XC7K410T-1FFG676C - Kintex-7 FPGA 406K Logic Cells | AMD
MPN: XC7K410T-1FFG676C β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1051.9 | $1,051.90 |
| 10 | $998.5 | $9,985.00 |
| 100 | $945.2 | $94,520.00 |
| 500 | $892.8 | $446,400.00 |
| 1,000 | $840.5 | $840,500.00 |
Drop-in alternatives for XC7K410T-1FFG676C β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7K410T-2FFG676C
β Drop-Inπ Reference alternative (not in catalog)
XC7K410T-1FFG676I
β Drop-Inπ Reference alternative (not in catalog)
XC7K410T-2FFG676I
β Drop-Inπ Reference alternative (not in catalog)
XC7K325T-2FFG676C
β Drop-Inπ Reference alternative (not in catalog)
XC7K480T-2FFG676C
β Drop-Inπ Reference alternative (not in catalog)
XC7K410T-1FFG676C Maximum Ratings & Electrical Characteristics
| Family | Kintex-7 |
| Logic Cells | 406720 |
| Number of I/O | 400 |
| Block RAM | 29306880 bits |
| DSP Slices | 1540 |
| Package | 676-BBGA, FCBGA |
| Technology | 28nm |
| Core Voltage | 1.0V |
| Speed Grade | -1 |
| Operating Temperature | 0C to +85C |
| Mounting Type | Surface Mount |
| Number of Terminals | 676 |
| Package Shape | Square |
| Terminal Form | Ball |
| RoHS Status | Compliant |
XC7K410T-1FFG676C Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O differential pair positive |
| Pin A2 | IO_L1N_T0 β User I/O differential pair negative |
| Pin B1 | VCCINT β Internal core voltage 1.0V |
| Pin B2 | GND β Ground |
| Pin C1 | IO_L2P_T0 β User I/O differential pair positive |
| Pin C2 | IO_L2N_T0 β User I/O differential pair negative |
| Pin D1 | VCCAUX β Auxiliary voltage 1.8V |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T0 β User I/O differential pair positive |
| Pin E2 | IO_L3N_T0 β User I/O differential pair negative |
| Pin F1 | VCCBRAM β Block RAM voltage 1.0V |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7K410T-1FFG676C is suitable for 6 applications: Wired Communications, Broadcast and Video Processing, Aerospace and Defense, High-Performance Computing, Medical Imaging, Wireless MIMO Base Stations.
Wired Communications
The XC7K410T-1FFG676C excels in wired communications equipment such as switches, routers, and line cards. Its 400 I/O pins and support for 10 Gigabit Ethernet enable high-speed data processing. The 1,540 DSP slices handle complex packet processing and traffic management algorithms. The 29.3 Mb of block RAM provides ample buffering for network queues. The -1 speed grade balances performance and power, making it suitable for cost-sensitive networking gear. Designers can implement flexible MAC and PHY layers, while the FPGA's reconfigurability allows protocol updates without hardware changes.
Recommended
Broadcast and Video Processing
In broadcast and video processing, the XC7K410T-1FFG676C provides the logic density and DSP capability needed for real-time video encoding, decoding, and format conversion. The 406,720 logic cells accommodate complex video pipelines, while the 1,540 DSP slices accelerate filtering and scaling operations. The 400 I/O pins interface with multiple video standards including SDI and HDMI. The 29.3 Mb block RAM supports line buffering and frame storage. The commercial temperature range suits studio environments. The FPGA's parallel processing architecture delivers the throughput required for 4K and 8K video streams.
Recommended
Aerospace and Defense
The XC7K410T-1FFG676C is well-suited for aerospace and defense applications such as radar, electronic warfare, and secure communications. Its 28nm technology provides high performance with manageable power consumption, critical for embedded systems. The 1,540 DSP slices enable sophisticated signal processing for radar beamforming and target detection. The 400 I/O pins interface with various sensors and data links. The FPGA's reconfigurability allows in-field updates for evolving mission requirements. The commercial temperature grade is suitable for many ground-based systems, while the -I variant supports extended temperature environments.
