5CSEBA2U19C7N - Cyclone V SE SoC FPGA, 25K LE, Dual ARM Cortex-A9 | Intel
MPN: 5CSEBA2U19C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.4 | $22.40 |
| 10 | $21.1 | $211.00 |
| 100 | $19.5 | $1,950.00 |
| 500 | $18.2 | $9,100.00 |
| 1,000 | $16.9 | $16,900.00 |
Drop-in alternatives for 5CSEBA2U19C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA2U19C6N
✅ Drop-In✓ In Stock
$74.6 / Unit
View Datasheet →5CSEBA2U19A7N
✅ Drop-In✓ In Stock
$92.1 / Unit
View Datasheet →5CSEBA2U19I7N
✅ Drop-In✓ In Stock
$454.39 / Unit
View Datasheet →5CSEBA4U19C7N
✅ Drop-In📋 Reference alternative (not in catalog)
5CSEBA4U19C6N
✅ Drop-In📋 Reference alternative (not in catalog)
5CSEBA2U19C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25,000 LE |
| Adaptive Logic Modules (ALMs) | 9,430 ALM |
| ALUTs | 9,430 |
| DSP Blocks | 66 (variable-precision 18x18) |
| Embedded Memory | 1,400 Kbits (M9K + MLAB) |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock Frequency | 925 MHz |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| L2 Cache | 512 KB shared |
| Package | 484-pin UBGA (19x19 mm, 1.0 mm pitch) |
| Speed Grade | C7 |
| Operating Temperature | Commercial / Industrial (TJ from data) |
| Process Technology | TSMC 28 nm low-power |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
5CSEBA2U19C7N 484-pin ubga (19x19 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 5CSEBA2U19C7N (484-pin ubga (19x19 mm, 1.0 mm pitch) package) with [DATA_NEEDED: exact user I/O count] pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA2U19C7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: [DATA_NEEDED: exact user I/O count] pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA2U19C7N is suitable for 6 applications: Industrial Machine Vision Cameras, Industrial Motor Control and Drives, Factory Automation PLCs and Edge Controllers, Broadcast Video Processing and Conversion, Military and Aerospace Embedded Systems, Medical Imaging and Diagnostic Equipment.
Industrial Machine Vision Cameras
The 5CSEBA2U19C7N is well-suited for industrial machine vision cameras because the dual ARM Cortex-A9 HPS at 925 MHz handles GigE Vision / USB3 Vision protocol stacks and image preprocessing, while the 25K LE Cyclone V fabric accelerates Bayer demosaicing, lens distortion correction, and edge detection. The 66 variable-precision DSP blocks enable real-time 2D convolution at 1080p60, and the 1.4 Mbit embedded memory serves as frame-line buffers. The 484-UBGA package keeps the PCB footprint compact for embedded camera form factors, while the HPS EMAC and USB 2.0 OTG peripherals connect directly to image sensors and host PCs.
Recommended
Industrial Motor Control and Drives
The 5CSEBA2U19C7N's dual ARM Cortex-A9 cores execute field-oriented control (FOC) and space-vector PWM at update rates up to 32 kHz, while the FPGA fabric generates high-resolution PWM (16-bit @ 100 kHz switching), decodes incremental/SSI encoders, and processes current-sense ADC samples with sub-microsecond latency. The HPS peripherals include dedicated PWM timers, quadrature encoder interfaces, and EMAC for EtherCAT/SERCOS communication. The 484-UBGA package with industrial-grade options (C7/A7/I7) supports harsh factory-floor environments where temperature swings from -40 C to +100 C are common.
Recommended
Factory Automation PLCs and Edge Controllers
For factory automation PLCs, the 5CSEBA2U19C7N delivers deterministic real-time control through the HPS running Linux/RTOS with PREEMPT-RT patches, while the FPGA fabric implements IEC 61131-3 function-block accelerators and high-speed digital I/O. The HPS DDR3 controller supports ECC for safety-critical applications, and the HPS-to-Fabric AXI bridges expose peripheral registers to the CPU at sub-microsecond latency. The 484-UBGA package fits DIN-rail mounted controller boards, and the C7/A7 speed grade options enable deployment from clean factory floors to outdoor cabinets.
Recommended
Broadcast Video Processing and Conversion
The 5CSEBA2U19C7N fits broadcast video processing applications because the FPGA fabric handles SDI/HDMI bridging, color-space conversion, and scaler functions, while the ARM HPS manages ancillary data extraction, closed-caption handling, and IP-based control (NMOS IS-04/IS-05). The 66 variable-precision DSP blocks accelerate chroma resampling and motion-adaptive deinterlacing at 3G-SDI data rates. The HPS USB 2.0 and EMAC interfaces provide configuration and monitoring channels, while the FPGA fabric interfaces directly to SDI PHY chips at 270/1485/2970 Mbps.
