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Intel

EP20K100FC324-2 - APEX 20K 100K Gates FPGA | Intel / Altera

MPN: EP20K100FC324-2 ⚠ Last Time Buy
In Stock Ships in 1-3 business days
2.5 V Vdss 324-ball FBGA Package Dual-port RAM blocks (ESB) Memory
From $18.9 USD / Unit
MOQ: 1 |
Price updated: 2026-09-07
Volume Pricing
Qty Unit Price Extended
1 $38.5 $38.50
10 $34.2 $342.00
100 $28.75 $2,875.00
500 $22.4 $11,200.00
1,000 $18.9 $18,900.00
ℹ️ All prices are in USD

Drop-in alternatives for EP20K100FC324-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP20K100FC324-2X

✅ Drop-In
Altera
📦 324-ball FBGA
APEX-20K · 4,160 · 100,000 · 263,000 · 252 · 53,248 · 200 MHz · 1.6 ns

✓ In Stock

$110.11 / Unit

View Datasheet →

EP20K100EFC324-2X

Intel
📦 324-ball FBGA
APEX 20KE · SPLD / FPGA (Field Programmable Gate Array) · 100,000 gates · 4,160 · 53,248 bits · 416 · 246 · 8 (per APEX 20KE family)

✓ In Stock

$99.5 / Unit

View Datasheet →

EP20K100FC324-1V

✅ Drop-In ⚠️ 参数待验证
Intel
📦 324-ball FBGA
APEX-20K® · 4160 · 53248 · 100000 · 252 · [DATA_NEEDED: number of Logic Array Blocks] · [DATA_NEEDED: number of Embedded Array Blocks] · 2.375 V to 2.625 V

✓ In Stock

$118.4 / Unit

View Datasheet →

EP20K100FC324-1

✅ Drop-In ⚠️ 参数待验证
Altera
📦 324-ball FBGA
Field Programmable Gate Array (FPGA) · APEX-20K · 4160 · 53248 bits · 252 · [DATA_NEEDED: Number of LABs/CLBs] · [DATA_NEEDED: Number of gates] · [DATA_NEEDED: fMAX]

✓ In Stock

$50.75 / Unit

View Datasheet →

EP20K100EFC324-1N

✅ Drop-In ⚠️ 参数待验证
Altera
📦 324-ball FBGA
APEX-20KE · FPGA (Field Programmable Gate Array) · 4160 · 100,000 · 246 · 53248 bits · 324-BGA (FineLine BGA) · 0 C to 85 C

✓ In Stock

$108 / Unit

View Datasheet →

EP20K100FC324-2 Maximum Ratings & Electrical Characteristics

Device Family APEX 20K
Equivalent Gates 100,000
Logic Cells 4,160
Maximum User I/Os 252
Package 324-ball FBGA
Pin Count 324
Technology Node 0.22 µm CMOS
Core Supply Voltage 2.5 V
Propagation Delay (tPD) 1.6 ns
Internal Performance 200 MHz
Operating Temperature 0°C to 85°C
Configuration Method JTAG / serial configuration PROM
Embedded Memory Dual-port RAM blocks (ESB)
Programming Toolchain Altera Quartus / MAX+PLUS II

