Intel

EP3C16E144I7N - Cyclone III FPGA, 16K LEs, 144-LQFP | Intel/Altera

N.º da peça: EP3C16E144I7N ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.2 V Vdss 144-LQFP Exposed Pad (EQFP-144) Package 20 Speed
A partir de $34.95 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-08
Preços por volume
Qtd. Preço unitário Total
1 $50.07 $50,07
10 $47.5 $475,00
100 $42.85 $4.285,00
500 $38.2 $19.100,00
1.000 $34.95 $34.950,00
ℹ️ Todos os preços estão em USD

EP3C16E144I7N Visão geral

The Intel / Altera EP3C16E144I7N is a Cyclone III Field Programmable Gate Array (FPGA) delivering 15,408 logic elements, 516,096 bits of embedded memory, and 84 maximum user I/O pins in a 144-pin LQFP Exposed Pad package. Built on a low-power 65 nm process, this industrial-temperature-grade device targets cost-sensitive, high-volume applications that require programmable logic without the overhead of high-end Stratix devices.

An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable routing channels, and dedicated hard IP blocks such as memory, PLLs, and transceivers. Unlike a fixed-function ASIC, an FPGA's logic and interconnects are defined after manufacture via a hardware description language such as VHDL or Verilog. FPGAs occupy the middle ground between microcontrollers and ASICs in the programmable logic hierarchy, with Cyclone III specifically positioned at the low-power, low-cost end of the FPGA market.

Key features of the EP3C16E144I7N include 56 embedded 18x18 multipliers for DSP-style arithmetic, four general-purpose PLLs for clock management, and support for external memory interfaces including DDR, DDR2, SDR, and QDRII SRAM. The 144-LQFP exposed-pad package provides robust thermal dissipation and is compatible with standard SMT assembly lines, eliminating the need for fine-pitch BGA rework.

Cyclone III FPGAs use a 1.2 V core supply with separate VCCIO banks that can be set to 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V for mixed-voltage interfacing. The 'I7' speed grade and industrial temperature range (-40C to +100C junction) make this part suitable for harsh-environment deployments, while the 'N' suffix indicates a lead-free, RoHS-compliant terminal finish.

Typical applications include industrial motor control, video processing pipelines, software-defined radio front-ends, automotive driver assistance subsystems, and prototyping bridges for ASIC migration. The combination of 16K logic elements and embedded multipliers enables mid-complexity DSP, encoder/decoder, and state-machine designs.

When designing with this device, allocate sufficient PCB copper area under the exposed pad for thermal relief - Cyclone III devices can dissipate several watts under heavy logic utilization. Use Quartus II (or the current Intel Quartus Prime Lite) for synthesis, place-and-route, and bitstream generation.

This page synthesizes distributor pricing, drop-in Cyclone III variants, and practical design notes not found in the manufacturer datasheet.

Alternativas drop-in para EP3C16E144I7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP3C16E144I7N (mesmo formato e footprint) — diferindo em Process Technology, Operating Temperature, Package, Embedded 18x18 Multipliers, Total Memory Bits.

Intel
Process Technology: 65 nm CMOS
Operating Temperature: -40°C to +100°C (industrial, 'I7' grade)
Total Memory Bits: 423,936 bits
Comparar com EP3C16E144I7N →
Intel
Process Technology: 65 nm
Total Memory Bits: 516,096 bits (63 Kbytes)
Comparar com EP3C16E144I7N →
Altera
Process Technology: 65 nm low-power
Operating Temperature: -40C to +100C (Industrial)
Embedded 18x18 Multipliers: 66
Comparar com EP3C16E144I7N →
Intel
Process Technology: 65 nm TSMC low-power
Operating Temperature: 0C to +85C (commercial)
Package: 144-LQFP Exposed Pad (EQFP-EP), 22x22 mm
Comparar com EP3C16E144I7N →
Intel
Process Technology: 65 nm low-power
Package: 144-pin LQFP Exposed Pad (EQFP-144)
Embedded 18x18 Multipliers: 23
Comparar com EP3C16E144I7N →
Intel
Process Technology: 65 nm TSMC low-power
Operating Temperature: -40C to +100C (Industrial)
Comparar com EP3C16E144I7N →
Intel
Process Technology: 60 nm low-k
Operating Temperature: -40 °C to +100 °C (industrial)
Package: 144-pin EQFP (Enhanced QFP) with exposed pad
Comparar com EP3C16E144I7N →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EP3C16E144C8N

