5CSEBA6U23C6N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9, 672-UBGA | Intel
N.º da peça: 5CSEBA6U23C6N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $272.2 | $272,20 |
| 10 | $245 | $2.450,00 |
| 100 | $215 | $21.500,00 |
| 250 | $199 | $49.750,00 |
| 500 | $185 | $92.500,00 |
5CSEBA6U23C6N Visão geral
A System-on-Chip (SoC) FPGA is a class of heterogeneous computing device that tightly couples a programmable logic fabric with a hard processor subsystem on the same silicon die, offering the I/O flexibility and parallelism of an FPGA with the deterministic software execution of an embedded CPU. SoC FPGAs sit at the intersection of microcontrollers, ASICs, and traditional FPGAs in the embedded-processing taxonomy, enabling hardware-accelerated peripherals alongside a Linux-capable application processor. The 5CSEBA6U23C6N specifically targets low-power, cost-sensitive industrial and video/embedded applications where board space, BOM, and power are constrained.
Key features include 110,000 logic elements, 224 (18x18) hardware multipliers, approximately 5.7 Mbits of embedded memory, dual ARM Cortex-A9 MPCore CPUs with NEON media engine and single/double-precision FPU, CoreSight debug and trace, integrated peripherals (USB 2.0 OTG, Gigabit Ethernet MAC, DDR3 controller, CAN, SPI, I2C, UART), and up to 145 user I/O pins. The device is built on TSMC's 28 nm low-power process and uses a 1.1 V core supply with dedicated HPS and FPGA power rails.
The HPS-FPFPGA bridge architecture provides up to 128-bit wide AXI buses between the processor subsystem and the FPGA fabric, enabling low-latency DMA and accelerator offload. Hardware multipliers, variable-precision DSP blocks, and embedded M10K memory blocks allow DSP-intensive pipelines to run alongside the HPS without contention. The 672-UBGA package exposes dedicated HPS I/O (DDR3, USB, Ethernet) and FPGA I/O banks for LVDS, LVCMOS, and RSDS signalling.
Typical applications include industrial machine vision and video surveillance, motor control and factory automation, broadcast video processing, medical imaging, and low-power embedded computing where Linux and FPGA acceleration coexist. The integration of the HPS removes the need for a separate processor MCU/MPU and companion power tree.
When designing with this device, allocate separate decoupling for HPS and FPGA rails, follow Intel's EMIF guidelines for DDR3 PCB routing, and validate pin assignments in Intel Quartus Prime and the SoC EDS toolchain. The -C6 commercial speed grade and 0 C to +85 C junction temperature are appropriate for indoor industrial deployments.
Alternativas drop-in para 5CSEBA6U23C6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSEBA6U23C6N (mesmo formato e footprint) — diferindo em Package, Logic Elements, Embedded Memory, Speed Grade, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSEBA6U23C7N
✅ Drop-In✓ Em estoque
$185 / unidade
Ver ficha técnica →5CSEBA6U23C8N
✅ Drop-In✓ Em estoque
$132 / unidade
Ver ficha técnica →5CSEBA6U23A7N
✅ Drop-In✓ Em estoque
$225 / unidade
Ver ficha técnica →5CSEBA6U23C6N
✅ Drop-In✓ Em estoque
$185 / unidade
Ver ficha técnica →5CSEBA5U23C6N
✅ Drop-In✓ Em estoque
$122.33 / unidade
Ver ficha técnica →5CSEBA6U23C6N Classificações máximas e características elétricas
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 110,000 |
| HPS Processor | Dual ARM Cortex-A9 MPCore with NEON and FPU |
| HPS Maximum Clock Frequency | 925 MHz |
| DSP Blocks (18x18 multipliers) | 224 |
| Embedded Memory (M10K + MLAB) | approximately 5.7 Mbits |
| Maximum User I/O | 145 |
| HPS Hard Memory Controller | DDR3, DDR3L, LPDDR2 |
| HPS Peripherals | USB 2.0 OTG, Gigabit Ethernet MAC, CAN, SPI, I2C, UART, NAND/NOR flash controller |
| Core Voltage | 1.1 V |
| Process Technology | TSMC 28 nm low-power |
| Encapsulamento | 672-UBGA (23x23 mm) |
| Tipo de montagem | Surface Mount (BGA) |
| Temperatura de junção de operação | 0 C to +85 C (commercial, C6 ordering code) |
| Speed Grade | C6 (commercial) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do 5CSEBA6U23C6N 672-ubga (23x23 mm)
Configuração de pinos para 5CSEBA6U23C6N (pacote 672-ubga (23x23 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSEBA6U23C6N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSEBA6U23C6N é adequado para 6 aplicaçãos: Industrial Machine Vision Systems, Video Surveillance and Broadcast Processing, Motor Control and Factory Automation, Medical Imaging Equipment, Embedded Computing with Linux and FPGA Acceleration, Low-Power Industrial IoT Gateways.
