EP1SGX25DF1020I6N - Stratix GX FPGA, 25K LE, 1020-BGA | Intel
MPN: EP1SGX25DF1020I6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $252 | $2,520.00 |
| 100 | $215 | $21,500.00 |
| 500 | $188 | $94,000.00 |
| 1,000 | $165 | $165,000.00 |
Drop-in alternatives for EP1SGX25DF1020I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25DF1020I5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$985 / Unit
View Datasheet →EP1SGX40DF1020I6N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1SGX25DF1020I6N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Series | EP1SGX25 |
| Logic Elements | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| User I/Os | 607 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Multi-Gigabit Transceivers | Integrated (up to 3.125 Gbps per channel) |
| Package | 1020-ball FC-FBGA, 33 mm × 33 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Lead Finish | Lead Free |
| Operating Temperature | 0 °C to +85 °C (industrial) |
| RoHS Status | Compliant |
| Memory | Embedded TriMatrix memory blocks |
| DSP Blocks | Integrated DSP blocks for fixed/floating-point arithmetic |
| Clock Management | PLLs with dynamic phase alignment (DPA) |
| Grade Identifier | I6 (industrial, speed grade 6) |
| Manufacturer | Intel (formerly Altera) |
EP1SGX25DF1020I6N 1020-ball fc-fbga, 33 mm × 33 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX25DF1020I6N (1020-ball fc-fbga, 33 mm × 33 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF1020I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF1020I6N is suitable for 7 applications: Telecom Line-Card Packet Processing, PCI Express Endpoint / Root Complex, Software-Defined Radio Baseband, Military / Aerospace Signal Processing, Broadcast Video Processing, High-Speed Test and Measurement Equipment, Storage Area Network (SAN) Controllers.
Telecom Line-Card Packet Processing
The EP1SGX25DF1020I6N is widely used in telecom line cards that aggregate and forward Ethernet/IP traffic between backplane fabrics and framer SERDES. Its integrated multi-gigabit transceivers (up to 3.125 Gbps per channel) implement SPI-4.2, SFI-4.1, or Serial RapidIO interconnects directly, eliminating external PHY devices and shrinking BOM cost. With 25,660 logic elements and dedicated DSP blocks, the FPGA can run header parsing, classification, and queuing logic for OC-192/STM-64 line rates. The 607 user I/Os also accommodate parallel UTOPIA / POS-PHY Level-3 or NPU look-aside interfaces common in legacy line-card designs.
Recommended
PCI Express Endpoint / Root Complex
With 3.125 Gbps multi-gigabit transceivers and embedded 8B/10B PCS, the EP1SGX25DF1020I6N is a common Altera platform for PCI Express x1/x4/x8 endpoints and root complex designs. The hard IP supports PCIe Gen1 at 2.5 Gbps directly, and the FPGA fabric implements the transaction layer, DMA engines, and application logic. The 25,660 logic elements comfortably host x4 Gen1 endpoint controllers with DMA and BAR mapping, while 607 user I/Os expose local bus interfaces to ASICs, NPUs, or memory controllers. PCI-SIG compliance requires careful PCB reference-clock routing and the Stratix GX datasheet provides application note guidance.
Recommended
Software-Defined Radio Baseband
The EP1SGX25DF1020I6N's DSP blocks, embedded memory, and 3.125 Gbps transceivers make it suitable for software-defined radio (SDR) baseband processing in defense and commercial wireless systems. Up/down-conversion, channelization, and digital filtering run efficiently on the dedicated DSP blocks, while ADC/DAC samples interface through LVDS user I/Os at hundreds of MHz. The transceivers carry digitized IF or digitized RF to/from ADC daughter cards. Industrial-grade temperature (0 °C to 85 °C) suits outdoor base-station deployments, and Quartus II IP libraries support common waveforms such as WCDMA, LTE, and tactical radio protocols.
Recommended
Military / Aerospace Signal Processing
The EP1SGX25DF1020I6N's industrial temperature range, mature tooling, and long-term availability in the Altera/Intel legacy portfolio make it a preferred platform for defense and aerospace programs with 15- to 20-year lifecycle expectations. Applications include radar signal preprocessing, electronic-countermeasure (ECM) front ends, satellite modem baseband, and flight-control test fixtures. The 1.0 mm-pitch FC-FBGA tolerates high-shock and high-vibration environments when paired with underfill, and the industrial temperature grade suits both ground and airborne platforms. Defense customers value the EP1SGX25DF1020I6N for its predictable long-term support and established certification trail.
Recommended
Broadcast Video Processing
Broadcast video routers, format converters, and contribution encoders benefit from the EP1SGX25DF1020I6N's combination of high logic density and high I/O count. SDI de/embedding, up/down/cross-conversion between SD-SDI (270 Mbps), HD-SDI (1.485 Gbps), and 3G-SDI (2.97 Gbps) can be implemented in the fabric, while housekeeping, audio embedding, and ancillary data parsing run alongside. The 25,660 logic elements support multi-channel processing on a single device, and the 607 user I/Os accommodate external memory buses (DDR2/QDRII) and parallel video ports. Long-term availability is critical for broadcast plant equipment that operates 24/7 for a decade or more.
