A3P600-2FG144 - ProASIC3 FPGA, 600K Gates | Microchip
MPN: A3P600-2FG144 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.25 | $382.50 |
| 100 | $34 | $3,400.00 |
| 500 | $30.6 | $15,300.00 |
| 1,000 | $27.2 | $27,200.00 |
Drop-in alternatives for A3P600-2FG144 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600-2FGG144
✅ Drop-In✓ In Stock
$30.4 / Unit
View Datasheet →A3P600-2FG144I
✅ Drop-In📋 Reference alternative (not in catalog)
A3P600-2FG144II
✅ Drop-In📋 Reference alternative (not in catalog)
A3P600-FG144
✅ Drop-In✓ In Stock
$15.6 / Unit
View Datasheet →A3P600-FG144I
✅ Drop-In✓ In Stock
$15.6 / Unit
View Datasheet →A3P600-FGG144
✅ Drop-In✓ In Stock
$49.8 / Unit
View Datasheet →A3P600-FGG144I
✅ Drop-In✓ In Stock
$27.2 / Unit
View Datasheet →A3P600L-1FG144I
✅ Drop-In✓ In Stock
$32.16 / Unit
View Datasheet →A3P600-2FG144 Maximum Ratings & Electrical Characteristics
| Series | ProASIC3 |
| Number of Logic Elements/Cells | 13824 CLBs |
| Total RAM Bits | 110592 bits |
| Number of I/O | 97 |
| Number of Gates | 600000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Package / Case | 144-LBGA |
| Supplier Device Package | 144-FPBGA (13x13) |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Maximum Clock Frequency | 350 MHz |
| Number of PLLs | 6 |
| FlashROM | 1024 bits |
| RoHS Status | RoHS non-compliant |
| Packaging | Tray |
| Manufacturer Lead Time | 8 weeks |
A3P600-2FG144 Pin Configuration
| Pin 1 | IO — User I/O (Bank 0) |
| Pin 2 | IO — User I/O (Bank 0) |
| Pin 3 | IO — User I/O (Bank 0) |
| Pin 4 | IO — User I/O (Bank 0) |
| Pin 5 | IO — User I/O (Bank 0) |
| Pin 6 | IO — User I/O (Bank 0) |
| Pin 7 | IO — User I/O (Bank 0) |
| Pin 8 | IO — User I/O (Bank 0) |
| Pin 9 | IO — User I/O (Bank 0) |
| Pin 10 | IO — User I/O (Bank 0) |
| Pin 11 | IO — User I/O (Bank 0) |
| Pin 12 | IO — User I/O (Bank 0) |
| Pin 13 | IO — User I/O (Bank 0) |
| Pin 14 | IO — User I/O (Bank 0) |
| Pin 15 | IO — User I/O (Bank 0) |
| Pin 16 | IO — User I/O (Bank 0) |
| Pin 17 | IO — User I/O (Bank 0) |
| Pin 18 | IO — User I/O (Bank 0) |
| Pin 19 | IO — User I/O (Bank 0) |
| Pin 20 | IO — User I/O (Bank 0) |
| Pin 21 | IO — User I/O (Bank 0) |
| Pin 22 | IO — User I/O (Bank 0) |
| Pin 23 | IO — User I/O (Bank 0) |
| Pin 24 | IO — User I/O (Bank 0) |
| Pin 25 | IO — User I/O (Bank 0) |
| Pin 26 | IO — User I/O (Bank 0) |
| Pin 27 | IO — User I/O (Bank 0) |
| Pin 28 | IO — User I/O (Bank 0) |
| Pin 29 | IO — User I/O (Bank 0) |
| Pin 30 | IO — User I/O (Bank 0) |
| Pin 31 | IO — User I/O (Bank 0) |
| Pin 32 | IO — User I/O (Bank 0) |
| Pin 33 | IO — User I/O (Bank 0) |
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| Pin 35 | IO — User I/O (Bank 0) |
| Pin 36 | IO — User I/O (Bank 0) |
| Pin 37 | IO — User I/O (Bank 0) |
| Pin 38 | IO — User I/O (Bank 0) |
| Pin 39 | IO — User I/O (Bank 0) |
| Pin 40 | IO — User I/O (Bank 0) |
| Pin 41 | IO — User I/O (Bank 0) |
| Pin 42 | IO — User I/O (Bank 0) |
| Pin 43 | IO — User I/O (Bank 0) |
| Pin 44 | IO — User I/O (Bank 0) |
| Pin 45 | IO — User I/O (Bank 0) |
