EP20K100FC324-1 - APEX-20K FPGA 4160 LE 252 I/O | Altera
MPN: EP20K100FC324-1 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.4 | $68.40 |
| 10 | $62.1 | $621.00 |
| 100 | $56.8 | $5,680.00 |
| 500 | $53.2 | $26,600.00 |
| 1,000 | $50.75 | $50,750.00 |
Drop-in alternatives for EP20K100FC324-1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K100FC324-1X
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K100FC324-1V
✅ Drop-In✓ In Stock
$118.4 / Unit
View Datasheet →EP20K100FC324-1N
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K100FC324-2
✅ Drop-In✓ In Stock
$18.9 / Unit
View Datasheet →EP20K100FC324-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$42.1 / Unit
View Datasheet →EP20K100FC324-1 Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Series | APEX-20K |
| Number of Logic Elements/Cells | 4160 |
| Total RAM Bits | 53248 bits |
| Number of User I/Os | 252 |
| Core Supply Voltage | 2.5 V |
| Package / Case | 324-BGA (FC324) |
| Supplier Device Package | 324-FBGA |
| Number of Pins | 324 |
| Mounting Type | Surface Mount |
| Operating Temperature Range | 0 °C to +85 °C |
| Architecture | MultiCore: LUT logic + product-term logic + embedded memory |
| Speed Grade | -1 |
| Configuration Memory | SRAM-based (external configuration device required) |
| RoHS Compliance | Unknown; lead-free -1N suffix variant exists |
EP20K100FC324-1 324-fbga Pin Configuration Guide
Complete pinout information for EP20K100FC324-1 (324-fbga package) with 324 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K100FC324-1.
Refer to the datasheet for full pin configuration.
Estimated pin count: 324 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K100FC324-1 is suitable for 6 applications: Telecommunications Line Card Bridging, Industrial Control Glue Logic, Protocol Conversion and Bus Bridging, ASIC Prototyping and Pre-Silicon Validation, Video and Broadcast Processing, High-Performance Embedded Test Instrumentation.
Telecommunications Line Card Bridging
The EP20K100FC324-1 is well suited to telecom line cards that need flexible packet or cell bridging between backplane buses and local framers. Its 252 user I/Os provide enough signals for parallel address/data buses, control strobes, and status lines, while the 53,248 RAM bits allow small FIFOs and mailbox buffers to be implemented inside the FPGA without adding external SRAM. The 4,160 logic elements are sufficient for bus arbitration, address decoding, parity checking, and simple protocol state machines. Designers can use the programmable MultiCore architecture to mix LUT-based control logic with product-term-style status and interrupt logic. Because the device is SRAM-based, line-card firmware can update the bridging logic in the field through a management processor or JTAG, reducing the cost of hardware re-spins. Place the FPGA close to the backplane connector and provide adequate 2.5-V core decoupling to maintain signal integrity on high-speed parallel paths.
Recommended
Industrial Control Glue Logic
In industrial controllers, the EP20K100FC324-1 replaces multiple CPLDs and discrete address-decoding circuits with a single FPGA. The product-term-compatible logic blocks are efficient for implementing chip selects, register decoding, and fault latching, while the LUT-based fabric handles more complex sequential functions. With 252 I/Os, the device can connect to a host microcontroller, several ADCs, DACs, quadrature encoders, opto-isolators, and fieldbus interface chips without adding external bus switches. Its 2.5-V core plus configurable I/O signaling permits bridging between 3.3-V and 5-V tolerant control logic when the I/O supply is selected correctly. The 0 °C to +85 °C commercial temperature range covers most indoor industrial cabinet environments. A configuration device such as the EPC2 loads the design at power-up, and a JTAG header supports field diagnostics and firmware updates, which is valuable for maintaining a standardized control platform across multiple product variants.
Recommended
Protocol Conversion and Bus Bridging
The EP20K100FC324-1 can implement protocol conversion between parallel CPU buses, UART-style serial ports, SPI, and simple external memory interfaces. Its 4,160 logic elements provide ample resources for FIFO control, byte packing, checksum generation, and small state machines. The 53,248 bits of embedded RAM are useful for transmit and receive buffers deep enough to smooth timing jitter between asynchronous clock domains. With 252 I/Os, a wide bus interface can be brought directly to the FPGA, reducing the need for level translators where I/O voltages are compatible. For system integration, the FPGA can also use an embedded product-term mode to generate fast flag and interrupt signals without consuming LUT resources. Since the APEX-20K MultiCore architecture combines these functions inside one package, the bridge occupies less board area than a multi-chip CPLD plus SRAM solution. Care should be taken to configure external EPC boot memory for automatic power-up loading.
Recommended
ASIC Prototyping and Pre-Silicon Validation
The EP20K100FC324-1 is useful for prototyping ASIC control logic before committing to custom silicon. It provides 4,160 LUT-based logic elements, enough for RTL blocks such as FIFO controllers, register files, or DSP control state machines. The 252 I/Os allow connection to test instruments, prototype memories, and motherboard interfaces, allowing early hardware-software co-validation. Because the FPGA is reconfigurable, engineers can synthesize a new build, download it through JTAG, and test immediately, shortening each iteration. The embedded 53,248 RAM bits emulate small scratchpad memories and FIFOs so the prototype is more representative than a CPLD implementation. Although the APEX-20K family is older and consumes more power than modern FPGAs, it can still validate non-timing-critical control logic and interface behavior. For final performance sign-off, a speed-grade -1 part should be used because the -1 suffix is the fastest timing grade in the FC324 package.
