5CSEBA4U23I7LN - Cyclone V SE SoC FPGA 40K LE Dual A9 925MHz | Intel
N.º da peça: 5CSEBA4U23I7LN ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $159.33 | $159,33 |
| 10 | $145.2 | $1.452,00 |
| 100 | $128.5 | $12.850,00 |
| 500 | $112.4 | $56.200,00 |
| 1.000 | $99.75 | $99.750,00 |
5CSEBA4U23I7LN Visão geral
A System-on-Chip FPGA combines a traditional FPGA fabric with a hard processor subsystem on a single die, enabling hardware/software co-design for embedded applications. The FPGA fabric provides configurable logic and DSP resources for parallel data processing, while the ARM Cortex-A9 cores run an operating system and orchestrate system-level tasks. Compared with a soft-core processor on a discrete FPGA, an SoC FPGA eliminates inter-chip communication bottlenecks, reduces PCB area, and lowers BOM cost by sharing power, clock, and memory resources.
Key features include 40K Logic Elements, ~1.6 Mb embedded memory, 224 18x18 multipliers for DSP, and integrated DDR3 controller supporting up to 32-bit external memory. The hard processor system offers dual ARM Cortex-A9 cores with NEON media engine, single/double-precision FPU, 32 KB I-cache + 32 KB D-cache per core, and 512 KB shared L2 cache. Peripherals include USB 2.0 OTG, Gigabit Ethernet MAC, NAND flash controller, and UART/SPI/I2C interfaces.
The 28nm low-power process and adaptive logic modules deliver high performance at low static and dynamic power, making it suitable for thermally constrained embedded applications. The shared coherent memory between FPGA and processor subsystems enables zero-copy data movement, accelerating compute-intensive pipelines such as machine vision inference and protocol processing.
Typical applications include industrial machine vision cameras, motor drives, broadcast video processing, test and measurement equipment, and automotive driver assistance platforms. The combination of deterministic hardware acceleration with a Linux-capable processor subsystem makes it ideal for heterogeneous compute workloads.
When designing with this device, ensure that the DDR3 interface is routed with matched length traces and proper termination per the Cyclone V External Memory Interface Handbook. The 23x23 mm UBGA package requires high-density PCB design with microvia stack-up to fan out the 672-pin BGA.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. The Cyclone V SE SoC FPGA 5CSEBA4U23I7LN datasheet at the Altera/Intel product page is the authoritative reference for detailed electrical characteristics.
Alternativas drop-in para 5CSEBA4U23I7LN — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 5CSEBA4U23I7LN (mesmo formato e footprint) — diferindo em Package, Logic Elements, Embedded Memory, Process Technology, Hard Processor System.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
5CSEBA4U23C8N
✅ Drop-In✓ Em estoque
$138.2 / unidade
Ver ficha técnica →5CSEBA4U23C7N
✅ Drop-In✓ Em estoque
$124.5 / unidade
Ver ficha técnica →5CSEBA4U23C6N
✅ Drop-In✓ Em estoque
$86.2 / unidade
Ver ficha técnica →5CSEBA4U23A7N
✅ Drop-In✓ Em estoque
$185 / unidade
Ver ficha técnica →5CSEBA6U23I7N
✅ Drop-In✓ Em estoque
$51.8 / unidade
Ver ficha técnica →5CSEMA2U23C6N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
5CSEBA4U23I7LN Classificações máximas e características elétricas
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 40,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore |
| Processor Clock Speed | 925 MHz |
| Encapsulamento | 672-pin UBGA (23x23 mm) |
| Temperatura de operação | -40C to +100C (Industrial) |
| Tipo de montagem | Surface Mount |
| Process Technology | 28nm TSMC low-power |
| Transceivers | 3.125 Gbps (per Cyclone V family) |
| External Memory Interface | DDR3, DDR2, LPDDR2 (controller integrated in HPS + soft IP in FPGA fabric) |
| Nível MSL | 3 |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Guia de Configuração de Pinos do 5CSEBA4U23I7LN 672-pin ubga (23x23 mm)
Configuração de pinos para 5CSEBA4U23I7LN (pacote 672-pin ubga (23x23 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 5CSEBA4U23I7LN.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
5CSEBA4U23I7LN é adequado para 6 aplicaçãos: Industrial Machine Vision Camera, Motor Drive and Servo Control, Broadcast Video Processing, Test and Measurement Instrumentation, Automotive Driver Assistance (ADAS), Industrial IoT Edge Gateway.
Industrial Machine Vision Camera
The 5CSEBA4U23I7LN is ideal for industrial machine vision cameras that interface with GigE Vision or CoaXPress image sensors. Its 40K Logic Elements can host hardware-accelerated image preprocessing pipelines (debayering, lens distortion correction, edge detection) in parallel while the dual ARM Cortex-A9 cores run OpenCV-based classification at up to 925 MHz. The shared coherent memory between FPGA and HPS eliminates copy overhead for frame buffers, reducing latency by 30-50% versus a discrete FPGA + external MCU architecture. Industrial -40C to +100C temperature grade supports IP67 enclosures on factory floors.
Recomendado
Motor Drive and Servo Control
In AC servo drives and industrial motor controllers, the 5CSEBA4U23I7LN combines FPGA-based Field-Oriented Control (FOC) loops with ARM Cortex-A9 motion trajectory planning. The 224 18x18 multipliers in the Cyclone V SE fabric execute Park/Clarke transforms and PID loops with sub-microsecond latency, while the HPS runs EtherCAT or CANopen master stacks. Industrial temperature range supports operation inside motor cabinets at ambient up to +60C. The 672-pin UBGA exposes enough GPIO to interface with encoder feedback (EnDat, BISS, SSI) and 3-phase PWM outputs for multi-axis drives.