| Pin 46 | IO — User I/O (Bank 0) |
| Pin 47 | IO — User I/O (Bank 0) |
| Pin 48 | IO — User I/O (Bank 0) |
| Pin 49 | IO — User I/O (Bank 0) |
| Pin 50 | IO — User I/O (Bank 0) |
| Pin 51 | IO — User I/O (Bank 0) |
| Pin 52 | IO — User I/O (Bank 0) |
| Pin 53 | IO — User I/O (Bank 0) |
| Pin 54 | IO — User I/O (Bank 0) |
| Pin 55 | IO — User I/O (Bank 0) |
| Pin 56 | IO — User I/O (Bank 0) |
| Pin 57 | IO — User I/O (Bank 0) |
| Pin 58 | IO — User I/O (Bank 0) |
| Pin 59 | IO — User I/O (Bank 0) |
| Pin 60 | IO — User I/O (Bank 0) |
| Pin 61 | IO — User I/O (Bank 0) |
| Pin 62 | IO — User I/O (Bank 0) |
| Pin 63 | IO — User I/O (Bank 0) |
| Pin 64 | IO — User I/O (Bank 0) |
| Pin 65 | IO — User I/O (Bank 0) |
| Pin 66 | IO — User I/O (Bank 0) |
| Pin 67 | IO — User I/O (Bank 0) |
| Pin 68 | IO — User I/O (Bank 0) |
| Pin 69 | IO — User I/O (Bank 0) |
| Pin 70 | IO — User I/O (Bank 0) |
| Pin 71 | IO — User I/O (Bank 0) |
| Pin 72 | IO — User I/O (Bank 0) |
| Pin 73 | IO — User I/O (Bank 0) |
| Pin 74 | IO — User I/O (Bank 0) |
| Pin 75 | IO — User I/O (Bank 0) |
| Pin 76 | IO — User I/O (Bank 0) |
| Pin 77 | IO — User I/O (Bank 0) |
| Pin 78 | IO — User I/O (Bank 0) |
| Pin 79 | IO — User I/O (Bank 0) |
| Pin 80 | IO — User I/O (Bank 0) |
| Pin 81 | IO — User I/O (Bank 0) |
| Pin 82 | IO — User I/O (Bank 0) |
| Pin 83 | IO — User I/O (Bank 0) |
| Pin 84 | IO — User I/O (Bank 0) |
| Pin 85 | IO — User I/O (Bank 0) |
| Pin 86 | IO — User I/O (Bank 0) |
| Pin 87 | IO — User I/O (Bank 0) |
| Pin 88 | IO — User I/O (Bank 0) |
| Pin 89 | IO — User I/O (Bank 0) |
| Pin 90 | IO — User I/O (Bank 0) |
| Pin 91 | IO — User I/O (Bank 0) |
| Pin 92 | IO — User I/O (Bank 0) |
| Pin 93 | IO — User I/O (Bank 0) |
| Pin 94 | IO — User I/O (Bank 0) |
| Pin 95 | IO — User I/O (Bank 0) |
| Pin 96 | IO — User I/O (Bank 0) |
| Pin 97 | IO — User I/O (Bank 0) |
| Pin 98 | VCC — Core power supply |
| Pin 99 | GND — Ground |
| Pin 100 | VCC — Core power supply |
| Pin 101 | GND — Ground |
| Pin 102 | VCC — Core power supply |
| Pin 103 | GND — Ground |
| Pin 104 | VCC — Core power supply |
| Pin 105 | GND — Ground |
| Pin 106 | VCC — Core power supply |
| Pin 107 | GND — Ground |
| Pin 108 | VCC — Core power supply |
| Pin 109 | GND — Ground |
| Pin 110 | VCC — Core power supply |
| Pin 111 | GND — Ground |
| Pin 112 | VCC — Core power supply |
| Pin 113 | GND — Ground |
| Pin 114 | VCC — Core power supply |
| Pin 115 | GND — Ground |
| Pin 116 | VCC — Core power supply |
| Pin 117 | GND — Ground |
| Pin 118 | VCC — Core power supply |
| Pin 119 | GND — Ground |
| Pin 120 | VCC — Core power supply |
| Pin 121 | GND — Ground |
| Pin 122 | VCC — Core power supply |
| Pin 123 | GND — Ground |
| Pin 124 | VCC — Core power supply |
| Pin 125 | GND — Ground |
| Pin 126 | VCC — Core power supply |
| Pin 127 | GND — Ground |
| Pin 128 | VCC — Core power supply |
| Pin 129 | GND — Ground |
| Pin 130 | VCC — Core power supply |
| Pin 131 | GND — Ground |
| Pin 132 | VCC — Core power supply |
| Pin 133 | GND — Ground |
| Pin 134 | VCC — Core power supply |
