2 Speed
From $19 USD / Unit
MOQ: 1 |
Price updated: 2026-08-20
Volume Pricing
Qty Unit Price Extended
1 $28.87 $28.87
10 $26.5 $265.00
100 $24 $2,400.00
500 $21.5 $10,750.00
1,000 $19 $19,000.00
ℹ️ All prices are in USD

Drop-in alternatives for XC7K70T-2FBG676I β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

XC7K70T-1FBG676I

βœ… Drop-In
πŸ“¦ 676-BBGA, FCBGA
Lower speed grade (-1 vs -2)

πŸ“‹ Reference alternative (not in catalog)

XC7K70T-3FBG676I

βœ… Drop-In
πŸ“¦ 676-BBGA, FCBGA
Higher speed grade (-3 vs -2)

πŸ“‹ Reference alternative (not in catalog)

XC7K70T-2FBG676C

βœ… Drop-In
πŸ“¦ 676-BBGA, FCBGA
Commercial temperature grade (0C to +85C) vs industrial (-40C to +100C)

πŸ“‹ Reference alternative (not in catalog)

XC7K70T-2FBG676E

βœ… Drop-In
πŸ“¦ 676-BBGA, FCBGA
Extended temperature grade (0C to +100C) vs industrial

πŸ“‹ Reference alternative (not in catalog)

XC7K70T-2FBG676I

βœ… Drop-In
AMD
πŸ“¦ 676-BBGA, FCBGA
Kintex-7 Β· 65600 Β· 300 Β· 4976640 bits Β· 240 Β· 5 Β· 28nm Β· 1V

βœ“ In Stock

$19 / Unit

View Datasheet β†’

XC7K70T-2FBG676I Maximum Ratings & Electrical Characteristics

Family Kintex-7
Logic Cells 65600
Number of I/Os 300
Block RAM 4976640 bits
DSP Slices 240
CMTs 5
Technology 28nm
Core Voltage 1V
Package 676-BBGA, FCBGA
Mounting Type Surface Mount
Operating Temperature -40C to +100C
RoHS Status Compliant
Speed Grade -2
Configuration Interfaces JTAG, SelectMAP, SPI
I/O Standards LVCMOS, LVDS, HSTL, SSTL

XC7K70T-2FBG676I Pin Configuration

Electronic Component Package Diagram Default generic electronic component package diagram 1 2 3 Package
Pin A1 IO_L1P_T0 β€” User I/O bank 0
Pin A2 IO_L1N_T0 β€” User I/O bank 0
Pin B1 IO_L2P_T0 β€” User I/O bank 0
Pin B2 IO_L2N_T0 β€” User I/O bank 0
Pin C1 IO_L3P_T0 β€” User I/O bank 0
Pin C2 IO_L3N_T0 β€” User I/O bank 0
Pin D1 IO_L4P_T0 β€” User I/O bank 0
Pin D2 IO_L4N_T0 β€” User I/O bank 0
Pin E1 IO_L5P_T0 β€” User I/O bank 0
Pin E2 IO_L5N_T0 β€” User I/O bank 0
Pin F1 IO_L6P_T0 β€” User I/O bank 0
Pin F2 IO_L6N_T0 β€” User I/O bank 0

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for XC7K70T-2FBG676I Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC7K70T-2FBG676I is suitable for 6 applications: Software-Defined Radio, Medical Imaging, Aerospace and Defense, High-Performance Computing, Wired Communications, Test and Measurement.

πŸ“‘

Software-Defined Radio

The XC7K70T-2FBG676I is ideal for software-defined radio (SDR) systems due to its 240 DSP48E1 slices and high-speed transceivers. It can handle complex modulation schemes and digital down/up conversion. The 300 I/Os allow interfacing with multiple ADCs and DACs. Its 28nm technology provides low power consumption, essential for portable SDR units. The FPGA's reconfigurability enables over-the-air updates and multi-standard support.

πŸ’Š

Medical Imaging

In medical imaging systems like ultrasound and CT scanners, the XC7K70T-2FBG676I provides the necessary DSP bandwidth for image processing. Its 240 DSP slices accelerate filtering and beamforming algorithms. The 4,976,640 bits of block RAM support frame buffering. The industrial temperature grade ensures reliability in clinical environments. The FPGA's parallel processing capability enables real-time image enhancement.

✈️

Aerospace and Defense

The XC7K70T-2FBG676I is suitable for aerospace and defense applications such as radar and secure communications. Its 28nm technology offers high performance with low power, critical for airborne systems. The device supports radiation-tolerant configurations with proper mitigation. The 300 I/Os allow interfacing with various sensors and communication links. AMD's long-term supply commitment ensures availability for defense programs.