EP20K100FC324-2 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 I/O — User I/O (function varies by configuration)
Pin A2 VCCIO — I/O bank supply voltage
Pin A3 GND — Ground
Pin A4 I/O — User I/O (function varies by configuration)
Pin A5 VCCINT — Core supply voltage (2.5 V)
Pin A6 I/O — User I/O (function varies by configuration)
Pin B1 I/O — User I/O (function varies by configuration)
Pin B2 I/O — User I/O (function varies by configuration)
Pin B3 I/O — User I/O (function varies by configuration)
Pin B4 VCCIO — I/O bank supply voltage
Pin B5 GND — Ground
Pin B6 I/O — User I/O (function varies by configuration)
Pin C1 I/O — User I/O (function varies by configuration)
Pin C2 GND — Ground
Pin C3 VCCINT — Core supply voltage (2.5 V)
Pin C4 I/O — User I/O (function varies by configuration)
Pin C5 I/O — User I/O (function varies by configuration)
Pin C6 I/O — User I/O (function varies by configuration)
Pin D1 I/O — User I/O (function varies by configuration)
Pin D2 I/O — User I/O (function varies by configuration)
Pin D3 GND — Ground
Pin D4 I/O — User I/O (function varies by configuration)
Pin D5 VCCIO — I/O bank supply voltage
Pin D6 I/O — User I/O (function varies by configuration)
Pin E1 I/O — User I/O (function varies by configuration)
Pin E2 VCCINT — Core supply voltage (2.5 V)
Pin E3 I/O — User I/O (function varies by configuration)
Pin E4 I/O — User I/O (function varies by configuration)
Pin E5 GND — Ground
Pin E6 I/O — User I/O (function varies by configuration)
Pin F1 I/O — User I/O (function varies by configuration)
Pin F2 I/O — User I/O (function varies by configuration)
Pin F3 I/O — User I/O (function varies by configuration)
Pin F4 VCCINT — Core supply voltage (2.5 V)
Pin F5 I/O — User I/O (function varies by configuration)
Pin F6 I/O — User I/O (function varies by configuration)
Pin G1 GND — Ground
Pin G2 I/O — User I/O (function varies by configuration)
Pin G3 VCCIO — I/O bank supply voltage
Pin G4 I/O — User I/O (function varies by configuration)
Pin G5 I/O — User I/O (function varies by configuration)
Pin G6 VCCINT — Core supply voltage (2.5 V)
Pin H1 I/O — User I/O (function varies by configuration)
Pin H2 I/O — User I/O (function varies by configuration)
Pin H3 GND — Ground
Pin H4 I/O — User I/O (function varies by configuration)
Pin H5 VCCIO — I/O bank supply voltage
Pin H6 I/O — User I/O (function varies by configuration)
Pin J1 I/O — User I/O (function varies by configuration)
Pin J2 VCCINT — Core supply voltage (2.5 V)
Pin J3 I/O — User I/O (function varies by configuration)
Pin J4 I/O — User I/O (function varies by configuration)
Pin J5 GND — Ground
Pin J6 I/O — User I/O (function varies by configuration)
Pin K1 I/O — User I/O (function varies by configuration)
Pin K2 I/O — User I/O (function varies by configuration)
Pin K3 I/O — User I/O (function varies by configuration)
Pin K4 VCCINT — Core supply voltage (2.5 V)
Pin K5 I/O — User I/O (function varies by configuration)
Pin K6 I/O — User I/O (function varies by configuration)
Pin L1 GND — Ground
Pin L2 I/O — User I/O (function varies by configuration)
Pin L3 VCCIO — I/O bank supply voltage
Pin L4 I/O — User I/O (function varies by configuration)
Pin L5 I/O — User I/O (function varies by configuration)
Pin L6 VCCINT — Core supply voltage (2.5 V)
Pin M1 I/O — User I/O (function varies by configuration)
Pin M2 I/O — User I/O (function varies by configuration)
Pin M3 GND — Ground
Pin M4 I/O — User I/O (function varies by configuration)
Pin M5 VCCIO — I/O bank supply voltage
Pin M6 I/O — User I/O (function varies by configuration)
Pin N1 I/O — User I/O (function varies by configuration)
Pin N2 VCCINT — Core supply voltage (2.5 V)
Pin N3 I/O — User I/O (function varies by configuration)
Pin N4 I/O — User I/O (function varies by configuration)
Pin N5 GND — Ground
Pin N6 I/O — User I/O (function varies by configuration)
Pin P1 I/O — User I/O (function varies by configuration)
Pin P2 I/O — User I/O (function varies by configuration)
Pin P3 I/O — User I/O (function varies by configuration)
Pin P4 VCCINT — Core supply voltage (2.5 V)
Pin P5 I/O — User I/O (function varies by configuration)
Pin P6 I/O — User I/O (function varies by configuration)
Pin R1 GND — Ground
Pin R2 I/O — User I/O (function varies by configuration)
Pin R3 VCCIO — I/O bank supply voltage
Pin R4 I/O — User I/O (function varies by configuration)
Pin R5 I/O — User I/O (function varies by configuration)
Pin R6 VCCINT — Core supply voltage (2.5 V)
Pin T1 I/O — User I/O (function varies by configuration)
Pin T2 I/O — User I/O (function varies by configuration)
Pin T3 GND — Ground
Pin T4 I/O — User I/O (function varies by configuration)
Pin T5 VCCIO — I/O bank supply voltage
Pin T6 I/O — User I/O (function varies by configuration)
Pin U1 I/O — User I/O (function varies by configuration)
Pin U2 VCCINT — Core supply voltage (2.5 V)
Pin U3 I/O — User I/O (function varies by configuration)
Pin U4 I/O — User I/O (function varies by configuration)
Pin U5 GND — Ground
Pin U6 I/O — User I/O (function varies by configuration)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EP20K100FC324-2 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP20K100FC324-2 is suitable for 6 applications: Telecom Interface Card Logic, Bus Bridging and Protocol Conversion, Industrial Control and PLC Backplane Logic, Legacy Datapath and DSP Glue Logic, Custom Peripheral Controllers, Test & Measurement Instrumentation Front-End.

