5CSEBA6U23A7N - Cyclone V SE SoC FPGA 110K LE | Intel
MPN: 5CSEBA6U23A7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $295 | $2,950.00 |
| 100 | $268 | $26,800.00 |
| 500 | $245 | $122,500.00 |
| 1,000 | $225 | $225,000.00 |
Drop-in alternatives for 5CSEBA6U23A7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA5U23A7N
✅ Drop-In✓ In Stock
$205 / Unit
View Datasheet →5CSEBA4U23A7N
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →5CSEBA2U23A7N
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →5CSEBA6U19A7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$198.4 / Unit
View Datasheet →5CSXFC6D6F31C8N
✅ Drop-In📋 Reference alternative (not in catalog)
5CSEBA6U23A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 110,000 |
| Process Node | 28 nm low-power |
| Hard Processor System (HPS) | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | 700 MHz |
| Core Voltage | 1.1 V |
| Package | 672-UBGA (23x23 mm) |
| Automotive Qualification | AEC-Q100 compliant |
| Operating Temperature | -40C to +85C (industrial) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| DSP Blocks | Variable-precision DSP blocks (per family datasheet) |
| Memory Interfaces | DDR3/DDR3L controller in HPS |
| RoHS Status | RoHS compliant |
| Shipping Media | Tray |
5CSEBA6U23A7N Pin Configuration
| Pin 1 | VCC — Core supply (1.1 V) - representative ball; full 672-ball pinout is in Intel Pin-Out Files for Cyclone V Devices |
| Pin 100 | GND — Ground - representative ball; full ball map in Intel Pin-Out Files for Cyclone V Devices |
| Pin 200 | HPS_DDR_DQ[0] — HPS DDR3/DDR3L data line 0 - representative HPS ball |
| Pin 300 | IO_3V3_BANK_8A — FPGA I/O bank 8A pin - representative FPGA I/O ball |
| Pin 400 | HPS_CLK1 — HPS clock input - representative clock ball |
| Pin 500 | CONFIG_DATA — FPGA configuration data pin - representative configuration ball |
| Pin 600 | JTAG_TCK — JTAG test clock - boundary-scan programming pin |
| Pin 672 | NC — No-connect (per package pinout) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA6U23A7N is suitable for 6 applications: Automotive ADAS Sensor Fusion, Industrial Motor Control, Machine Vision Pre-Processing, Human-Machine Interface (HMI) Controllers, Programmable Logic Controller (PLC) Backplane, Medical Imaging Signal Conditioning.
Automotive ADAS Sensor Fusion
The 5CSEBA6U23A7N's AEC-Q100 qualification and 110K logic elements make it a strong fit for automotive ADAS sensor-fusion ECUs. The dual-core Cortex-A9 HPS at 700 MHz runs the sensor-fusion OS (typically AUTOSAR or RT-Linux), while the FPGA fabric implements low-latency preprocessing of camera, radar, and lidar data streams - object detection, point-cloud filtering, and time synchronization. The 672-UBGA package exposes enough I/O to interface multiple MIPI CSI-2 cameras and CAN-FD vehicle networks, and the 28 nm low-power process keeps chassis-domain power budgets realistic.
Recommended
Industrial Motor Control
For high-end industrial servo drives and multi-axis motor controllers, the 5CSEBA6U23A7N's 110K LEs host PWM generators, encoder interfaces (EnDat, BiSS), and current-control loops in hardware, while the Cortex-A9 HPS runs the motion-control stack (EtherCAT, CANopen) and supervisory logic. The 672-UBGA provides sufficient I/O banks for simultaneous three-phase current sensing and resolver excitation, and the -40C to +85C industrial range supports cabinet and machine-mount installations. Variable-precision DSP blocks accelerate the Park/Clark transforms and SVPWM calculations.
Recommended
Machine Vision Pre-Processing
The 5CSEBA6U23A7N suits factory-floor machine vision pre-processing where the FPGA fabric pipelines image acquisition, lens correction, color conversion, and feature extraction before forwarding results to the Cortex-A9 HPS for higher-level decision making. The 700 MHz dual-core CPU handles inspection logic, while FPGA logic keeps throughput deterministic at high frame rates. The 672-UBGA supports parallel image-sensor interfaces (MIPI CSI-2, LVDS, parallel CMOS) and GigE Vision hand-off to upstream networks.
Recommended
Human-Machine Interface (HMI) Controllers
For industrial HMI panels, the 5CSEBA6U23A7N drives TFT-LCD controllers, touch-screen I2C interfaces, and graphics accelerators in the FPGA fabric while the HPS runs the embedded Linux GUI stack (Qt or WebKit). The 672-UBGA provides the LVDS pairs and HSIO banks needed for large 10- to 15-inch displays, and the industrial temperature grade supports panel-mount installations near heat-generating equipment. AEC-Q100 compliance also enables in-cabin automotive HMI deployments such as instrument clusters and infotainment auxiliary displays.