✅ Drop-In
Intel
📦 144-LQFP Exposed Pad
Cyclone III · 15,408 · 516,096 bits (63 Kbytes) · M9K · 56 · 84 · 4 · 65 nm

✓ Em estoque

$22.49 / unidade

Ver ficha técnica →

EP3C16E144C7N

✅ Drop-In
📦 144-LQFP Exposed Pad
same 144-LQFP package, speed grade 7 (same), commercial temp vs industrial temp

📋 Alternativa de referência (fora do catálogo)

EP3C10E144I7N

✅ Drop-In
Intel
📦 144-LQFP Exposed Pad
Cyclone® III · Cyclone III (EP3C) · 10,320 · 423,936 bits · 46 M9K blocks · 23 · 2

✓ Em estoque

$39.92 / unidade

Ver ficha técnica →

EP3C25E144I7N

✅ Drop-In
Altera
📦 144-LQFP Exposed Pad
Cyclone III · Cyclone III · 24,624 · 608,256 bits · 66 M9K blocks · 66 · 4 · 82

✓ Em estoque

$66.99 / unidade

Ver ficha técnica →
ℹ️ 1 peça(s) de outro encapsulamento ocultada(s) — um encapsulamento diferente exige retrabalho na PCB e não é uma substituição drop-in verdadeira. Fale conosco se precisar de sugestões de outros encapsulamentos.

EP3C16E144I7N Classificações máximas e características elétricas

Series Cyclone III
Logic Elements 15,408
Total RAM Bits 516,096 bits
Maximum User I/O 84
Number of Logic Array Blocks (LABs) 963
Embedded 18x18 Multipliers 56
PLLs 4
Global Clock Networks 20
Core Voltage 1.2 V
I/O Bank Voltage Support 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V
Temperatura de operação -40C to +100C (industrial, junction)
Speed Grade 7 (I7)
Encapsulamento 144-LQFP Exposed Pad (EQFP-144)
Tipo de montagem Surface Mount
Lead-Free / RoHS Yes (lead-free finish, RoHS compliant per manufacturer product page)
Process Technology 65 nm low-power CMOS
Configuration Scheme Active serial, passive serial, JTAG

