EP20K100FC324-1V - 100K Gates APEX-20K FPGA, 324-FBGA | Intel
MPN: EP20K100FC324-1V ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165.5 | $1,655.00 |
| 100 | $142.75 | $14,275.00 |
| 250 | $130.2 | $32,550.00 |
| 500 | $118.4 | $59,200.00 |
Drop-in alternatives for EP20K100FC324-1V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K100FC324-1
✅ Drop-In✓ In Stock
$50.75 / Unit
View Datasheet →EP20K100FC324-2X
✅ Drop-In✓ In Stock
$110.11 / Unit
View Datasheet →EP20K100EFC324-2X
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →EP20K100EFC324-1N
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EP20K1000CF33I8N
✅ Drop-In✓ In Stock
$210 / Unit
View Datasheet →EP20K60EFC324-2N
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K100FC324-1V Maximum Ratings & Electrical Characteristics
| Series | APEX-20K® |
| Number of Logic Elements / Cells | 4160 |
| Total RAM Bits | 53248 |
| Number of Gates (typical) | 100000 |
| Number of I/O | 252 |
| Supply Voltage - Core (VCCINT) | 2.375 V to 2.625 V |
| Supply Voltage - I/O (VCCIO) | 3.0 V / 3.3 V / 5.0 V tolerant (per I/O standard) |
| Speed Grade | -1V (commercial) |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
| Package / Case | 324-FBGA (FineLine BGA, 19x19 mm) |
| Supplier Device Package | 324-FBGA |
| Number of PLLs | 4 |
| I/O Standards Supported | LVCMOS, LVTTL, PCI, SSTL, GTL+, HSTL |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
| Programming Interface | JTAG (IEEE 1149.1) / in-system |
EP20K100FC324-1V 324-fbga Pin Configuration Guide
Complete pinout information for EP20K100FC324-1V (324-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K100FC324-1V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K100FC324-1V is suitable for 6 applications: Telecommunications Line Card Interface, ASIC Prototyping, DSP Datapath Acceleration, PCI Bus Interface Bridge, Industrial Control Glue Logic Consolidation, High-Speed Data Acquisition Backplane.
Telecommunications Line Card Interface
The EP20K100FC324-1V is well suited to telecom line card designs where 100K gates of programmable logic implement framing, HDLC controllers, ATM SAR functions, and glue logic between PHY and network processors. With 53,248 bits of embedded SRAM and 252 user I/Os, the device can host multiple FIFO buffers for traffic shaping while leaving sufficient I/O for 32-bit UTOPIA/POS-PHY interfaces and an external TCAM interface. The four on-chip PLLs synthesize multiple clock domains required by SDH/SONET backplanes. According to Altera's APEX-20K application notes, this density tier targets mid-range line cards at STM-1/OC-3 and below, where the MultiCore architecture lets designers place LUT-based datapaths alongside product-term state machines in one fabric, reducing board area compared with separate CPLD plus ASIC solutions.
Recommended
ASIC Prototyping
Engineers use the EP20K100FC324-1V to prototype ASIC designs at clock rates up to the device Fmax before committing to mask tooling. The 4,160 logic elements and 100K-gate capacity map cleanly to mid-complexity ASICs, and the 53,248 bits of embedded SRAM act as a scratchpad for verification testbenches. Quartus II provides pre-synthesis resource estimation that helps validate gate count and pin assignment before ASIC handoff. The 324-FBGA footprint also lets prototyping boards reuse the same PCB layout that later hosts the packaged ASIC, accelerating mechanical integration. According to the APEX-20K handbook, the MultiCore fabric supports incremental compile, allowing RTL changes between prototype spins without re-running full place-and-route on the unchanged hierarchy.
Recommended
DSP Datapath Acceleration
The EP20K100FC324-1V accelerates DSP datapaths by hosting custom FIR/IIR filters, FFT engines, and CRC calculators alongside a host DSP processor. The MultiCore EABs deliver dual-port RAM blocks ideal for coefficient storage and data buffering, while the LUT-based logic implements multiplier-accumulator trees. The four PLLs derive the multiple clock domains needed for sample-rate conversion and parallel datapath pipelining. According to Altera APEX-20K DSP application notes, the 100K-gate density is sufficient for 16-bit fixed-point FFTs up to 1024 points, parallel multiplier arrays, and Reed-Solomon codecs. The 252 user I/Os accept wide parallel data buses from external ADCs and DACs without bus multiplexing.
Recommended
PCI Bus Interface Bridge
The EP20K100FC324-1V implements PCI 2.2 compliant bus bridges between legacy PCI slots and modern local buses, with on-chip PLLs generating the 33 MHz or 66 MHz PCI clock. The device's 252 user I/Os are sufficient for a 32-bit/64-bit PCI bus plus a parallel local bus and interrupts. Quartus II includes a pre-verified PCI megafunction that maps onto the APEX-20K logic and EABs, dramatically shortening development time. The device supports the 3.3 V PCI signaling standard natively and tolerates 5 V inputs via clamping diodes. According to the APEX-20K datasheet, the on-chip PLLs can deskew the PCI clock with respect to the local bus clock, which simplifies PCB routing in systems where the PCI connector is physically distant from the FPGA.