πŸ–₯️

High-Performance Computing

For high-performance computing (HPC) accelerators, the XC7K70T-2FBG676I offers 240 DSP slices and 65,600 logic cells for parallel processing. It can be used for data compression, encryption, and machine learning inference. The 4,976,640 bits of block RAM provide on-chip storage for frequently accessed data. The FPGA's reconfigurability allows algorithm updates without hardware changes. Its 1V core voltage reduces power consumption in data centers.

🌐

Wired Communications

In wired communication systems like switches and routers, the XC7K70T-2FBG676I provides high-speed serial transceivers and flexible I/O. It can implement packet processing, traffic management, and protocol conversion. The 300 I/Os support various memory interfaces and network PHYs. The FPGA's low latency is essential for real-time packet forwarding. Its 28nm technology balances performance and power for line-card designs.

πŸ”§

Test and Measurement

The XC7K70T-2FBG676I is used in test and measurement equipment like oscilloscopes and logic analyzers. Its high-speed I/Os and DSP capabilities enable signal acquisition and analysis. The 240 DSP slices accelerate FFT and filtering operations. The FPGA's reconfigurability allows firmware updates to add new measurement features. The industrial temperature grade ensures stable operation in lab environments.

Recommended Products Summary

AD9361 RF transceiver for SDR Used in: Software-Defined Radio XC7Z020 AMD Used in: Software-Defined Radio, Aerospace and Defense, High-Performance Computing AD9279 Octal LNA/VGA/ADC for ultrasound Used in: Medical Imaging STM32F746BET6 STMicroelectronics Used in: Medical Imaging, Test and Measurement AD9653 Quad ADC for radar Used in: Aerospace and Defense MT40A512M16JY-075E Micron Technology Used in: High-Performance Computing, Wired Communications SFP+ Optical transceiver module Used in: Wired Communications ADC12DJ3200 High-speed ADC for signal acquisition Used in: Test and Measurement
What is the price of XC7K70T-2FBG676I?
As of 2026-08-21, the XC7K70T-2FBG676I is priced at $28.87 for single-unit purchases, with volume discounts available. According to LCSC Electronics, the price starts at $28.8731. For bulk quantities, prices can drop to around $19.00 at 1000 units. Availability is in stock at major distributors like DigiKey and Mouser.
Where can I buy XC7K70T-2FBG676I online?
The XC7K70T-2FBG676I can be purchased from authorized distributors including DigiKey, Mouser, LCSC, and Avnet. DigiKey lists it as 'ships today' with stock available. LCSC offers it for $28.8731. Always verify stock and pricing on the distributor's website as of 2026-08-21.
What is the lead time for XC7K70T-2FBG676I?
The lead time for XC7K70T-2FBG676I varies by distributor and order quantity. As of 2026-08-21, DigiKey indicates it ships today for in-stock items. For larger orders, lead times may extend to 4-6 weeks. Check with your preferred distributor for current lead time estimates.
Is XC7K70T-2FBG676I in stock?
Yes, the XC7K70T-2FBG676I is in stock at multiple distributors as of 2026-08-21. DigiKey shows it as 'ships today', and LCSC lists it as in-stock. Mouser also has inventory. For real-time stock levels, visit the distributor websites.
What is the difference between XC7K70T-2FBG676I and XC7A100T?
The XC7K70T-2FBG676I is a Kintex-7 FPGA with 65,600 logic cells, while the XC7A100T is an Artix-7 FPGA with 101,440 logic cells. The Kintex-7 offers higher performance and more DSP slices (240 vs 240), but the Artix-7 has more logic cells. They are not pin-compatible due to different packages and pinouts.
When should I choose XC7K70T-2FBG676I over XC7A100T?
Choose the XC7K70T-2FBG676I when you need the higher performance and DSP capabilities of the Kintex-7 family, especially for signal processing and high-speed applications. The XC7A100T is better for logic-intensive designs with lower cost. The XC7K70T operates at 1V core voltage and has 300 I/Os, while the XC7A100T has 210 I/Os in a smaller package.
What is the best drop-in replacement for XC7K70T-2FBG676I?
The best drop-in replacement for XC7K70T-2FBG676I is the XC7K70T-1FBG676I, which shares the same package and pinout but has a lower speed grade. The XC7K70T-2FBG676I is the -2 speed grade, while the -1 is slower. For a higher performance option, the XC7K70T-3FBG676I is also pin-compatible. All are in the same Kintex-7 family.
Can XC7K70T-2FBG676I replace XC7K70T-1FBG676I?
Yes, the XC7K70T-2FBG676I can replace the XC7K70T-1FBG676I as they are pin-compatible and share the same package. The -2 speed grade offers faster performance, so it is a drop-in upgrade. Ensure your design can handle the faster timing and any power differences.
Where can I download the XC7K70T-2FBG676I datasheet PDF?
The XC7K70T-2FBG676I datasheet is available from AMD's website. The 7 Series FPGAs Overview datasheet (DS180) covers the family specifications. For detailed pinout and package files, visit AMD's Kintex-7 package pinout files page. Distributors like DigiKey and Mouser also provide datasheet links.
Where can I find the XC7K70T-2FBG676I pinout?
The pinout for XC7K70T-2FBG676I is available in AMD's package pinout files, which can be downloaded from the Kintex-7 package device pinout files page. The files are in ASCII TXT and CSV formats, as described in UG475. These files provide the exact pin assignments for the 676-pin FCBGA package.
What are the key specifications of XC7K70T-2FBG676I that engineers should know?
The XC7K70T-2FBG676I is a Kintex-7 FPGA with 65,600 logic cells, 300 user I/Os, 4,976,640 bits of block RAM, and 240 DSP48E1 slices. It operates at a core voltage of 1V and is built on 28nm technology. The device includes 5 clock management tiles (CMTs) with MMCM and PLL. It comes in a 676-pin lidless FCBGA package and supports various I/O standards.
What is the best Intel equivalent for XC7K70T-2FBG676I?
The Intel (Altera) equivalent to the XC7K70T-2FBG676I is the Cyclone V or Arria V series. Specifically, the 5CEFA7F31I7N is a comparable FPGA with similar logic density and I/O count. However, they are not pin-compatible and require a different PCB layout. For a drop-in replacement, stick with AMD's Kintex-7 family.
Hey Google, what can replace XC7K70T-2FBG676I?
The XC7K70T-2FBG676I can be replaced by other Kintex-7 FPGAs with the same package, such as the XC7K70T-1FBG676I (slower) or XC7K70T-3FBG676I (faster). These are pin-compatible drop-in replacements. For a different brand, you would need to redesign the PCB as no cross-brand FPGA is pin-compatible.
Is XC7K70T-2FBG676I the same as XC7K70T-1FBG676I?
No, the XC7K70T-2FBG676I and XC7K70T-1FBG676I are not the same. The difference is the speed grade: -2 indicates a faster speed grade than -1. They are pin-compatible and share the same package, but the -2 version has higher maximum clock frequencies. Both are part of the Kintex-7 family.