Recommended
High-Speed Test and Measurement Equipment
Test & measurement instruments such as logic analyzers, protocol analyzers, BER testers, and high-speed digitizers leverage the EP1SGX25DF1020I6N's transceivers and parallel LVDS I/Os. Multi-gigabit links probe serial buses (PCI Express, SATA, USB 3.0, Serial RapidIO) for compliance and debug, while LVDS user I/Os sample DUT waveforms at sub-ns rates. The 25,660 logic elements and embedded TriMatrix memory support deep trace buffers and real-time protocol decoding. Industrial-grade temperature and lead-free packaging satisfy RoHS requirements for global commercial test equipment shipments.
Recommended
Storage Area Network (SAN) Controllers
The EP1SGX25DF1020I6N serves as a SAS/SATA expander or Fibre Channel controller in enterprise SAN equipment. Multi-gigabit transceivers implement 3 Gbps SAS/SATA or 4 Gbps Fibre Channel links, and 25,660 logic elements support RAID engines, encryption accelerators, and management interfaces. The 607 user I/Os connect to DDR2 memory for caching, to management processors, and to backplane LEDs. Industrial temperature and 130 nm CMOS robustness suit data-center operating conditions, while the mature Quartus II toolchain accelerates time-to-market for OEM storage vendors.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF1020I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF1020I5N | EP1SGX40DF1020I6N |
|---|---|---|---|
| Brand | Intel | Intel | Intel |
| Family | Stratix GX | Stratix GX | Stratix GX |
| Package | 1020-ball FC-FBGA, 33×33 mm, 1.0 mm pitch | 1020-ball FC-FBGA, 33×33 mm, 1.0 mm pitch — same | 1020-ball FC-FBGA, 33×33 mm, 1.0 mm pitch — same |
| Logic Elements | 25,660 | 25,660 (same die) | 41,250 (~61% more) |
| CLBs | 2,566 | 2,566 (same) | [DATA_NEEDED: 4,125 estimated] |
| User I/Os | 607 | 607 (same) | [DATA_NEEDED: ~600 same package] |
| Speed Grade | 6 (slower) | 5 (faster, ~10–15% higher Fmax) | 6 (same) |
| Core Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V (same) | 1.425 V to 1.575 V (same) |
| Operating Temperature | 0 °C to +85 °C (industrial) | 0 °C to +85 °C (industrial, same) | 0 °C to +85 °C (industrial, same) |
| Lead Free / RoHS | Lead free, RoHS compliant | Lead free, RoHS compliant (same) | Lead free, RoHS compliant (same) |
Key Differentiators
- Higher transceiver data rate per channel (3.125 Gbps) vs non-GX Stratix (vs EP1S40F1020C6N)
- Pin-compatible higher-density upgrade path within same 1020-ball package (vs EP1SGX40DF1020I6N)
- Mature, long-term-supported legacy platform with extensive Quartus II IP (vs Cyclone V E FPGA)
Design Notes
Multi-gigabit transceiver (MGT) channels on the EP1SGX25DF1020I6N require controlled-impedance differential pairs (100 Ω ±10%) with continuous reference plane on adjacent layers. Minimize via count; use blind/buried vias where the PCB stack-up allows. Match intra-pair skew to <0.5 ps and inter-pair skew per protocol (PCIe: 5 ps, RapidIO: 2 ps). Isolate MGT power islands (VCCR, VCCT) from core and I/O supplies using ferrite beads and star-grounding. Reference clock jitter must be <3 ps RMS to meet 3.125 Gbps link budget per the Stratix GX datasheet.
The 1020-ball FC-FBGA package dissipates up to ~10 W under full MGT and logic utilization. Without airflow, junction temperature can exceed 100 °C, derating internal clock rates. Provide forced-air cooling (≥150 LFM) in production enclosures, and use thermal vias beneath the BGA grid connecting to internal copper planes. Estimated: at 8 W dissipation with θJA ≈ 12 °C/W (4-layer JEDEC test board), junction temperature rises 96 °C above 25 °C ambient, giving 121 °C — above the 85 °C industrial limit. Add a heatsink or increase airflow for production.
Power-on sequence for the EP1SGX25DF1020I6N must follow the Stratix GX datasheet: VCCIO first, then VCCINT, then VCCR/VCCT (transceiver analog). Reverse sequencing or simultaneous ramp can cause latch-up. Use a dedicated power-supply sequencer or FPGA-supervisor IC. Hold the nCONFIG pin low until all rails are stable, and respect the tRAMP specification for monotonic ramp. Decouple each VCC pin with 0.1 µF + 10 µF capacitors placed within 5 mm of the ball.
Do not assume EP1SGX25 variants are fully bitstream-compatible: the EP1SGX25DF1020I6N speed grade 6 and EP1SGX25DF1020I5N speed grade 5 use the same silicon but require re-compilation in Quartus II to select the correct timing model. A design that closes timing at speed grade 6 may fail at speed grade 5 only because of unrelated RTL changes; always re-validate timing after device swap. Also confirm that the user I/O bank voltage and clock pin assignments match the new device variant.
Compliance Information
Lead-free per Alldatasheet listing (LEF indicator in package code). RoHS compliance inferred from 'LEAD FREE' package code and Intel/Altera product page. AEC-Q100 not applicable (FPGA is not an automotive-qualified IC; consult Intel automotive FPGA families for that market). Halogen-free status not stated in the verified web data — set to unknown.