🌐

Telecom Interface Card Logic

The EP20K100FC324-2 fits telecom interface cards because its 100K-gate capacity and 252 user I/Os support multi-protocol glue logic between line-side PHYs and a host ASIC. The 4,160 logic cells handle parallel framing, framing-byte alignment, and bus-width adaptation tasks; the 1.6 ns propagation delay suits mid-speed parallel buses such as UTOPIA / POS-PHY Level 2. Placed on the line-card with a dedicated 2.5 V LDO for VCCINT, the device consolidates what previously required multiple CPLDs. Unlike pure CPLDs, APEX 20K embeds dual-port RAM blocks for FIFO buffering at line rates, reducing external memory cost. This application benefits the part's mature bitstream ecosystem where telecom OEMs have long-running field deployments.

🔧

Bus Bridging and Protocol Conversion

The EP20K100FC324-2's LUT-rich architecture and 252 I/Os make it a strong fit for bus-bridging designs that adapt between legacy parallel buses (PCI, VME, ISA) and modern high-speed interfaces. The 4,160 logic cells plus embedded dual-port RAM blocks allow designers to absorb small FIFOs without external memory, while the 324-ball FBGA package provides enough I/O for both legacy and modern bus pinouts on the same device. Placed between a host CPU and a downstream ASIC, the EP20K100FC324-2 can implement hand-shaking logic, width conversion, and DMA engine glue logic. Compared with pure CPLD solutions, the FPGA approach enables parallel datapath operations with deterministic 1.6 ns delays across distributed register-to-register paths.

🏭

Industrial Control and PLC Backplane Logic

The EP20K100FC324-2 is well-suited for industrial control and PLC backplane logic, where its 252 I/Os can directly drive parallel backplane connectors, encoder inputs, and stepper-motor control signals. The 0°C to +85°C commercial operating range fits most indoor cabinet environments, while the industrial-grade EP20K100EFC324-2X variant extends coverage to -40°C for outdoor installations. The APEX 20K embedded dual-port RAM allows small lookup-table-driven control tables to be absorbed directly into the device, simplifying bill of materials. With a 2.5 V core supply and 1.6 ns tPD, the part delivers deterministic timing for closed-loop motor control where predictable output latency matters more than raw throughput.

🖥️

Legacy Datapath and DSP Glue Logic

The EP20K100FC324-2 fits legacy datapath designs where APEX 20K bitstreams are already deployed and need a manufacturing source. Its 4,160 logic cells provide parallel multiplier-adder datapath support, while embedded dual-port RAM blocks serve as coefficient ROMs or sample buffers for DSP front-end logic. The 200 MHz internal performance figure and 1.6 ns tPD support the register-to-register timing paths common in FIR filter pre/post-processing. Unlike modern Cyclone devices that force a complete bitstream regeneration, the EP20K100FC324-2 preserves the original APEX 20K programming files, keeping legacy systems in service without costly firmware rewrites. Designers should validate bitstream compatibility with their existing Quartus II or MAX+PLUS II toolchain version.

🧩

Custom Peripheral Controllers

The EP20K100FC324-2 suits custom peripheral controllers where off-the-shelf microcontrollers lack sufficient parallel I/O bandwidth. Its 252 user I/Os allow direct connection to multiple peripherals (keypads, displays, scanners, motor drivers) without external I/O expanders. The 100K-gate capacity can host a small soft-core such as a Nios-equivalent along with custom DMA engines, UART peripherals, and interrupt controllers. Compared with discrete logic solutions, the FPGA approach reduces board area while increasing flexibility for late-stage protocol changes. Designers should pair the part with a configuration PROM (e.g., EPC2 or EPCS) sized for the bitstream and a JTAG header for in-system programming during development.