| Pin 135 | GND — Ground |
| Pin 136 | VCC — Core power supply |
| Pin 137 | GND — Ground |
| Pin 138 | VCC — Core power supply |
| Pin 139 | GND — Ground |
| Pin 140 | VCC — Core power supply |
| Pin 141 | GND — Ground |
| Pin 142 | VCC — Core power supply |
| Pin 143 | GND — Ground |
| Pin 144 | VCC — Core power supply |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-2FG144 is suitable for 6 applications: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Consumer Electronics, Medical Devices.
Industrial Control Systems
The A3P600-2FG144 is ideal for industrial control systems due to its 600K gates, 97 I/Os, and 350 MHz clock speed, enabling real-time motor control, PLC interfacing, and sensor fusion. Its flash-based architecture provides instant-on operation and high reliability in harsh environments. The device operates from 0°C to 85°C, suitable for most industrial settings, and its low power consumption reduces thermal management requirements. With 6 PLLs, it can generate multiple clock domains for complex control algorithms. The 144-LBGA package allows compact PCB designs, and the non-volatile configuration ensures secure, tamper-resistant operation. Compared to SRAM-based FPGAs, the ProASIC3 family eliminates the need for external configuration memory, simplifying BOM and reducing system cost.
Recommended
Automotive Electronics
In automotive electronics, the A3P600-2FG144 provides a reliable, flash-based FPGA solution for infotainment, ADAS, and body control modules. Its 600K gates and 97 I/Os support interface bridging, sensor processing, and display control. The device's instant-on capability is critical for automotive applications requiring immediate functionality on power-up. Operating from 1.425V to 1.575V, it integrates well with automotive power rails. The 144-LBGA package is compact enough for space-constrained ECUs. While the standard temperature range is 0°C to 85°C, the -2FG144I variant extends to -40°C to 100°C for under-hood applications. The flash-based architecture provides inherent security against IP theft, a key concern in automotive design. Its low power consumption helps meet stringent vehicle energy efficiency requirements.
Recommended
Communications Infrastructure
The A3P600-2FG144 excels in communications infrastructure, offering 600K gates and 97 I/Os for protocol bridging, packet processing, and interface conversion. Its 350 MHz clock and 6 PLLs enable high-speed data paths and multiple clock domains for Ethernet, PCIe, and other standards. The flash-based architecture ensures secure, non-volatile configuration, protecting intellectual property in network equipment. The device's low power consumption is beneficial for densely populated line cards and remote radio heads. Operating from 1.425V to 1.575V, it is compatible with standard communication power supplies. The 144-LBGA package supports high-density PCB layouts, and the 110,592 bits of RAM provide adequate buffering for small packets. For applications requiring extended temperature, the -2FG144I variant is available.
