5CSEBA5U19A7N - Cyclone V SE SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Intel
N.º da peça: 5CSEBA5U19A7N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $204.85 | $204,85 |
| 10 | $195.2 | $1.952,00 |
| 100 | $178.5 | $17.850,00 |
| 500 | $165 | $82.500,00 |
| 1.000 | $152.4 | $152.400,00 |
5CSEBA5U19A7N Visão geral
A SoC FPGA is an integrated circuit that combines a programmable logic fabric (FPGA) and a microprocessor subsystem (HPS) on a single die. Within the broader taxonomy it is a class of programmable logic device, itself a sub-category of digital semiconductors. SoC FPGAs differ from pure FPGAs (which require an external host processor) and from application processors (which lack reconfigurable hardware), and are commonly used to offload custom accelerators, interfaces or DSP from the CPU while keeping deterministic hardware paths.
Key features of the 5CSEBA5U19A7N include up to 85K logic elements, embedded memory and DSP blocks in the FPGA fabric, hard memory controllers supporting DDR3, a wide range of I/O standards (LVDS, LVCMOS, SSTL) on the logic side, and the Cortex-A9 HPS with NEON and single/double precision FPU. The device supports partial reconfiguration, multiple boot modes (NAND, QSPI, SD/MMC) and is qualified to the automotive AEC-Q100 grade (-40C to +125C junction), making it suitable for harsh-environment deployments.
The integrated HPS-to-FPGA bridges (AXI) provide high-throughput, low-latency connectivity between the ARM cores and the programmable fabric, allowing tight hardware/software partitioning. The 28 nm process and Cyclone V power-optimized architecture target lower static current than prior Cyclone generations, while variable-precision DSP blocks implement 9x9, 18x18, 27x27 and floating-point modes for efficient signal processing.
Typical applications include industrial motor control and machine vision, automotive driver assistance and infotainment, video surveillance and broadcast, industrial Ethernet and protocol bridging, and embedded vision with on-the-fly image processing. The dual-core ARM subsystem enables Linux-based stacks while the FPGA implements deterministic I/O or real-time DSP.
When designing with this device, engineers should plan power sequencing for the HPS and FPGA rails, allocate sufficient PCB layers for BGA fan-out, and use Intel Quartus Prime with the SoC EDS toolchain to configure the HPS-FPGA bridge, pin mux and boot source. Memory trace routing should follow DDR3 length-matching rules and reference the device's pin-out file.
Alternativas drop-in para 5CSEBA5U19A7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSEBA5U19A7N (mesmo formato e footprint) — diferindo em Package, Logic Elements, DSP Blocks, Embedded Memory, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSEBA4U19A7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$99.9 / unidade
Ver ficha técnica →5CSEBA2U19A7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$92.1 / unidade
Ver ficha técnica →5CGTFD9A5U19A7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$241.5 / unidade
Ver ficha técnica →5CEBA4F23C8N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$62.41 / unidade
Ver ficha técnica →5CEBA4U19I7
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
5CSEBA5U19A7N Classificações máximas e características elétricas
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 85,000 |
| Process Technology | 28 nm low-power |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 700 MHz |
| Encapsulamento | 484-pin UBG A (19x19 mm) |
| Tipo de montagem | Surface Mount (BGA) |
| Supply Voltage (Core) | 1.1 V |
| Operating Temperature Grade | Automotive (AEC-Q100) -40C to +125C |
| I/O Count | 66 (per source listing) |
| Memory Interface | DDR3 controller in HPS; external memory interface in FPGA fabric |
| DSP Blocks | Variable-precision DSP blocks |
| Configuration / Boot Modes | NAND, QSPI, SD/MMC |
| Status RoHS | Compliant (per Ampheo listing) |
| Automotive Qualification | AEC-Q100 (Automotive grade, indicated by 'A' in part number) |
Guia de Configuração de Pinos do 5CSEBA5U19A7N 484-pin ubg a (19x19 mm)
Configuração de pinos para 5CSEBA5U19A7N (pacote 484-pin ubg a (19x19 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSEBA5U19A7N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSEBA5U19A7N é adequado para 6 aplicaçãos: Industrial Motor Control and Drives, Automotive Driver Assistance (ADAS) and Infotainment, Machine Vision and Industrial Cameras, Industrial Networking and Protocol Bridging, Embedded Test and Measurement Instrumentation, Industrial IoT Edge Gateways.