Recommended
Video and Broadcast Processing
The EP20K100FC324-1 can be used in broadcast and video equipment for pixel-format conversion, timing synchronization, and small scan-line buffers. The 53,248 bits of embedded RAM are sufficient for line-length FIFOs on standard-definition video signals, while the 252 I/Os connect to video ADCs, DACs, and a host pixel bus. Logic elements implement horizontal/vertical counters, blanking generators, and color-space matrix state machines. The MultiCore architecture enables product-term implementation of quick status flags such as sync loss or CRC errors, which is valuable for broadcast monitoring. In video systems that require multiple clock domains, the APEX-20K FPGA can act as a clock-domain crossing buffer by using internal RAM FIFOs with independent read and write enables. Designers should confirm that the required I/O standard is supported by the APEX-20K I/O supply options. The 0 °C to +85 °C temperature range is typical for rack-mounted broadcast equipment.
Recommended
High-Performance Embedded Test Instrumentation
The EP20K100FC324-1 can serve as the programmable core of a benchtop or portable test instrument, handling pattern generation, data acquisition sequencing, and trigger logic. Its 252 I/Os enable connection to multiple comparators, ADC data buses, DAC analog-control outputs, and a host USB/controller interface. The 4,160 logic elements are sufficient for finite-state-machine acquisition control, histogram counters with moderate width, and averaged trigger detection. Embedded RAM buffers captured records before transferring them to a host processor, reducing host interrupt loading. The FPGA can be reconfigured via JTAG to support different measurement personalities on the same hardware, which is a major advantage for multi-function instruments. For high-speed sampling, place the FPGA close to the data converters and use matched trace lengths on the parallel data buses. Because this is an SRAM-based FPGA, a configuration PROM must be provided for standalone power-up when no host is present.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100FC324-1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100FC324-1X | EP20K100FC324-1V | EP20K100FC324-1N | EP20K100FC324-2 | EP20K100FC324-3 |
|---|---|---|---|---|---|---|
| Package | 324-BGA (FC324) | 324-BGA (FC324) | 324-BGA/324-FBGA | 324-BGA | 324-BGA (FC324) | 324-BGA (FC324) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Speed Grade | -1 | -1 | -1 (V suffix) | -1 | -2 | -3 |
| Number of Logic Elements/Cells | 4160 | 4160 | 4160 | 4160 | 4160 | 4160 |
| Total RAM Bits | 53248 bits | 53248 bits | 53248 bits | 53248 bits | 53248 bits | 53248 bits |
| User I/O Count | 252 | 252 | 252 | 252 | 252 | 252 |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V [DATA_NEEDED] | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature Range | 0 °C to +85 °C | 0 °C to +85 °C [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 0 °C to +85 °C [DATA_NEEDED] | 0 °C to +85 °C [DATA_NEEDED] |
Key Differentiators
- Fastest APEX-20K speed grade available in the FC324 package (vs EP20K100FC324-2 / EP20K100FC324-3)
- Same-package ordering variants provide supply-chain flexibility (vs EP20K100FC324-1X / EP20K100FC324-1V / EP20K100FC324-1N)
- MultiCore architecture in a single BGA FPGA (vs discrete CPLD plus external FIFO/RAM)
Design Notes
The EP20K100FC324-1 uses a 2.5-V core supply. Place at least one 0.1 uF ceramic capacitor close to every core power ball, plus a 10 uF bulk capacitor per power region. If I/O banks use a separate VCCIO supply, decouple those pins with the same per-pin 0.1 uF ceramic approach. The exact number of power and ground balls should be confirmed from the Intel/Altera package drawing, and the 2.5-V rail should have a low-impedance plane beneath the BGA area to minimize dynamic voltage droop during logic switching.
Do not treat the -1 suffix as interchangeable with -2 or -3 without re-running timing analysis and re-verifying configuration bitstream compatibility. APEX-20K is SRAM-based, so the FPGA must be configured at power-up. Ensure CONF_DONE and nSTATUS pull-up resistors are connected, and verify that the external EPC or configuration PROM is compatible with the selected boot mode. If the configuration device is missing or misprogrammed, the FPGA will not become active and the 252 I/Os will stay high-impedance, which is easy to misdiagnose as a hardware pin fault.
The FC324 package is a 324-ball BGA. Route high-speed I/O traces out of the inner ball rows using vias-in-pad or dog-bone fanout with small vias, and keep series-termination resistors close to the output pins. BGA packages require a completed PCB escape pattern before the layout is finalized; use the Intel/Altera package file to map every ball. For the configuration and JTAG pins, add a standard 10-pin JTAG header and series resistors for signal integrity. Provide a large ground plane under the BGA to improve thermal conduction and reduce ground bounce.
Compliance Information
No RoHS/REACH statement was included in the verified web data. The EP20K100FC324-1N suffix variant is commonly associated with lead-free/RoHS ordering options, but base -1 compliance should be confirmed from the Altera/Intel datasheet or distributor.