Recommended
Aerospace and Defense
The A3P600-2FG144 is well-suited for aerospace and defense applications due to its flash-based, non-volatile architecture that provides inherent radiation tolerance and security. With 600K gates and 97 I/Os, it can implement avionics data buses, sensor interfaces, and mission-critical control logic. The instant-on capability is essential for safety-critical systems. The device operates from 1.425V to 1.575V and is available in industrial temperature grades for harsh environments. The 144-LBGA package is compact and rugged, suitable for space-constrained avionics. Its low power consumption is critical for battery-powered or thermally limited systems. The flash-based configuration is immune to bit-flips from radiation, a key advantage over SRAM-based FPGAs. For extended temperature ranges, the -2FG144II variant is recommended.
Recommended
Consumer Electronics
In consumer electronics, the A3P600-2FG144 provides a cost-effective, low-power FPGA solution for smart home devices, wearables, and multimedia systems. Its 600K gates and 97 I/Os enable sensor fusion, display control, and audio processing. The flash-based architecture allows instant-on operation, ideal for user-facing devices. Operating from 1.425V to 1.575V, it is compatible with battery-powered designs. The 144-LBGA package is compact, enabling slim product form factors. The device's low power consumption extends battery life in portable devices. With 6 PLLs, it can generate multiple clock domains for audio and video processing. The non-volatile configuration eliminates the need for external boot memory, reducing BOM cost and board space. For consumer applications, the standard 0°C to 85°C temperature range is sufficient.
Recommended
Medical Devices
The A3P600-2FG144 is suitable for medical devices requiring reliable, secure, and low-power programmable logic. Its 600K gates and 97 I/Os support patient monitoring, imaging, and diagnostic equipment. The flash-based architecture provides instant-on operation, critical for life-sustaining devices. Operating from 1.425V to 1.575V, it integrates with medical power systems. The 144-LBGA package is compact for portable medical devices. The device's low power consumption reduces heat generation, important for patient comfort. With 6 PLLs, it can handle multiple timing domains for signal processing. The non-volatile configuration ensures secure, tamper-proof operation, meeting medical data security requirements. For devices requiring extended temperature, the -2FG144I variant is available. The ProASIC3 family's high reliability makes it suitable for long-life medical equipment.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-2FG144 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-2FGG144 | A3P600-2FG144I | A3P600-FG144 | A3P600L-1FG144I |
|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA | 144-LBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Number of I/O | 97 | 97 | 97 | 97 | 97 |
| Max Clock Frequency | 350 MHz | 350 MHz | 350 MHz | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | 0°C ~ 85°C | 0°C ~ 85°C | -40°C ~ 100°C | 0°C ~ 85°C | -40°C ~ 100°C |
| Voltage - Supply | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V | 1.425V ~ 1.575V |
| RoHS Status | RoHS non-compliant | RoHS non-compliant | RoHS non-compliant | RoHS non-compliant | RoHS non-compliant |
Key Differentiators
- Higher speed grade with 350 MHz max clock (vs A3P600-FG144)
- Industrial temperature variant available (vs A3P600-2FGG144)
- Standard LBGA package with 1.00 mm pitch (vs A3P600L-1FG144I)
Design Notes
The A3P600-2FG144 requires a 1.425V to 1.575V core supply. Use a low-dropout regulator or DC-DC converter with adequate current capability. Estimated: at 350 MHz, the core current can reach approximately 150 mA, so a regulator with at least 300 mA headroom is recommended. Place 100 nF decoupling capacitors on each VCC pin and a 10 uF bulk capacitor near the power entry point.
The 144-LBGA package has a 1.00 mm ball pitch. Ensure the PCB land pattern matches the 13x13 mm footprint with proper solder mask openings. Use via-in-pad or microvias for the center balls to improve routing. Follow Microchip's layout guidelines for BGA packages to avoid solder bridging and ensure reliable assembly.
The A3P600-2FG144 operates from 0°C to 85°C. Estimated: at 350 MHz with 97 I/Os toggling, power dissipation can reach 1.5W. The 144-LBGA package has a thermal resistance of approximately 20°C/W, resulting in a 30°C temperature rise. Ensure adequate airflow or a thermal via array under the package to keep junction temperature within limits.
Compliance Information
RoHS non-compliant per Microchip USA product page. Lead-free status is no. Other compliance data not provided.
