5CSEBA2U19A7N - Cyclone V SE SoC FPGA 25K LE, A7 Automotive | Altera
MPN: 5CSEBA2U19A7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $114.62 | $114.62 |
| 10 | $110.5 | $1,105.00 |
| 100 | $105.2 | $10,520.00 |
| 500 | $98.4 | $49,200.00 |
| 1,000 | $92.1 | $92,100.00 |
Drop-in alternatives for 5CSEBA2U19A7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSEBA2U19C8N
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5CSEBA2U19I7N
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View Datasheet →5CSEBA2U19C7N
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View Datasheet →5CSEBA2U19A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA2 (U19 device) |
| Logic Elements | 25,000 |
| Process Technology | 28 nm low-power |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 700 MHz |
| Core Voltage (VCCINT) | 1.1 V |
| Temperature Grade | Automotive A7 |
| AEC-Q100 | Qualified |
| Package | 484-UBGA (U19), 19x19 mm |
| Mounting Type | Surface Mount (FBGA) |
| User I/O Pins | 161 |
| Memory | Embedded SRAM + DDR3/LPDDR2 controller (HPS) |
| DSP Blocks | Variable-precision, embedded multiplier/accumulator |
| RoHS Status | Compliant |
| Lead-Free | Yes |
5CSEBA2U19A7N 484-ubga (u19), 19x19 mm Pin Configuration Guide
Complete pinout information for 5CSEBA2U19A7N (484-ubga (u19), 19x19 mm package) with 161 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA2U19A7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 161 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA2U19A7N is suitable for 7 applications: Automotive ADAS Sensor Fusion, Industrial Machine Vision Controller, Motor Control and Drive Inverter, Automotive HMI / Infotainment Controller, Factory Automation Gateway / Edge Controller, Medical Imaging / Diagnostic Equipment, Surveillance / Smart Camera Edge AI.
Automotive ADAS Sensor Fusion
The 5CSEBA2U19A7N's AEC-Q100 qualification, dual ARM Cortex-A9 HPS, and 25K-logic-element FPGA fabric make it well-suited to automotive ADAS sensor-fusion front-ends. The HPS runs the real-time operating system and sensor calibration, while the FPGA fabric performs low-latency object detection, radar preprocessing, and CAN-FD bridging. The 28nm low-power process keeps junction temperature manageable in sealed ECU enclosures. Compared to discrete MCU + FPGA solutions, the integrated SoC reduces board area, BOM count, and inter-IC latency.
Recommended
Industrial Machine Vision Controller
The 5CSEBA2U19A7N pairs deterministic FPGA fabric parallelism with Linux-capable HPS processing, ideal for industrial machine vision controllers handling MIPI CSI-2, GigE Vision, or parallel CMOS image sensors. The variable-precision DSP blocks accelerate Bayer demosaicing, edge detection, and CNN inference at the edge, while the Cortex-A9 cores run OpenCV and factory-floor protocol stacks (OPC-UA, Modbus/TCP). The 161 user I/O support multiple camera lanes and GPIO for lighting control.
Recommended
Motor Control and Drive Inverter
The 5CSEBA2U19A7N's combination of high-speed FPGA I/O, deterministic timing, and an embedded HPS makes it a strong fit for industrial motor-control and drive inverter designs. The FPGA fabric implements field-oriented control (FOC), PWM generation, and encoder interfaces at sub-microsecond latency, while the ARM cores execute supervisory control loops, communication stacks, and fault diagnostics. Automotive A7 temperature grade also enables use in traction inverters and servo drives with extended thermal envelopes.
Recommended
Automotive HMI / Infotainment Controller
The 5CSEBA2U19A7N's dual ARM Cortex-A9 cores running Android or Linux, combined with FPGA-accelerated display pipelines, suit automotive HMI and infotainment controllers. The HPS handles graphics stacks, touch input, and Bluetooth/Wi-Fi host bridging, while the FPGA fabric drives LVDS or OpenLDI displays, performs pixel-level compositing, and offloads video decode. AEC-Q100 qualification plus the U19 UBGApackage fit behind the dashboard where thermal and EMI budgets are tight.
Recommended
Factory Automation Gateway / Edge Controller
The 5CSEBA2U19A7N serves as an edge-of-network gateway in Industry 4.0 deployments, with the HPS running containerized workloads (Docker on Linux) and the FPGA fabric accelerating industrial protocols like PROFINET, EtherCAT, or EtherNet/IP in hardware. The 25K LE capacity allows simultaneous bridging of multiple real-time Ethernet channels without external ASICs, while the integrated Cortex-A9 cores handle secure boot, TLS, and MQTT messaging. The UBGApackage is robust against factory-floor vibration and thermal cycling.