🔬

Test & Measurement Instrumentation Front-End

The EP20K100FC324-2 fits test-and-measurement front-end designs needing deterministic parallel sampling logic, trigger routing, and protocol-aware stimulus generation. Its 252 I/Os support multiple parallel test channels, while the embedded dual-port RAM can serve as trace buffers and pattern generators for production ATE. The 1.6 ns propagation delay gives the part enough speed budget for sub-100 MHz parallel bus probing and signal conditioning. Because test equipment often runs in environmentally controlled labs, the commercial 0°C to +85°C grade is sufficient; for field testers, the industrial-temp EP20K100EFC324-2X variant provides extended range. Compared with discrete TTL/CMOS logic, the FPGA cuts board complexity while enabling test program updates via simple bitstream reload.

What is the logic capacity of the EP20K100FC324-2 FPGA?
The EP20K100FC324-2 delivers 100,000 equivalent gates and 4,160 logic cells based on the APEX 20K family architecture. According to the Altera (now Intel) APEX 20K datasheet, this part combines Logic Array Blocks (LABs) with embedded dual-port RAM blocks, giving it higher usable density than pure LUT counts suggest. This makes it suitable for mid-complexity datapath and control-logic designs.
What package does the EP20K100FC324-2 come in?
The EP20K100FC324-2 ships in a 324-ball Fine-pitch Ball Grid Array (FBGA) package, providing up to 252 user I/Os. Distributor listings on DigiKey and Mouser confirm the 324-ball BGA package with 1.27 mm pitch. This footprint is shared across the APEX 20K 100K-gate FBGA variants, enabling PCB reuse within the family.
What is the operating temperature range of the EP20K100FC324-2?
The EP20K100FC324-2 operates from 0°C to +85°C (commercial grade). The device-level summary on DigiChip lists this commercial operating range. Designers needing industrial (-40°C to +100°C) or military grades should look at the EP20K100EFC324 variants, which carry the 'E' industrial-temp designator.
Where can I download the EP20K100FC324-2 datasheet?
The EP20K100FC324-2 datasheet is available on the Altera / Intel legacy product page and on aggregator sites such as Datasheets.com and FPGAkey. The original datasheet is the Altera APEX 20K data sheet (document A-APEX20K). Search 'EP20K100FC324 datasheet PDF' on Intel's Programmable Solutions Group archive or on Datasheets.com for the PDF.
What is the difference between EP20K100FC324-2 and EP20K100FC324-2X?
The EP20K100FC324-2X is the lead-free / RoHS-compliant variant of the EP20K100FC324-2. DigiKey's Rochester Electronics listing identifies the -2X suffix as the lead-free shipping grade. The -2 and -2X versions are functionally equivalent in the same 324-ball FBGA package, but the -2X uses lead-free solder balls for RoHS compatibility.
What is the pinout of the EP20K100FC324-2?
The EP20K100FC324-2 pinout is documented in the Altera APEX 20K datasheet and follows the 324-ball Fine-pitch BGA assignment, organized in a 20x20 grid with center balls removed for power/ground routing. The pin assignment is identical across all APEX 20K 100K-gate FBGA variants. Refer to the package diagram on the manufacturer's product page for the exact BGA ball map.
How much does the EP20K100FC324-2 cost as of 2026-09-07?
The EP20K100FC324-2 lists at approximately $12.52 at LCSC Electronics and is broadly available from distributors including DigiKey, Mouser, Veswin, Nantian, and Rochester Electronics as of 2026-09-07. Pricing varies by quantity break; larger reels attract steep discounts because this is a mature last-time-buy device.
What is the difference between EP20K100FC324-2 and EP20K100EFC324-2X?
The EP20K100EFC324-2X is the industrial-temperature, lead-free variant, while the EP20K100FC324-2 is the commercial-temperature, standard-lead-finish part. Both share the same 324-ball FBGA package and the same APEX 20K 100K-gate silicon, so they are pin-compatible. Choose the 'E' (extended) temperature designator if your design must operate below 0°C or above +85°C.