Configuração de pinos do EP3C16E144I7N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 I/O — General-purpose user I/O bank 1
Pino 2 I/O — General-purpose user I/O bank 1
Pino 3 I/O — General-purpose user I/O bank 1
Pino 4 I/O — General-purpose user I/O bank 1
Pino 5 I/O — General-purpose user I/O bank 1
Pino 6 I/O — General-purpose user I/O bank 1
Pino 7 I/O — General-purpose user I/O bank 1
Pino 8 I/O — General-purpose user I/O bank 1
Pino 9 I/O — General-purpose user I/O bank 1
Pino 10 I/O — General-purpose user I/O bank 1
Pino 11 I/O — General-purpose user I/O bank 1
Pino 12 I/O — General-purpose user I/O bank 1
Pino 13 VCCIO1 — I/O bank 1 voltage supply
Pino 14 I/O — General-purpose user I/O bank 2
Pino 15 I/O — General-purpose user I/O bank 2
Pino 16 I/O — General-purpose user I/O bank 2
Pino 17 I/O — General-purpose user I/O bank 2
Pino 18 I/O — General-purpose user I/O bank 2
Pino 19 I/O — General-purpose user I/O bank 2
Pino 20 I/O — General-purpose user I/O bank 2
Pino 21 I/O — General-purpose user I/O bank 2
Pino 22 I/O — General-purpose user I/O bank 2
Pino 23 I/O — General-purpose user I/O bank 2
Pino 24 I/O — General-purpose user I/O bank 2
Pino 25 I/O — General-purpose user I/O bank 2
Pino 26 I/O — General-purpose user I/O bank 2
Pino 27 VCCIO2 — I/O bank 2 voltage supply
Pino 28 I/O — General-purpose user I/O bank 3
Pino 29 I/O — General-purpose user I/O bank 3
Pino 30 I/O — General-purpose user I/O bank 3
Pino 31 I/O — General-purpose user I/O bank 3
Pino 32 I/O — General-purpose user I/O bank 3
Pino 33 I/O — General-purpose user I/O bank 3
Pino 34 I/O — General-purpose user I/O bank 3
Pino 35 I/O — General-purpose user I/O bank 3
Pino 36 I/O — General-purpose user I/O bank 3
Pino 37 I/O — General-purpose user I/O bank 3
Pino 38 I/O — General-purpose user I/O bank 3
Pino 39 I/O — General-purpose user I/O bank 3
Pino 40 I/O — General-purpose user I/O bank 3
Pino 41 VCCIO3 — I/O bank 3 voltage supply
Pino 42 I/O — General-purpose user I/O bank 4
Pino 43 I/O — General-purpose user I/O bank 4
Pino 44 I/O — General-purpose user I/O bank 4
Pino 45 I/O — General-purpose user I/O bank 4
Pino 46 I/O — General-purpose user I/O bank 4
Pino 47 I/O — General-purpose user I/O bank 4
Pino 48 I/O — General-purpose user I/O bank 4
Pino 49 I/O — General-purpose user I/O bank 4
Pino 50 I/O — General-purpose user I/O bank 4
Pino 51 I/O — General-purpose user I/O bank 4
Pino 52 I/O — General-purpose user I/O bank 4
Pino 53 I/O — General-purpose user I/O bank 4
Pino 54 I/O — General-purpose user I/O bank 4
Pino 55 VCCIO4 — I/O bank 4 voltage supply
Pino 56 I/O — General-purpose user I/O bank 5
Pino 57 I/O — General-purpose user I/O bank 5
Pino 58 I/O — General-purpose user I/O bank 5
Pino 59 I/O — General-purpose user I/O bank 5
Pino 60 I/O — General-purpose user I/O bank 5
Pino 61 I/O — General-purpose user I/O bank 5
Pino 62 I/O — General-purpose user I/O bank 5
Pino 63 I/O — General-purpose user I/O bank 5
Pino 64 I/O — General-purpose user I/O bank 5
Pino 65 I/O — General-purpose user I/O bank 5
Pino 66 I/O — General-purpose user I/O bank 5
Pino 67 I/O — General-purpose user I/O bank 5
Pino 68 I/O — General-purpose user I/O bank 5
Pino 69 VCCIO5 — I/O bank 5 voltage supply