Recommended
Military and Aerospace Embedded Systems
The 5CSEBA2U19C7N's combination of ARM Cortex-A9 with CoreSight debug fabric and 25K LE Cyclone V fabric is attractive for military/aerospace embedded systems where SWaP-C (size, weight, power, cost) is critical. The HPS runs secure RTOS (VxWorks, INTEGRITY) with built-in TrustZone support, while the FPGA implements MIL-STD-1553, ARINC 429, or SpaceWire interfaces. The 484-UBGA package's 1.0 mm pitch accommodates conformal coating for harsh-environment operation. Industrial temperature grade (A7/I7 speed grade variants) supports -40 C to +100 C operation required by DO-160 and MIL-STD-810.
Recommended
Medical Imaging and Diagnostic Equipment
The 5CSEBA2U19C7N supports medical imaging and diagnostic equipment by combining ARM Cortex-A9 processing for UI, DICOM networking, and patient data management with FPGA acceleration for image reconstruction, beamforming, or signal conditioning. The 66 DSP blocks accelerate FFT-based spectral analysis for ultrasound and optical coherence tomography, while the 1.4 Mbit embedded memory holds waveform and lookup tables. The HPS DDR3 controller with ECC meets IEC 60601-1 patient-safety data integrity requirements. The 484-UBGA package fits compact portable cart-based imaging systems.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U19C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA2U19C6N | 5CSEBA2U19A7N | 5CSEBA2U19I7N | 5CSEBA4U19C7N | 5CSEBA4U19C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA (19x19) | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same | 484-UBGA (19x19) - same |
| Logic Elements | 25,000 LE | 25,000 LE | 25,000 LE | 25,000 LE | 40,000 LE | 40,000 LE |
| Speed Grade | C7 | C6 | A7 | I7 | C7 | C6 |
| Temperature Grade | Commercial | Commercial | Industrial | Industrial | Commercial | Commercial |
| HPS Processor | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz |
| DSP Blocks | 66 | 66 | 66 | 66 | 84 | 84 |
| Embedded Memory | 1,400 Kbits | 1,400 Kbits | 1,400 Kbits | 1,400 Kbits | 2,700 Kbits | 2,700 Kbits |
Key Differentiators
- Same-package logic density upgrade path (vs 5CSEBA4U19C7N)
- Industrial temperature variants available (vs 5CSEBA2U19I7N)
- Speed grade flexibility (vs 5CSEBA2U19C6N)
Design Notes
The 484-UBGA package uses 1.0 mm ball pitch, which can be manufactured with via-in-pad or dog-bone fanout. For HFS (high-frequency signal) routes to DDR3 and EMAC, prefer via-in-pad with filled-and-capped vias to maintain signal-integrity-controlled impedance. Decoupling: place 0.1 uF X7R capacitors within 100 mil of every VCCINT/VCCAUX/VCCPD pin, plus bulk 10-47 uF tantalum or polymer capacitors near each power plane entry point. Keep the exposed thermal pad soldered to a continuous ground plane with at least 9 thermal vias for heat dissipation under sustained HPS load.
The HPS and FPGA fabric require separate power rails: VCCINT (1.1 V core), VCCAUX (2.5 V), VCCPD (3.0 V or 2.5 V), and HPS_VDD (1.1 V for ARM cores). Each rail should use a dedicated switching regulator with at least 20% headroom; the HPS can draw up to 2 A during Cortex-A9 peak operation. Power sequencing requires VCCPD to come up before VCCINT; failure to sequence properly can cause permanent latch-up. Use the dedicated EN sequencing controller (e.g., LTC2923) or rely on the Intel-recommended power tree with sequenced enable inputs.
Common pitfalls with the 5CSEBA2U19C7N: (1) forgetting to configure the HPS pin multiplexing in the preloader, which causes boot failure; (2) omitting the DDR3 calibration routine, which leads to intermittent memory errors at temperature; (3) exceeding 1.0 mm drill-to-copper on breakout vias, which causes shorts; (4) failing to terminate the HPS JTAG chain correctly when chaining multiple debug TAPs. Always run the Cyclone V SoC EDS bootloader validation tool before sealing the design. Estimated junction-to-ambient thermal resistance (theta_JA) for the UBGA-484 with 9 thermal vias is approximately 18 C/W, so 2 W dissipation yields ~36 C rise - well within the 100 C industrial junction limit.
Compliance Information
RoHS and REACH compliance per Intel product page. AEC-Q100 not applicable for SoC FPGA - this is a logic device, not an automotive-grade IC. Industrial-grade variants (A7/I7) available for harsh-environment applications.
