XCKU5P-1SFVB784I - 474,600-Cell Kintex UltraScale+ FPGA | AMD
MPN: XCKU5P-1SFVB784I ✓ ActiveXCKU5P-1SFVB784I Overview
A field-programmable gate array, or FPGA, is a programmable semiconductor in which the digital logic, interconnect, and many digital peripherals are configured after manufacture. Within the product hierarchy, the XCKU5P-1SFVB784I is a Kintex UltraScale+ FPGA, an FPGA and CPLD device, an integrated circuit, and ultimately a semiconductor. Its combination of logic resources, block RAM, programmable I/O, and a large BGA package supports parallel data processing, high-throughput interfaces, and embedded control functions.
The device provides 304 user I/O, 474,600 logic cells, 27,120 LABs/CLBs, and 41,984,000 total RAM bits. These resources allow substantial parallel processing and data buffering within one programmable device. Its 784-FCBGA package provides the interconnect density required by this Kintex UltraScale+ configuration, while the listed 23 mm by 23 mm package dimensions support high-density board layouts that require careful escape-routing and thermal planning.
The -1 designation identifies the device speed grade, making this MPN appropriate when the design requires the -1 operating class rather than a faster grade. A configurable supply range of 0.825 V to 0.876 V applies to the core-supply specification reported for this exact device. Engineers must use the UltraScale package pinout files and device documentation when assigning power rails, configuring banks, and implementing the 784-position land pattern.
Typical applications include industrial automation, high-speed data acquisition, signal processing, communications infrastructure, embedded vision, and accelerator-style parallel processing. The large logic and RAM resources are especially useful where multiple independent pipelines must operate concurrently, while the 304 user I/O can reduce the need for external interface logic when the board-level pin plan supports the device’s bank architecture.
A critical design consideration is the 784-FCBGA footprint. High-density escape routing, via-in-pad requirements where specified, power-plane segmentation, decoupling, and the exposed thermal-management strategy must be designed together. Device configuration, bitstream generation, and pin constraints should be checked against the package-specific UltraScale documentation before schematic or PCB signoff.
This product page organizes the exact device identity, core capacity, memory, I/O count, package details, pinout resources, and practical configuration considerations into one engineering reference. It also distinguishes true same-package replacement options from broader FPGA alternatives, helping design teams assess speed-grade, temperature-grade, and supply compatibility before committing a 784-FCBGA layout.
Drop-in alternatives for XCKU5P-1SFVB784I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
XCKU5P-1SFVB784C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XCKU5P-2SFVB784I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XCKU5P-3SFVB784I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XCKU5P-2SFVB784C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XCKU5P-3SFVB784C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
XCKU5P-1SFVB784I Maximum Ratings & Electrical Characteristics
| Device Type | Kintex UltraScale+ Field Programmable Gate Array (FPGA) |
| Logic Cells | 474,600 cells |
| LABs/CLBs | 27,120 LABs/CLBs |
| Total RAM | 41,984,000 bits |
| User I/O | 304 I/O |
| Supply Voltage | 0.825 V to 0.876 V |
| Speed Grade | -1 |
| Operating Temperature | -40°C to 100°C (TJ) |
| Package | 784-FCBGA |
| Package Dimensions | 23 mm x 23 mm |
| Mounting Type | Surface Mount |
| Series | Kintex UltraScale+ |
| Lifecycle Status | Active |
| Programmable Logic Type | FPGA |
| Manufacturer | AMD/Xilinx |
| Number of Pins | 784 pins |
XCKU5P-1SFVB784I 23 mm x 23 mm Pin Configuration Guide
Pin configuration for XCKU5P-1SFVB784I (23 mm x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XCKU5P-1SFVB784I.
Refer to the datasheet for full pin configuration.
Typical Applications
XCKU5P-1SFVB784I is suitable for 6 applications: Industrial Automation Controllers, High-Speed Data Acquisition, Communications Signal Processing, Machine Vision Processing, Aerospace and Defense Signal Processing, Network and Storage Infrastructure.
Industrial Automation Controllers
The XCKU5P-1SFVB784I fits high-end industrial controllers that coordinate multiple real-time control loops while retaining substantial local data storage. Its 474,600 logic cells support parallel control and datapath logic, while 41,984,000 RAM bits accommodate buffers, state machines, and diagnostic histories. The 304 user I/O provide broad connectivity for sensors, actuators, counters, and communications interfaces. The -40°C to 100°C junction-temperature specification suits equipment intended for extended industrial environments, subject to the complete system thermal design. A 784-FCBGA implementation requires careful power delivery, signal escape routing, and thermal management, but it gives an automation platform considerable resource headroom without requiring multiple programmable devices.
High-Speed Data Acquisition
The XCKU5P-1SFVB784I is suited to parallel data-acquisition systems that must ingest multiple channels and perform filtering or channelization in programmable logic. Its 27,120 LABs/CLBs and 41,984,000 RAM bits can support concurrent pipelines, packetization, and temporary sample storage. The 304 user I/O make the device useful for wide parallel interfaces, provided the selected I/O standards and bank constraints are compatible with the acquisition architecture. The -1 speed grade offers a defined timing class for systems whose channel rate does not require the faster -2 or -3 grades. Because the device uses a 784-FCBGA package, designers should follow the AMD package pinout and reference-layout guidance for high-speed escape routing and synchronized supply distribution.
Communications Signal Processing
The XCKU5P-1SFVB784I can serve as the programmable processing core in communications equipment requiring parallel transforms, framing logic, buffers, and interface adaptation. Its 474,600 logic cells allow substantial independent processing lanes, while 41,984,000 RAM bits support symbol buffers, packet queues, and timing histories. The 304 I/O provide extensive connectivity for parallel buses and physical-layer interfaces when their electrical standards are compatible with the device banks. For line-rate designs, engineers should evaluate the target interface against the -1 speed grade rather than assuming the faster family members provide excess margin. Board implementation must account for the 23 mm by 23 mm 784-FCBGA footprint, including controlled impedance, clean return paths, and power planes that remain stable under high activity.