Industrial Machine Vision Systems
The 5CSEBA6U23C6N is well suited to industrial machine vision because its 110K logic elements and 224 18x18 hardware multipliers provide the DSP throughput required for image preprocessing, edge detection, and convolutional pipelines running alongside the dual ARM Cortex-A9 HPS at 925 MHz. The HPS runs Linux with the OpenCV stack while the FPGA fabric handles sensor interface aggregation (MIPI, LVDS, GigE Vision) and hardware-accelerated filtering. This split keeps the CPU free for higher-level inspection algorithms while achieving deterministic frame rates; the 145 user I/Os and DDR3 controller comfortably support multi-stream GigE Vision cameras.
Recomendado
Video Surveillance and Broadcast Processing
For video surveillance and broadcast video processing, the 5CSEBA6U23C6N's combination of 5.7 Mbits embedded memory and 224 DSP blocks enables real-time H.264/H.265 encode/decode pipelines and multi-channel scaling. The dual Cortex-A9 with NEON SIMD handles network stacks, ONVIF/RTSP, and analytics code while the FPGA fabric implements video pre-processing (deinterlacing, color space conversion). The 672-UBGA exposes enough LVDS pairs to drive HDMI/SDI bridge chips; thermal performance is comfortable inside an indoor surveillance enclosure thanks to the 1.1 V core.
Recomendado
Motor Control and Factory Automation
Industrial motor drives and PLC platforms leverage the 5CSEBA6U23C6N's deterministic HPS-FPGA AXI bridges to implement field-oriented control (FOC) loops with sub-microsecond latency while the Cortex-A9 runs the EtherCAT or PROFINET master and the operator HMI. The 28 nm low-power process keeps dissipation under 5 W typical, allowing fanless DIN-rail mounting. Industrial peripherals (CAN, SPI, I2C, UART) integrated in the HPS eliminate companion interface ICs, and the 145 user I/Os comfortably accommodate multi-axis encoder and resolver inputs.
Recomendado
Medical Imaging Equipment
In medical imaging platforms such as ultrasound and endoscopy systems, the 5CSEBA6U23C6N delivers the parallel processing fabric required for beamforming and real-time image reconstruction while the Cortex-A9 HPS manages the user interface, DICOM network stack, and patient data encryption. Hardware multipliers enable FIR/IIR filtering for noise suppression on incoming analog front-end channels; embedded M10K memory blocks store scan-line buffers close to the logic. The 1.1 V core voltage and commercial 0-85 C junction range suit controlled-environment hospital deployments; for portable instruments an industrial I7 variant is recommended.