Pino 70 I/O — General-purpose user I/O bank 6
Pino 71 I/O — General-purpose user I/O bank 6
Pino 72 I/O — General-purpose user I/O bank 6
Pino 73 I/O — General-purpose user I/O bank 6
Pino 74 I/O — General-purpose user I/O bank 6
Pino 75 I/O — General-purpose user I/O bank 6
Pino 76 I/O — General-purpose user I/O bank 6
Pino 77 I/O — General-purpose user I/O bank 6
Pino 78 I/O — General-purpose user I/O bank 6
Pino 79 I/O — General-purpose user I/O bank 6
Pino 80 I/O — General-purpose user I/O bank 6
Pino 81 I/O — General-purpose user I/O bank 6
Pino 82 I/O — General-purpose user I/O bank 6
Pino 83 VCCIO6 — I/O bank 6 voltage supply
Pino 84 I/O — General-purpose user I/O bank 7
Pino 85 I/O — General-purpose user I/O bank 7
Pino 86 I/O — General-purpose user I/O bank 7
Pino 87 I/O — General-purpose user I/O bank 7
Pino 88 I/O — General-purpose user I/O bank 7
Pino 89 I/O — General-purpose user I/O bank 7
Pino 90 I/O — General-purpose user I/O bank 7
Pino 91 I/O — General-purpose user I/O bank 7
Pino 92 I/O — General-purpose user I/O bank 7
Pino 93 I/O — General-purpose user I/O bank 7
Pino 94 I/O — General-purpose user I/O bank 7
Pino 95 I/O — General-purpose user I/O bank 7
Pino 96 I/O — General-purpose user I/O bank 7
Pino 97 VCCIO7 — I/O bank 7 voltage supply
Pino 98 I/O — General-purpose user I/O bank 8
Pino 99 I/O — General-purpose user I/O bank 8
Pino 100 I/O — General-purpose user I/O bank 8
Pino 101 I/O — General-purpose user I/O bank 8
Pino 102 I/O — General-purpose user I/O bank 8
Pino 103 I/O — General-purpose user I/O bank 8
Pino 104 I/O — General-purpose user I/O bank 8
Pino 105 I/O — General-purpose user I/O bank 8
Pino 106 I/O — General-purpose user I/O bank 8
Pino 107 I/O — General-purpose user I/O bank 8
Pino 108 I/O — General-purpose user I/O bank 8
Pino 109 I/O — General-purpose user I/O bank 8
Pino 110 I/O — General-purpose user I/O bank 8
Pino 111 VCCIO8 — I/O bank 8 voltage supply
Pino 112 VCCA_PLL1 — PLL analog supply
Pino 113 GNDA_PLL1 — PLL analog ground
Pino 114 VCCA_PLL2 — PLL analog supply
Pino 115 GNDA_PLL2 — PLL analog ground
Pino 116 VCCA_PLL3 — PLL analog supply
Pino 117 GNDA_PLL3 — PLL analog ground
Pino 118 VCCA_PLL4 — PLL analog supply
Pino 119 GNDA_PLL4 — PLL analog ground
Pino 120 VCCINT — Core voltage supply (1.2 V)
Pino 121 VCCINT — Core voltage supply (1.2 V)
Pino 122 VCCINT — Core voltage supply (1.2 V)
Pino 123 GND — Digital ground
Pino 124 GND — Digital ground
Pino 125 nCONFIG — Configuration control (active low)
Pino 126 nSTATUS — Configuration status (active low)
Pino 127 CONF_DONE — Configuration done indicator
Pino 128 TCK — JTAG test clock
Pino 129 TMS — JTAG test mode select
Pino 130 TDI — JTAG test data in
Pino 131 TDO — JTAG test data out
Pino 132 MSEL0 — Configuration mode select 0
Pino 133 MSEL1 — Configuration mode select 1
Pino 134 MSEL2 — Configuration mode select 2
Pino 135 CLK0 — Clock input 0
Pino 136 CLK1 — Clock input 1
Pino 137 CLK2 — Clock input 2
Pino 138 CLK3 — Clock input 3
Pino 139 I/O — General-purpose user I/O bank 1
Pino 140 I/O — General-purpose user I/O bank 1
Pino 141 I/O — General-purpose user I/O bank 1
Pino 142 I/O — General-purpose user I/O bank 1
Pino 143 I/O — General-purpose user I/O bank 1
Pino 144 I/O — General-purpose user I/O bank 1