Industrial Motor Control and Drives
The 5CSEBA5U19A7N suits industrial motor-control designs that need both deterministic FPGA logic and a Linux host. Its 85K logic elements and variable-precision DSP blocks can implement field-oriented control loops, sigma-delta modulators and current-sense sampling at sub-microsecond jitter, while the dual Cortex-A9 HPS runs the control protocol stack (EtherCAT, EtherNet/IP, CANopen) and the human-machine interface. The 28 nm low-power process keeps static current low for always-on industrial PCs, and the AEC-Q100 automotive-grade junction range gives thermal headroom in cabinet-less installations. Engineers typically allocate the FPGA fabric to PWM generation, encoder decoding and safety logic (STO, SBC) while reserving the HPS for the motion controller and network server.
Recomendado
Automotive Driver Assistance (ADAS) and Infotainment
The 'A' suffix in 5CSEBA5U19A7N marks it as AEC-Q100 qualified for automotive, making it a fit for in-vehicle systems such as surround-view image stitching, sensor pre-processing, and infotainment head units. The dual ARM Cortex-A9 cores run Linux/Android Automotive OS and DSP-rich algorithms, while the 85K LE fabric implements MIPI-CSI2 capture, color-pipeline acceleration and low-latency sensor fusion in hardware. Cyclone V variable-precision DSP blocks perform 27x27 multiplies for radar FFT pipelines or convolutional layers, offloading the ARM cores. The 484-UBGA footprint enables small-form-factor PCB designs suited for behind-cluster or center-stack modules.
Recomendado
Machine Vision and Industrial Cameras
For industrial machine vision, the 5CSEBA5U19A7N integrates an 85K LE fabric for image-sensor pre-processing pipelines (debayering, gamma correction, edge detection) with a Cortex-A9 host for GigE Vision or USB3 Vision protocol stacks. The FPGA fabric reaches the bandwidth needed for 2K/4K line-scan or area-scan sensors, while DDR3 in the HPS provides frame-buffer memory. The SoC architecture eliminates external processors and the latency of PCIe between them, and AEC-Q100 grade supports food/pharmaceutical lines with wash-down enclosures. Linux SDK support simplifies integration with OpenCV or vendor SDKs.
Recomendado
Industrial Networking and Protocol Bridging
In factory-floor gateways and protocol converters, the 5CSEBA5U19A7N acts as a multi-protocol translator - for example, PROFINET to EtherNet/IP, Modbus to OPC UA. The Cortex-A9 HPS runs the fieldbus master libraries and the OPC UA server, while the FPGA fabric implements deterministic cycle-time I/O handling, time-stamping and hardware acceleration for frame parsing. The 85K LE budget is enough to add on-board firewall and intrusion-detection engines without a second processor. The automotive-grade temperature range tolerates sealed enclosures, and 28 nm low-power silicon reduces heat-load versus higher-end FPGAs.
Recomendado
Embedded Test and Measurement Instrumentation
For portable test instruments, the 5CSEBA5U19A7N offers a hybrid CPU+FPGA architecture that lowers BOM cost relative to a host PC plus FPGA card. The FPGA fabric implements high-speed ADC capture, digital down-conversion and trigger logic, while the Cortex-A9 HPS runs the GUI stack, file system (SD/eMMC) and USB/LAN connectivity. The dual ARM cores handle multi-threaded acquisition and live display rendering. The AEC-Q100 temperature grade supports outdoor or harsh-industrial measurement scenarios, and the 484-UBGA package enables handheld form factors.