Recomendado
Broadcast Video Processing
Broadcast studios use the 5CSEBA4U23I7LN for SDI video format conversion, frame-rate translation, and overlay graphics generation. The FPGA fabric handles SDI encode/decode at up to 3 Gbps (SMPTE 424M), while the ARM cores manage file I/O and network control. The 28nm low-power process keeps total system power under 10W in a 1U rackmount chassis. The 672-ball package provides sufficient GPIO for multi-channel SDI I/O and GPIO control surfaces. Industrial temperature rating suits broadcast truck and outdoor event production.
Recomendado
Test and Measurement Instrumentation
Test equipment manufacturers leverage the 5CSEBA4U23I7LN to combine FPGA-based DSP signal processing with Linux-driven GUI and network control. Use cases include protocol analyzers, oscilloscope DSP pre-processors, and arbitrary waveform generators. The HPS runs a Yocto Linux rootfs hosting Qt-based UIs, while the FPGA implements the real-time DSP. Industrial -40C to +100C operation supports benchtop and portable instrument use cases. The 3.125 Gbps transceivers enable high-speed serial trigger and data links.
Recomendado
Automotive Driver Assistance (ADAS)
For non-safety ADAS subsystems such as surround-view parking assist and driver monitoring, the 5CSEBA4U23I7LN integrates image preprocessing (fisheye correction, lens undistortion, object detection) with H.264 encoding and CAN bus networking. The dual ARM Cortex-A9 cores handle network stacks while the FPGA fabric accelerates vision algorithms. For full automotive -40C to +125C operation, the 5CSEBA4U23A7N variant is recommended. The 672-pin UBGA package supports multi-camera sensor aggregation.
Recomendado
Industrial IoT Edge Gateway
The 5CSEBA4U23I7LN serves as an Industrial IoT edge gateway aggregating Modbus, PROFINET, and EtherCAT fieldbus data into MQTT/HTTPS cloud pipelines. The FPGA fabric implements deterministic fieldbus master cycles, while the ARM Cortex-A9 HPS runs containerized edge analytics and TLS-secured cloud uploads. Industrial temperature range supports DIN-rail mounted enclosures in unconditioned factory spaces. The 672-pin UBGA exposes sufficient GPIO for RS-485, RS-232, and GPIO-based legacy equipment interfaces.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 5CSEBA4U23I7LN — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 5CSEBA4U23C8N | 5CSEBA4U23C7N | 5CSEBA4U23C6N | 5CSEBA4U23A7N | 5CSEBA6U23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin UBGA (23x23 mm) | 672-pin UBGA (23x23) - same | 672-pin UBGA (23x23) - same | 672-pin UBGA (23x23) - same | 672-pin UBGA (23x23) - same | 672-pin UBGA (23x23) - same |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 110,000 |
| HPS Clock Speed | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz | 925 MHz |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Automotive) | -40C to +100C (Industrial) |
| Speed Grade | 7 (industrial) | 8 (commercial) | 7 (commercial) | 6 (commercial) | 7 (automotive) | 7 (industrial) |
| Processor Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Lead-Free / RoHS | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Industrial -40C to +100C temperature grade (vs 5CSEBA4U23C8N)
- Higher logic density (40K LE) at industrial temp (vs 5CSEMA2U23C6N)
- Higher HPS clock speed (925 MHz) (vs 5CSEMA2U23C6N)
Notas de projeto
Estimated: at the maximum 925 MHz HPS clock and full FPGA utilization in 28nm TSMC process, total power consumption is approximately 5-8 W depending on toggle rate. The 672-pin UBGA package dissipates heat primarily through the die-side balls; designing a 4-layer PCB with a continuous ground plane under the BGA and 8 thermal vias in a 3x3 pattern per quadrant drops theta-JA from ~15 C/W (bare BGA) to ~6 C/W. At 8 W total dissipation, this yields a junction temperature rise of ~48 C above ambient - acceptable within the -40C to +100C industrial window but worth verifying against worst-case ambient.
Route DDR3 traces with matched-length matching within +/-25 mil and 100 ohm differential impedance for clocks per the Cyclone V External Memory Interface Handbook. Use a 1.0 mm pitch BGA fanout with 4/4 mil trace/space and microvia-in-pad construction for inner rows. Maintain a continuous reference plane beneath the BGA to provide impedance control; never route signals across a split in the reference plane under the package.
Use IBIS simulation for HPS DDR3 and LVDS interfaces before tape-out. Series damping resistors (22-33 ohm) on LVDS outputs reduce ringback on long backplane traces. For SDI/coaxial interfaces at 3 Gbps, follow AC-coupled 75 ohm design and isolate the connector ground with stitching vias at 1/10 wavelength spacing. The transceivers in this part support up to 3.125 Gbps per the Cyclone V Device Datasheet.
Do not confuse the U23 (672-pin UBGA) package with the U19 (484-pin UFBGA) package - they are NOT pin-compatible despite sharing the same silicon die. Always check the order code suffix (U19 vs U23) before PCB assembly. Boot configuration pins MSEL[3:0] must be pulled to the correct logic levels via 4.7k resistors to select FPP/x16/x32 configuration mode, otherwise the device will not configure from flash.
Informações de conformidade
RoHS compliant and lead-free per Intel product page. The I7LN variant is industrial-grade but NOT AEC-Q100 qualified - select the A7N variant for AEC-Q100 automotive applications. Halogen-free status not explicitly stated in the verified web data.