Engineering reference data for XC7K70T-2FBG676I β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the XC7K70T-2FBG676I when you need a mid-range Kintex-7 FPGA with industrial temperature range and -2 speed grade. It is ideal for applications requiring high DSP performance and 300 I/Os. If you need lower cost and can tolerate slower speed, select the -1 version. For maximum performance, choose the -3 version. For commercial temperature environments, the -2FBG676C is a cost-effective option. All alternatives are pin-compatible, allowing easy PCB reuse.

Comparison with Alternatives

Parameter This Product XC7K70T-1FBG676I XC7K70T-3FBG676I XC7K70T-2FBG676C
Package 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA
Brand AMD AMD AMD AMD
Speed Grade -2 -1 -3 -2
Temperature Grade Industrial (-40C to +100C) Industrial Industrial Commercial (0C to +85C)
Logic Cells 65600 65600 65600 65600
Block RAM 4976640 bits 4976640 bits 4976640 bits 4976640 bits
DSP Slices 240 240 240 240
I/O Count 300 300 300 300

Key Differentiators

  • Higher speed grade than -1 (vs XC7K70T-1FBG676I)
  • Industrial temperature grade (vs XC7K70T-2FBG676C)
  • Balanced performance and cost (vs XC7K70T-3FBG676I)

Design Notes

The XC7K70T-2FBG676I requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCO depending on I/O banks. Use a dedicated power management IC to sequence these rails. Decouple each rail with 100nF and 10uF capacitors near the FPGA pins. Refer to the 7 Series FPGAs Power Management User Guide (UG473) for detailed recommendations.

The lidless FCBGA package requires a heatsink for high-power designs. The thermal resistance (theta_JA) is approximately 10 C/W without airflow. For a 5W design, the junction temperature rise is 50C above ambient. Ensure adequate airflow or a heatsink to keep junction temperature below 100C. Use thermal interface material between the die and heatsink.

For the 676-pin FCBGA, use a high-layer-count PCB (at least 8 layers) for routing. Follow AMD's PCB design guidelines in UG483. Place decoupling capacitors on the bottom side of the board directly under the FPGA. Use via-in-pad for power and ground connections. Ensure controlled impedance for high-speed signals.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per AMD product page. Not AEC-Q100 qualified as it is not an automotive part.

Data verified on: 2026-08-21
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