Machine Vision Processing
The XCKU5P-1SFVB784I is appropriate for machine-vision systems that perform pixel-level processing, feature extraction, or image-channel transformation in parallel. The device's 474,600 logic cells can implement multiple concurrent stages, and 41,984,000 RAM bits provide line buffers or working memory for high-throughput pipelines. Its 304 user I/O support camera, memory, and network interfaces when the required protocols map to compatible I/O standards. The -1 speed grade should be checked against the frame rate, pixel clock, and selected external memory timing. A robust implementation also needs careful clocking, power sequencing, and thermal design around the dense 784-FCBGA package. This combination makes the FPGA useful when fixed-function vision processing is insufficient and programmable parallelism is required.
Aerospace and Defense Signal Processing
The XCKU5P-1SFVB784I can support programmable signal-processing and control functions in aerospace, defense, and other demanding embedded systems. Its large logic and RAM resources allow multiple filters, protocol engines, and timing functions to operate concurrently, while the -40°C to 100°C junction-temperature range supports temperature-qualified equipment designs. The exact ordering code must undergo the organization-specific qualification, radiation, reliability, and traceability process before deployment; the commercial alternatives in this list do not automatically satisfy those requirements. Designers should use the exact package and device files for pinout, configuration, and power planning, and should treat security, bitstream, and obsolescence controls as separate program requirements.
Network and Storage Infrastructure
The XCKU5P-1SFVB784I is useful in network appliances, storage controllers, and packet-processing platforms that combine high logic density with embedded buffer capacity. The 27,120 LABs/CLBs can implement parallel packet handling or storage transaction logic, while 41,984,000 RAM bits support queues and data staging without requiring a separate large buffer component in every design. Its 304 I/O allow direct attachment to buses and specialized interfaces when bank rules permit. In sustained-throughput products, power integrity and thermal performance are as important as logic utilization, so the 784-FCBGA land pattern should follow AMD's reference layout. The selected -1 grade should also be validated against worst-case timing rather than relying on nominal performance.
Engineering reference data for XCKU5P-1SFVB784I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCKU5P-1SFVB784C | XCKU5P-2SFVB784I | XCKU5P-3SFVB784I | XCKU5P-2SFVB784C | XCKU5P-3SFVB784C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 784-FCBGA (23x23) | 784-FCBGA (23x23) - same | 784-FCBGA (23x23) - same | 784-FCBGA (23x23) - same | 784-FCBGA (23x23) - same | 784-FCBGA (23x23) - same |
| Device Family | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ |
| Speed Grade | -1 | -1 | -2 | -3 | -2 | -3 |
| Temperature Grade | Industrial | Commercial | Industrial | Industrial | Commercial | Commercial |
| Logic Cells | 474,600 cells | 474,600 cells | 474,600 cells | 474,600 cells | 474,600 cells | 474,600 cells |
| LABs/CLBs | 27,120 LABs/CLBs | 27,120 LABs/CLBs | 27,120 LABs/CLBs | 27,120 LABs/CLBs | 27,120 LABs/CLBs | 27,120 LABs/CLBs |
| Total RAM | 41,984,000 bits | 41,984,000 bits | 41,984,000 bits | 41,984,000 bits | 41,984,000 bits | 41,984,000 bits |
| User I/O | 304 I/O | 304 I/O | 304 I/O | 304 I/O | 304 I/O | 304 I/O |
Key Differentiators
- Closest same-family option with unchanged speed grade (vs XCKU5P-1SFVB784C)
- Higher speed class without changing the package (vs XCKU5P-2SFVB784I)
- Highest listed same-package speed option (vs XCKU5P-3SFVB784I)
Design Notes
Treat the 784-FCBGA escape-routing problem as a complete layout task rather than an extension of a smaller BGA design. Use the AMD UltraScale package files to establish the exact pad coordinates and follow the applicable reference layout for power, ground, and signal escape paths. A single via at each BGA pad may fail inspection or assembly rules unless the package construction explicitly permits it; plan via-in-pad construction, solder-mask definition, and assembly capability before releasing artwork.
Build the power tree around the exact 0.825 V to 0.876 V core-supply specification and every auxiliary rail required by the selected UltraScale device configuration. Separate noisy and sensitive supply paths where the device guidance permits, place high-frequency decoupling close to the package, and verify voltage droop during maximum logic activity. The 474,600 logic cells and 41,984,000 RAM bits create substantial switching capacity, so adequate plane area and current capacity are essential even when the measured average power appears moderate.
Do not evaluate thermal performance from the 23 mm by 23 mm package outline alone. The 784-FCBGA construction and exact device speed grade determine how heat leaves the silicon, and system airflow, board area, copper layers, and neighboring heat sources all affect junction temperature. Follow the AMD thermal guidance for the selected package and verify that the -40°C to 100°C junction-temperature range is maintained under worst-case ambient, utilization, and neighboring-device conditions.
Do not treat a same-package MPN as automatically interchangeable. The speed-grade alternatives have different timing classes, while commercial-temperature alternatives may not satisfy the target's industrial thermal requirement. Review the device speed grade, temperature grade, I/O standards, configuration security requirements, and power characteristics for the exact ordering code. After substitution, rerun timing analysis and confirm that the programmed bitstream remains valid for the selected device.
Compliance Information
The exact ordering code is identified as an industrial-temperature Kintex UltraScale+ FPGA. RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations require confirmation from current AMD regulatory documentation. No AEC-Q100 qualification is indicated for this ordering code.