Recommended
Programmable Logic Controller (PLC) Backplane
As a PLC backplane controller, the 5CSEBA6U23A7N's 110K LEs implement industrial fieldbus protocols (PROFINET, EtherCAT, EtherNet/IP, Modbus TCP) and high-speed digital I/O scan engines directly in FPGA logic, while the Cortex-A9 HPS executes the IEC 61131-3 runtime and supervisory logic. The 672-UBGA package accommodates multiple industrial Ethernet PHYs and a parallel backplane interface, and the automotive/industrial temperature range guarantees operation in factory cabinets and process-control racks.
Recommended
Medical Imaging Signal Conditioning
Although not FDA-cleared for life-support devices, the 5CSEBA6U23A7N is used in non-life-support medical imaging equipment (portable ultrasound pre-beamforming, lab analyzers, dental imaging) where its FPGA fabric performs high-speed ADC conditioning and DSP, while the dual-core Cortex-A9 HPS runs the user interface and image processing stack. The 672-UBGA accepts multiple high-speed ADC channels, and the industrial temperature range supports clinical and laboratory environments without additional ruggedization.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA6U23A7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA5U23A7N | 5CSEBA4U23A7N | 5CSEBA2U23A7N | 5CSEBA6U19A7N | 5CSXFC6D6F31C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (23x23 mm, U23) | 672-UBGA (23x23 mm, U23) - same | 672-UBGA (23x23 mm, U23) - same | 672-UBGA (23x23 mm, U23) - same | 672-UBGA (19x19 mm, U19) - smaller | 896-FBGA (31x31 mm, F31) - larger |
| Logic Elements | 110,000 | 85,000 (-23%) | 49,000 (-55%) | 25,000 (-77%) | 110,000 (same) | [DATA_NEEDED] |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | Dual-core ARM Cortex-A9 MPCore (same) | Dual-core ARM Cortex-A9 MPCore (same) | Dual-core ARM Cortex-A9 MPCore (same) | Dual-core ARM Cortex-A9 MPCore (same) | Dual-core ARM Cortex-A9 MPCore (same) |
| HPS Clock Frequency | 700 MHz | 700 MHz | 700 MHz | 700 MHz | 700 MHz | [DATA_NEEDED] (likely higher SX) |
| Process Node | 28 nm low-power | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) | 28 nm low-power (same) |
| AEC-Q100 Automotive Grade | Yes | Yes | Yes | Yes | Yes | No (industrial) |
| Operating Temperature | -40C to +85C | -40C to +85C (same) | -40C to +85C (same) | -40C to +85C (same) | -40C to +85C (same) | -40C to +85C (same) |
| Approximate 1-piece Unit Price (USD, as of 2026-09-06) | 320.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Lowest LE density in same-package U23 footprint (vs 5CSEBA6U19A7N)
- Higher LE density vs lower-density same-package variants (vs 5CSEBA2U23A7N)
- Lower power and cost tier vs Cyclone V SX feature-rich variant (vs 5CSXFC6D6F31C8N)
Design Notes
Estimated: the 5CSEBA6U23A7N in the 672-UBGA package typically dissipates 3-8 W depending on FPGA utilization, HPS workload, and toggle rate. Provide a minimum 4-layer PCB with a dedicated ground plane and a copper pour under the UBG A thermal footprint to keep junction temperature within the 100C automotive derating budget. A small heatsink is recommended if utilization exceeds 60% with high toggle rates.
Per Intel's Cyclone V device handbook, the SoC FPGA requires at minimum a 1.1 V core supply, a 2.5 V or 3.3 V I/O supply, and a separate HPS supply rail. Decouple each supply pin with 0.1 uF and 10 uF ceramic capacitors placed as close to the balls as possible. Power sequencing must follow the Cyclone V Power Management User Guide to avoid latch-up during hot-plug events.
The 672-UBGA package uses fine-pitch (0.8 mm) balls; per IPC-7351 guidelines, microvia stacks with dog-bone fan-out are recommended, and trace escape routing must respect the BGA pitch. Use 50 ohm controlled impedance for HPS DDR3/DDR3L nets and length-match within the tolerances specified in the Cyclone V External Memory Interface Handbook.
Do not assume that different Cyclone V SE variants with the same UBG A footprint are interchangeable without verifying pinout - while 5CSEBA6U23A7N, 5CSEBA5U23A7N, 5CSEBA4U23A7N, and 5CSEBA2U23A7N share the same U23 package, 5CSEBA6U19A7N uses the smaller U19 footprint and is NOT drop-in. Confirm via Intel's Pin-Out Files before substituting.
Keep HPS DDR memory traces on the same PCB layer as the HPS balls with no vias in the data byte groups, per the Cyclone V External Memory Interface Handbook. Maintain at least 25 mil spacing between high-speed HPS traces and noisy switching supplies to avoid coupling into the DDR sampling window.
Compliance Information
AEC-Q100 qualification per Veswin and Datasheets.com listings; RoHS and conflict-minerals compliance per standard Intel FPGA product policy. Halogen-free status not explicitly stated in the verified data.