Recommended
Medical Imaging / Diagnostic Equipment
The 5CSEBA2U19A7N's deterministic FPGA fabric accelerates ultrasound beamforming, CT reconstruction pre-processing, and digital X-ray pipeline stages in medical imaging equipment. The dual ARM cores host the patient UI, DICOM storage, and clinician-facing controls. AEC-Q100 is not directly applicable, but the automotive A7 temperature range and extended reliability testing make the part attractive for medical designs demanding long product life cycles and high MTBF.
Recommended
Surveillance / Smart Camera Edge AI
The 5CSEBA2U19A7N's FPGA fabric implements low-latency video pre-processing (HDR merge, lens correction, motion detection) while the ARM cores run edge AI inference (TensorFlow Lite, ONNX) for surveillance and smart camera applications. The 161 user I/O support multiple sensor lanes, IR illumination control, and PTZ motor drivers. Compared to ASIC-based SoCs, the FPGA portion lets OEMs differentiate with proprietary analytics without respinning silicon.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U19A7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA2U19C8N | 5CSEBA4U19C8N | 5CSEBA2U19I7N | 5CSEBA2U19C7N | 5CGTFD7D5F27I7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-UBGA (U19) 19x19 mm | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 484-UBGA (U19) - same | 672-FBGA - larger |
| Family | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V GT SoC (with transceivers) |
| Logic Elements | 25,000 | 25,000 | 40,000 | 25,000 | 25,000 | ~150,000 |
| HPS Processor | Dual ARM Cortex-A9 700 MHz | Dual ARM Cortex-A9 700 MHz | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 700 MHz | Dual ARM Cortex-A9 700 MHz | Dual ARM Cortex-A9 925 MHz |
| Temperature Grade | Automotive A7 (-40C to +125C) | Commercial C8 (0C to +85C) | Commercial C8 (0C to +85C) | Industrial I7 (-40C to +100C) | Commercial C7 | Industrial I7 |
| AEC-Q100 | Qualified | Not qualified | Not qualified | Not qualified | Not qualified | Not qualified |
| Transceivers | None (SE family) | None | None | None | None | 3.125 Gbps transceivers |
Key Differentiators
- Automotive AEC-Q100 A7 qualification at 25K LE capacity (vs 5CSEBA2U19C8N)
- Highest LE capacity in pin-compatible U19 UBGApackage (vs 5CSEBA2U19C8N)
- Cyclone V SE: zero high-speed transceivers, lower power than GT (vs 5CGTFD7D5F27I7N)
- Integrated HPS eliminates external processor + bus bridge (vs 5CEFA9F23I7N (Cyclone V E, FPGA-only))
Design Notes
Estimated: with VCCINT 1.1V at typical SoC operation (FPGA fabric ~50% utilization + HPS active), the 5CSEBA2U19A7N draws approximately 3-5W from the core rail plus HPS I/O and FPGA I/O bank supplies. Design a 6+ layer PCB with separate planes for VCCINT, VCCPD, VCC_HPS, and VCCAUX to minimize switching noise. Decoupling follows Altera's Cyclone V hardware reference manual: place 0.1uF X7R caps at every VCCINT pin within 100 mils, plus bulk 47-100uF polymer caps per supply plane.
The 484-UBGA U19 package (19x19 mm, 0.8 mm ball pitch) requires via-in-pad technology with laser-drilled microvias and 4-mil/4-mil trace/space design rules. Maintain a continuous GND pour under the package and stitch vias on a 200-mil grid around the BGA perimeter. Length-match DDR3/LPDDR2 traces per the Cyclone V SE external memory interface guidelines - mismatch beyond 25 ps risks setup/hold violations at 400 MHz.
Estimated: at 5W total dissipation on the 484-UBGA (theta_JA ~15-20 C/W on a 6-layer JEDEC test board, per Altera thermal model), the junction-to-ambient temperature rise is 75-100 C above ambient. For automotive A7 grade with 125 C junction limit, derate ambient to ~25-50 C max without airflow. Apply thermal vias under the exposed die region and consider a heat spreader for sealed ECU enclosures.
Common pitfalls include: (1) not sequencing the FPGA core, HPS, and I/O rails independently - the HPS can boot before the FPGA fabric is configured if rails are not ordered, leading to bus contention; (2) omitting the external clock reference - the HPS requires a 25-50 MHz reference for its PLL chain before the Cortex-A9 cores can boot; (3) using a non-AEC-Q100 part in automotive safety-critical paths - always verify the ordering code ends in A7N for AEC-Q100 compliance.
Compliance Information
AEC-Q100 qualified per datasheets.com catalog entry. RoHS and lead-free confirmed per Altera product page. Halogen-free status not explicitly published in available data.