Recommended
High-Performance Computing
In high-performance computing, the XC7K410T-1FFG676C accelerates compute-intensive workloads through hardware parallelism. The 406,720 logic cells implement custom accelerators for scientific simulations, financial modeling, and data analytics. The 1,540 DSP slices provide high-throughput floating-point and fixed-point arithmetic. The 29.3 Mb block RAM supports local data caching, reducing external memory bandwidth demands. The 400 I/O pins connect to high-speed memory interfaces and interconnects. The -1 speed grade offers a balanced performance point for compute acceleration, while the FCBGA package ensures good thermal performance under sustained load.
Recommended
Medical Imaging
The XC7K410T-1FFG676C is ideal for medical imaging systems such as ultrasound, CT, and MRI. The 1,540 DSP slices accelerate image reconstruction and enhancement algorithms, while the 406,720 logic cells implement complex processing pipelines. The 400 I/O pins interface with high-speed ADCs and DACs. The 29.3 Mb block RAM supports image buffering and intermediate storage. The FPGA's parallel processing enables real-time imaging with low latency. The commercial temperature range suits clinical environments. The device's reconfigurability allows algorithm updates for new imaging modalities without hardware redesign.
Recommended
Wireless MIMO Base Stations
The XC7K410T-1FFG676C is well-suited for wireless MIMO base stations, offering high DSP ratios for beamforming and signal processing. The 1,540 DSP slices handle complex matrix operations for MIMO precoding and decoding. The 406,720 logic cells implement the baseband processing chain, including channel estimation and error correction. The 400 I/O pins connect to multiple RF transceivers. The 29.3 Mb block RAM supports buffering of multiple data streams. The -1 speed grade provides sufficient performance for LTE and 5G NR baseband processing while managing power consumption in remote radio heads.
Recommended
Engineering reference data for XC7K410T-1FFG676C β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7K410T-2FFG676C | XC7K410T-1FFG676I | XC7K410T-2FFG676I | XC7K325T-2FFG676C | XC7K480T-2FFG676C |
|---|---|---|---|---|---|---|
| Package | 676-BBGA, FCBGA | 676-BBGA, FCBGA - same | 676-BBGA, FCBGA - same | 676-BBGA, FCBGA - same | 676-BBGA, FCBGA - same | 676-BBGA, FCBGA - same |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 406720 | 406720 | 406720 | 406720 | 326080 | 477760 |
| Number of I/O | 400 | 400 | 400 | 400 | 400 | 400 |
| Block RAM | 29306880 bits | 29306880 bits | 29306880 bits | 29306880 bits | 16020000 bits | 38304000 bits |
| DSP Slices | 1540 | 1540 | 1540 | 1540 | 840 | 1920 |
| Speed Grade | -1 | -2 | -1 | -2 | -2 | -2 |
| Operating Temperature | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C |
Key Differentiators
- Higher logic density than XC7K325T (vs XC7K325T-2FFG676C)
- More DSP slices than XC7K325T (vs XC7K325T-2FFG676C)
- Lower cost than XC7K480T (vs XC7K480T-2FFG676C)
Design Notes
The XC7K410T-1FFG676C requires a robust power delivery network. The core voltage (VCCINT) is 1.0V and must be regulated tightly, typically within +/-3%. Use multiple low-ESR ceramic capacitors (0.1uF and 1uF) placed close to the VCCINT pins to handle transient currents. The auxiliary voltage (VCCAUX) is 1.8V and should be decoupled similarly. Refer to the AMD Kintex-7 power management application notes for detailed recommendations.
The 676-ball FCBGA package has an exposed pad that must be soldered to a thermal via array on the PCB for effective heat dissipation. The maximum junction temperature is 85C for the commercial grade. Calculate the power dissipation based on your design's logic utilization and clock frequency, then ensure the thermal resistance of your PCB and any heatsink keeps the junction temperature within limits. For high-utilization designs, consider forced-air cooling.
For high-speed serial transceivers and memory interfaces, maintain controlled impedance traces and minimize stub lengths. Use ground planes beneath all high-speed signal layers. The FCBGA package requires a fan-out pattern with microvias or blind vias for dense routing. Follow the AMD PCB design guidelines in UG483 for proper decoupling capacitor placement and power plane partitioning.
Compliance Information
RoHS compliance indicated by distributor listings. Other compliance data not explicitly provided in verified web data.