Recomendado
Industrial IoT Edge Gateways
The 5CSEBA5U19A7N is well suited as the core of an industrial IoT edge gateway, where the FPGA fabric interfaces legacy analog or digital sensors and runs pre-processing, while the dual Cortex-A9 cores host Linux, container runtimes (Docker/Balena), and MQTT/HTTPS clients. The 28 nm low-power process keeps fanless designs feasible; the 484-UBGA package enables compact DIN-rail housings. The SoC FPGA reduces part count relative to a discrete MCU + FPGA design, lowering both BOM cost and potential failure surfaces. The AEC-Q100 grade supports deployment in outdoor enclosures or near-motor cabinets.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSEBA5U19A7N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSEBA4U19A7N | 5CSEBA2U19A7N | 5CGTFD9A5U19A7N | 5CEBA4F23C8N | 5CEBA4U19I7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-UBGA (19x19) | 484-FBGA | 484-UBGA (19x19) |
| Family | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V GT (with transceivers) | Cyclone V E (no HPS) | Cyclone V E (no HPS) |
| Logic Elements | 85,000 | 40,000 | ~25,000 | ~85,000 (GT variant) | 40,000 (E, no HPS) | 40,000 (E, no HPS) |
| Hard Processor System | Dual ARM Cortex-A9 up to 700 MHz | Dual ARM Cortex-A9 up to 700 MHz | Dual ARM Cortex-A9 up to 700 MHz | Dual ARM Cortex-A9 up to 925 MHz | None (pure FPGA) | None (pure FPGA) |
| Transceivers | No (Cyclone V SE) | No | No | Yes (Cyclone V GT) | No (Cyclone V E) | No (Cyclone V E) |
| Automotive Grade (AEC-Q100) | Yes (-40C to +125C) | Yes (-40C to +125C) | Yes (-40C to +125C) | Yes (-40C to +125C) | Industrial (no AEC-Q100 in this suffix) | Industrial |
| Process Technology | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
Principais diferenciais
- Integrated dual Cortex-A9 HPS on the same die (vs 5CEBA4U19I7)
- 85K logic elements vs lower-density siblings (vs 5CSEBA4U19A7N)
- Lower power than Cyclone V GT for non-transceiver designs (vs 5CGTFD9A5U19A7N)
Notas de projeto
Estimated: the 5CSEBA5U19A7N UBG A-484 package uses a 19x19 mm body with 0.8 mm ball pitch. PCB layout must follow Intel's land-pattern recommendations, using microvia HDI stack-ups (typically 8 layers minimum) with via-in-pad for full BGA break-out. Power plane decoupling requires 0402/0201 capacitors within 2 mm of each power ball, and at least 1 oz copper pours for the 1.1 V core and DDR3 reference planes to handle the ~3-5 W peak dynamic power (estimated from HPS+FPGA workload).
Estimated: total power dissipation for the 5CSEBA5U19A7N depends on HPS utilization and FPGA toggle rate; typical industrial designs range 2-5 W. Use a thermal pad connected to the package substrate balls for the exposed thermal feature, and ensure junction-to-ambient theta-JA does not push the die beyond the AEC-Q100 125 C limit. For sealed enclosures, add a small heatsink or thermal interface material above the UBG A top.
Route DDR3 traces from the HPS memory controller with matched length within +/-25 mils and 100 ohm differential impedance; the FPGA fabric memory interface should follow the same rules. Keep high-speed HPS clock traces short and reference to a continuous ground plane to avoid jitter. Use Quartus pin-planner to assign I/O bank voltage standards before layout to avoid re-spin.
Do not assume Cyclone V SE ballout is identical to Cyclone V E or GT in the same UBG A-484 footprint - the HPS-related pins (DDR3, USB, Ethernet MAC, boot config) are present only on SE SoC parts and differ in function from the pure FPGA variants. Always check the device pin-out file (CSV from Quartus) before reuse, and verify boot-mode strap pins (BSEL, CSEL) are pulled correctly at power-up.
Informações de conformidade
RoHS compliance confirmed by Ampheo listing. AEC-Q100 qualification is indicated by the 'A' suffix in the part number, with junction temperature range -40C to +125C. Halogen-free and conflict-minerals status were not explicitly provided in verified web data and are marked as 'unknown'.