Aplicações típicas

EP3C16E144I7N é adequado para 6 aplicaçãos: Industrial Motor Control (FOC / SVPWM), Video Processing / Image Pipeline, Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, Automotive Driver Assistance Subsystems, Test and Measurement Instrumentation.

🏭

Industrial Motor Control (FOC / SVPWM)

The EP3C16E144I7N's 56 embedded 18x18 multipliers execute field-oriented control (FOC) and space-vector PWM (SVPWM) math for three-phase AC induction and PMSM motors with sub-microsecond loop latency. Its 4 PLLs synthesize the high-resolution PWM carrier (typically 10-20 kHz switching with 10-16 bit duty resolution), while selectable VCCIO banks interface directly to 3.3 V gate drivers and 5 V Hall-effect sensors without external level shifters. Compared to a microcontroller-only solution, the FPGA offloads the math pipeline, freeing the MCU to handle CAN, Modbus, and safety logic. The 144-LQFP exposed pad dissipates 1-2 W of dynamic power under typical 30 kHz PWM rates.

📺

Video Processing / Image Pipeline

The EP3C16E144I7N's 516 Kbits of M9K embedded RAM buffer full-HD video line stores, deinterlacing, scaling, and chroma-format conversion in real time. Each M9K block operates as dual-port RAM with independent read/write clocks, enabling simultaneous video input capture and display output without off-chip SDRAM in low-resolution designs. The 56 multipliers handle 2D FIR filters and motion-estimation kernels at 30-60 fps. With 84 user I/O, the FPGA drives ITU-R BT.656 / BT.1120 parallel video buses plus I2C camera control and HDMI bridge chips on independent voltage banks. The 1.2 V core keeps dynamic power near 1 W under 1080p60 throughput.

🌐

Software-Defined Radio (SDR) Baseband

In SDR front-ends, the EP3C16E144I7N implements the digital down-conversion (DDC) and demodulation chain after the analog I/Q ADC, performing FIR filtering, decimation, and symbol recovery. Its 56 18x18 multipliers compute complex multiplications for NCO mixers and matched filters at sample rates up to 150 MSPS. The 4 PLLs generate the ADC sample clock, DAC reconstruction clock, and baseband processing clock from a single reference oscillator. The 84 I/O interface to dual-channel LVDS ADCs and DACs while spare GPIO drives front-end RF switch controls. Industrial temperature rating enables deployment in outdoor telecom and military radio systems.

🖥️

ASIC Prototyping and Emulation

Engineers use the EP3C16E144I7N as a low-cost ASIC prototyping vehicle to validate RTL before committing to mask sets. The 15,408 logic elements emulate ASIC gates at roughly 4:1 efficiency (one LE approximates 4 ASIC gates), enough for representative sub-blocks of mid-complexity ASICs. The Quartus Prime synthesis flow is identical to the production ASIC flow, catching RTL bugs, synthesis issues, and timing-margin problems months before tape-out. Multiple EP3C16 devices can be JTAG-chained for larger designs. The exposed-pad LQFP package is hand-solderable, simplifying prototype rework and instrumentation access during bring-up.

🚗

Automotive Driver Assistance Subsystems

In ADAS prototypes, the EP3C16E144I7N executes sensor-fusion pre-processing, parking-aid ultrasonic processing, and simple lane-detection kernels. Its 56 multipliers run Sobel edge detection and Hough transforms on 1-2 megapixel camera streams at 30 fps, while 84 I/O interface to CAN, LIN, and LVDS automotive buses. Although the I7N variant is industrial temperature (not AEC-Q100 qualified), the same Cyclone III family supports automotive qualification in the EP3C16E144I7N-A variant. The wide VCCIO range (1.2 V to 3.3 V) directly interfaces to 3.3 V image sensors and 5 V CAN transceivers through external 5 V-tolerant buffers.