Recomendado
Embedded Computing with Linux and FPGA Acceleration
The 5CSEBA6U23C6N targets embedded computing boards that need to run a full operating system with hardware acceleration. The dual Cortex-A9 boots Linux via the on-chip NAND/NOR flash controller, while user logic added to the FPGA fabric implements accelerators (cryptographic engines, packet processors, custom DSP). The 128-bit AXI HPS-to-FPGA bridge offers high-bandwidth DMA for accelerator offload. A 672-UBGA package integrates the HPS peripherals (USB OTG, Gigabit Ethernet, DDR3) without needing companion power management ICs beyond the standard Cyclone V sequencing circuit.
Recomendado
Low-Power Industrial IoT Gateways
For industrial IoT gateways consolidating Modbus, CAN, and EtherCAT fieldbuses, the 5CSEBA6U23C6N provides the HPS to run an MQTT broker plus on-board analytics, and the FPGA to implement protocol conversion and deterministic timestamping. The 28 nm low-power process and 1.1 V core keep the gateway below 5 W typical, allowing fanless DIN-rail mounting in cabinets. Integrated USB 2.0 OTG and Gigabit Ethernet MAC eliminate external PHY chips in many designs, reducing BOM cost. Industrial C6 ordering code supports indoor cabinet deployments up to 85 C junction temperature.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSEBA6U23C6N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSEBA6U23C7N | 5CSEBA6U23C8N | 5CSEBA6U23A7N | 5CSEBA5U23C6N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same |
| Logic Elements | 110,000 | 110,000 | 110,000 | 110,000 | approximately 85,000 |
| HPS Processor | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz |
| DSP Blocks (18x18) | 224 | 224 | 224 | 224 | approximately 174 |
| Speed Grade | C6 (commercial) | C7 (slower Fmax tier) | C8 (slowest Fmax tier) | A7 (automotive ordering code) | C6 (commercial) |
| Junction Temperature | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | -40 C to +125 C (automotive) | 0 C to +85 C |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
Principais diferenciais
- Highest-density 5CSEBA6 member in the U23 commercial speed grade (vs 5CSEBA5U23C6N)
- Integrated dual ARM Cortex-A9 HPS eliminates companion processor (vs Cyclone V E (5CE) sub-family)
- Drop-in speed-grade alternatives on the same die/package (vs 5CSEBA6U23C7N / 5CSEBA6U23C8N)
Notas de projeto
The Cyclone V SE SoC requires separate HPS and FPGA power rails per Intel's Cyclone V Device Datasheet power management guidelines. Typical rails include VCC_HPS (1.1 V), VCC_FPGA (1.1 V), VCCIO_HPS (1.5 V/1.8 V/3.3 V for HPS banks), VCCIO_FPGA (per-bank voltage), and VCCPD (3.0 V/2.5 V for configuration). Use a sequencer such as the LM3880 or Intel's recommended controller; Estimated: total board power at 925 MHz HPS plus 60% FPGA utilization is approximately 3-5 W, dominated by FPGA core and DDR3 terminations.
Follow Intel's EMIF guidelines for the HPS DDR3 controller: match-length address/command traces within +/-25 mil, route byte-lane DQS to clock within +/-10 mil, use 100 ohm differential impedance for clock, and provide solid GND reference planes on adjacent layers. Place the 672-UBGA on a board with at least 6 layers to accommodate HPS and FPGA decoupling without compromising signal-integrity on the 1.5 V DDR3 interface.
Estimated: at 925 MHz HPS plus 60% FPGA utilization and 1.1 V core, total dissipation is roughly 3-5 W. The 672-UBGA package has a typical theta_JA near 12 C/W with adequate PCB thermal vias under the exposed pad area; for sealed enclosures, provision a small aluminum heat spreader or thermal interface to keep junction below 85 C. For deployments exceeding 85 C junction, select the A7 automotive or I7 industrial ordering variant.
Informações de conformidade
RoHS and lead-free compliance per Intel Altera Cyclone V product page. C6 ordering code is commercial grade; AEC-Q100 qualification applies only to A7 automotive ordering codes. REACH compliance status confirmed via Intel product declaration.