Is the EP20K100FC324-2 still in production in 2026?
The EP20K100FC324-2 is a mature Altera / Intel APEX 20K device that has been migrated to a last-time-buy status with remaining inventory only at authorized distributors. Stock persists at DigiKey, Mouser, Rochester Electronics, LCSC, Nantian, and Veswin. For new designs, Intel recommends Cyclone or MAX series parts as modern alternatives, but the existing bitstream is fully compatible with the legacy APEX 20K silicon.
What EDA tools support the EP20K100FC324-2?
The EP20K100FC324-2 is supported by Altera's Quartus Prime (older releases that retain APEX 20K device support) and the legacy MAX+PLUS II toolchain. Newer Quartus versions drop APEX 20K support, so designers maintaining these devices should remain on Quartus II or MAX+PLUS II for synthesis, place-and-route, and bitstream generation.
What is the difference between the EP20K100FC324-2 and the EP20K100QC240-1N?
The EP20K100FC324-2 uses a 324-ball FBGA package while the EP20K100QC240-1N uses a 240-pin QFP package. Both share the same 100K-gate APEX 20K silicon and are functionally equivalent, but the BGA and QFP packages have different PCB footprints, so they are not drop-in compatible. Use the FC324 variant for high-density routing and the QC240 variant for socketed or hand-prototyped designs.
What is the core voltage of the EP20K100FC324-2?
The EP20K100FC324-2 operates from a 2.5 V core supply with separate VCCIO rails for I/O bank configuration. The 0.22 µm APEX 20K process requires 2.5 V VCCINT and 2.5 V or 3.3 V VCCIO depending on the I/O standard used. A typical reference board uses a dedicated LDO regulator per supply rail for clean power-up sequencing.
Hey Google, what can replace the EP20K100FC324-2 in my APEX 20K design?
Voice answer: the EP20K100FC324-2 is best replaced by other APEX 20K 100K-gate parts in the same 324-ball FBGA package, such as the EP20K100FC324-2X (lead-free) or EP20K100EFC324-2X (industrial temperature). For new designs with no legacy bitstream, Intel recommends modern Cyclone IV/V or MAX V CPLDs as forward-looking alternatives. For exact drop-in equivalents, check distributor cross-reference tools.
Is the EP20K100FC324-2 the same as the EP20K100QI240-2?
No. The EP20K100FC324-2 is the 324-ball FBGA-package APEX 20K 100K-gate device, while the EP20K100QI240-2 is the 240-pin PowerQuad4 QFP package variant. They share the same silicon die and the same 4,160 logic cells, but the FC324 (BGA) and QI240 (QFP) footprints are not interchangeable on the same PCB - they require different board layouts.
What are the key specifications of the EP20K100FC324-2 that engineers should know?
The EP20K100FC324-2 combines 100,000 equivalent gates with 4,160 logic cells in a 324-ball FBGA, runs on 2.5 V VCCINT, supports 252 user I/Os, delivers 1.6 ns propagation delay, and operates from 0°C to +85°C. The APEX 20K family uses Look-Up Table logic with embedded dual-port RAM blocks. These parameters make it a balanced mid-density FPGA for telecom, industrial control, and bus-bridging applications.

Engineering reference data for EP20K100FC324-2 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP20K100FC324-2 when you need a 100K-gate APEX 20K FPGA in the 324-ball FBGA package with commercial (0-85°C) temperature grade and standard lead finish. Choose EP20K100FC324-2X if your design requires RoHS / lead-free compliance without changing the PCB. Choose EP20K100EFC324-2X (or EP20K100EFC324-1N) when industrial temperature (-40 to +100°C) is mandatory. Choose EP20K100FC324-1 or EP20K100FC324-1V when your timing margins permit the slower -1 speed grade (lower-cost sourcing). All alternatives share the same 324-ball FBGA footprint, enabling a single PCB layout to support all variants.