Recommended
Industrial Control Glue Logic Consolidation
The EP20K100FC324-1V consolidates multiple discrete 74-series logic ICs, small PLDs, and FIFO chips into a single programmable device, reducing PCB area, BOM cost, and inventory complexity. Industrial control systems benefit from in-system programmability via JTAG, allowing field upgrades to logic without board rework. The -1V speed grade provides adequate timing margin for typical 25-50 MHz control bus rates. With 252 user I/Os and embedded EABs, the device handles encoder counters, PWM generators, and communication protocol stacks (Modbus, CAN, SPI, I2C) simultaneously. According to Altera industrial reference designs, the APEX-20K family is qualified for industrial temperature grades in the -1N variant when the application demands it.
Recommended
High-Speed Data Acquisition Backplane
The EP20K100FC324-1V is deployed in data acquisition backplanes that aggregate multiple ADC channels into a processing pipeline. The 252 user I/Os accept wide parallel LVDS or parallel CMOS buses from multiple converters, while the 53,248 bits of embedded SRAM buffer samples between acquisition and DMA transfer. Four on-chip PLLs generate per-channel sampling clocks with programmable phase offsets for interleaved ADC systems. The MultiCore architecture supports state-machine-driven acquisition sequencing alongside LUT-based preprocessing (gain/offset correction, decimation). According to APEX-20K datasheet timing specifications, the device supports LVDS I/O at rates sufficient for 16-bit, 100 MSPS ADC interfaces when using the -1V speed grade, making it appropriate for radar, ultrasound, and instrumentation front ends.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100FC324-1V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100FC324-1 | EP20K100FC324-2X | EP20K100EFC324-2X | EP20K100EFC324-1N | EP20K60EFC324-2N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 324-FBGA | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Number of Gates (typical) | 100000 | 100000 | 100000 | 100000 | 100000 | 60000 |
| Logic Elements / Cells | 4160 | 4160 | 4160 | 4160 | 4160 | 2560 (approximately) |
| Total RAM Bits | 53248 | 53248 | 53248 | 53248 | 53248 | [DATA_NEEDED] |
| Speed Grade | -1V (commercial, faster) | -1 (commercial, base) | -2X (commercial, slower) | -2X (enhanced silicon) | -1N (industrial) | -2N (industrial, slower) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Number of User I/O | 252 | 252 | 252 | 252 | 252 | [DATA_NEEDED: confirm 252] |
| Core Voltage (VCCINT) | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Fastest commercial speed grade in the 324-FBGA footprint (vs EP20K100FC324-2X)
- Pure commercial temperature range vs industrial alternative (vs EP20K100EFC324-1N)
- Mid-tier density with abundant I/O for bus-rich designs (vs EP20K60EFC324-2N)
Design Notes
The EP20K100FC324-1V requires both a 2.5 V core supply (VCCINT, 2.375-2.625 V) and a separate I/O supply (VCCIO). Power sequencing should ramp VCCINT before VCCIO to prevent I/O latch-up; many Altera reference designs use a Schottky diode and RC delay network to enforce this. Place 0.1 µF ceramic decoupling capacitors within 100 mils of every VCCINT and VCCIO pin, plus bulk 47-100 µF tantalum or polymer capacitors near the package. The four PLL analog supply pins (VCCA_PLL) must be filtered with a ferrite bead and decoupled with 10 µF + 0.1 µF capacitors to suppress clock jitter.
The 324-FBGA package uses a 1.0 mm ball pitch on a 19x19 mm body. PCB design requires microvia or via-in-pad technology for signal fan-out; conventional through-hole vias cannot escape the inner rows without violating design rules. Use a 4-6 layer stackup with continuous GND planes beneath the device for controlled impedance (typically 50 ohm single-ended, 100 ohm differential for LVDS pairs). Match trace lengths within 150 mils for clock pairs feeding the PLL inputs to minimize skew.
Three pitfalls commonly bite designers working with the EP20K100FC324-1V: (1) ignoring the I/O bank VCCIO grouping - mixing 3.3 V and 5 V inputs in the same bank can damage inputs without proper clamping; (2) forgetting the nCONFIG / nSTATUS pull-up resistors required for proper configuration - leaving them floating causes configuration failure at power-up; (3) substituting a different speed grade without re-running Quartus II timing analysis - the -1V internal timing model differs from -1, -2X, and -3N grades.
Estimated: The 324-FBGA package typically has theta-JA around 15-20 C/W on a JEDEC-compliant 4-layer test board with adequate copper. At typical APEX-20K dynamic power consumption of 0.5-1.5 W for a 50% utilization design switching at 100 MHz, junction temperature rise is 10-30 C above ambient. For power-dense designs, attach a heatsink or use forced airflow to keep Tj below 125 C. The -1N industrial variant tolerates ambient temperatures up to 100 C but requires derating above 85 C ambient.
The APEX-20K I/O drivers have fast edge rates (1-2 ns rise/fall) that can cause significant ringing on improperly terminated traces. Use series damping resistors (22-33 ohm) on long PCB traces and verify signal integrity with IBIS models in HyperLynx or similar tools before fabrication. For LVDS signaling, maintain 100 ohm differential impedance and keep pair matching within 50 mils. The dedicated PLL clock inputs (CLK pins) require clean signals - isolate them from switching outputs on the board.
Compliance Information
RoHS/REACH compliance data was not present in the verified web data; field set to unknown. The APEX-20K family pre-dates widespread AEC-Q100 automotive adoption, so this part is not automotive-qualified.