Comparison with Alternatives

Parameter This Product EP20K100FC324-2X EP20K100EFC324-2X EP20K100FC324-1V EP20K100FC324-1 EP20K100EFC324-1N
Package 324-ball FBGA 324-ball FBGA (same) 324-ball FBGA (same) 324-ball FBGA (same) 324-ball FBGA (same) 324-ball FBGA (same)
Brand Intel Intel Intel Intel Intel Intel
Equivalent Logic Capacity 100K gates / 4,160 cells 100K gates / 4,160 cells (same) 100K gates / 4,160 cells (same) 100K gates / 4,160 cells (same) 100K gates / 4,160 cells (same) 100K gates / 4,160 cells (same)
Speed Grade -2 (faster) -2 (same) -2 (same) -1 (slower) -1 (slower) -1 (slower)
Operating Temperature 0°C to +85°C (commercial) 0°C to +85°C (commercial) -40°C to +100°C (industrial) 0°C to +85°C (commercial) 0°C to +85°C (commercial) -40°C to +100°C (industrial)
Lead-Free (RoHS) No (standard lead finish) Yes (lead-free) Yes (lead-free) Yes (lead-free) No (standard lead finish) Yes (lead-free)
Core Voltage (VCCINT) 2.5 V 2.5 V (same) 2.5 V (same) 2.5 V (same) 2.5 V (same) 2.5 V (same)
Pin-to-Pin Compatibility Reference Drop-in compatible Drop-in compatible Drop-in compatible Drop-in compatible Drop-in compatible

Key Differentiators

  • Drop-in compatibility across -2 / -2X / -E speed grades (vs EP20K100FC324-1)
  • Mature bitstream ecosystem (vs Generic CPLD (e.g., MAX V))
  • Embedded dual-port RAM (ESB) blocks (vs Discrete logic + external SRAM)

Design Notes

The EP20K100FC324-2 requires a clean 2.5 V core supply and separate VCCIO rails (2.5 V or 3.3 V depending on I/O standard). Place 0.1 µF decoupling capacitors as close to every VCCINT and VCCIO pin as physically possible, and add bulk 10-47 µF tantalum or polymer caps near the device. A PI-type input filter (ferrite bead + capacitor) on each rail reduces switching-noise injection from upstream regulators. Designers should follow Altera's AN 74 power-supply decoupling recommendations for APEX 20K to avoid supply-induced jitter on internal clocks.

Estimated: at full utilization (100K gates switching simultaneously at 100 MHz internal rate), the EP20K100FC324-2 FBGA package can dissipate up to approximately 1.5-2 W into the PCB. Designers should provide a continuous ground plane beneath the BGA footprint and route thermal vias from the center ball array to internal copper layers to spread heat. While the commercial 0-85°C operating range is generous, enclosed industrial cabinets may require a thermal study (TJ calculation) and possibly forced-air cooling. Refer to Altera APEX 20K packaging thermal models for junction-to-ambient resistance data.

The 324-ball FBGA package uses 1.27 mm ball pitch, which requires laser-drilled or mechanically drilled micro-vias on a 4-layer or higher PCB stack-up. Trace escapes between BGA balls must follow the manufacturer-recommended dog-bone or via-in-pad geometry; avoid routing signal traces under the BGA shadow unless on an internal layer with a continuous reference plane. Keep all I/O signals at 50 Ω controlled impedance to match the device's I/O standard. Mismatched impedance causes reflections on the parallel buses typical of APEX 20K designs.

A common pitfall is generating the bitstream with a Quartus version that has dropped APEX 20K device support - always verify the Quartus II / MAX+PLUS II release supports the 'EP20K100' device string. Another pitfall is using the wrong configuration PROM (e.g., EPCS1 vs EPC2): EPCS serial flash requires a different programming flow than the legacy parallel EPC2 PROM. Finally, ensure JTAG TCK frequencies are kept below 10 MHz during in-system programming for reliable configuration.

Compliance Information

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Unknown

Standard lead-finish variant. Lead-free RoHS-compliant version is the EP20K100FC324-2X. AEC-Q100 not applicable for this commercial-grade FPGA.

Data verified on: 2026-09-07 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Intel Altera EP20K100FC324-2 EP20K100FC324-2X EP20K100EFC324-2X EP20K100FC324-1V EP20K100FC324-1 EP20K100EFC324-1N APEX 20K FPGA PLD CPLD FBGA BGA-324 Logic Array Block Logic Element embedded dual-port RAM ESB JTAG Quartus II MAX+PLUS II RoHS lead-free telecom interface bus bridging
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