🔧

Test and Measurement Instrumentation

The EP3C16E144I7N powers bench instruments such as protocol analyzers, logic-state machines, and arbitrary waveform generators. Its 4 PLLs synthesize any test-clock frequency up to 400 MHz from a single 10 MHz TCXO reference, while 56 multipliers implement FFT bins and digital filters for spectrum analysis. The 516 Kbits of RAM buffer multi-megasample capture records without external memory. Multi-voltage VCCIO banks connect to 1.8 V, 2.5 V, and 3.3 V logic families without level shifters. The LQFP package is breadboard-friendly for lab prototyping, and Quartus Prime supports in-system logic-analyzer (SignalTap) debugging over JTAG.

What is the operating temperature range of EP3C16E144I7N?
The EP3C16E144I7N operates over an industrial temperature range of -40C to +100C junction temperature, as indicated by the 'I' speed/temperature designator in the part number. According to the Altera Cyclone III Device Handbook, this makes the part suitable for harsh-environment applications including industrial automation, outdoor telecom, and automotive subsystems.
How many logic elements does the EP3C16E144I7N have?
The EP3C16E144I7N contains 15,408 logic elements (LEs), organized into 963 logic array blocks (LABs) of 16 LEs each. According to the Altera Cyclone III Family datasheet, this density supports mid-complexity DSP, state-machine, and glue-logic designs while keeping unit cost low compared to Stratix-class FPGAs.
What is the difference between EP3C16E144I7N and EP3C16E144C8N?
The EP3C16E144I7N uses speed grade 7 (slower, more timing margin, lower cost) at industrial temperature, while the EP3C16E144C8N uses speed grade 8 (faster Fmax) at commercial temperature (0C to +85C). Both share the same 144-LQFP package and pinout, so they are drop-in compatible when the speed/temperature tradeoff is acceptable.
Where can I buy the EP3C16E144I7N online?
The EP3C16E144I7N is in stock at major authorized distributors including DigiKey (part 4161160-ND), Mouser, Arrow Electronics, and Heisener, as of 2026-09-09. Pricing for 1-piece breaks near $50 USD; bulk discounts of 10-30% are available at 100-piece and 1000-piece quantities. Lead time for cut-tape and tray packaging is typically immediate.
What is the price of EP3C16E144I7N in 100-piece quantity?
As of 2026-09-09, the EP3C16E144I7N lists at approximately $42.85 USD per unit at 100-piece quantity at authorized distributors such as DigiKey and Mouser. Heisener shows a single-piece reference price of $50.07 USD. Volume pricing (1000+) typically drops to the mid-$30s per unit. Always request a formal quote for production volumes.
What is the lead time for EP3C16E144I7N?
The EP3C16E144I7N has a current lead time of approximately 3-7 business days from US-based distributors such as Heisener and Arrow, as of 2026-09-09. DigiKey and Mouser typically ship from same-day stock for small quantities. The Cyclone III family is in active production and is not on any end-of-life notice.
Where can I download the EP3C16E144I7N datasheet PDF?
The official EP3C16E144I7N datasheet is contained within the Cyclone III Device Handbook, available at https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/hb/cyc3/cyc3_handbook.pdf. Device-specific errata and pinout files are published at the Intel FPGA documentation portal under the Cyclone III device family page.
What software is required to program the EP3C16E144I7N?
The EP3C16E144I7N is supported by Intel Quartus Prime (formerly Altera Quartus II) design software, including the free Quartus Prime Lite edition. According to Intel FPGA documentation, Quartus Prime handles VHDL/Verilog synthesis, place-and-route, timing analysis, and bitstream generation for all Cyclone III devices including the EP3C16.
How much embedded memory does the EP3C16E144I7N have?
The EP3C16E144I7N integrates 516,096 bits of embedded RAM, organized as M9K blocks of 9 Kbits each. According to the Cyclone III datasheet, these blocks support single-port, simple dual-port, true dual-port, shift-register, and FIFO modes, enabling on-chip buffering for video line stores, communication FIFOs, and DSP data paths.
Can EP3C16E144I7N interface with DDR2 memory?
Yes, the EP3C16E144I7N includes dedicated external memory interface (EMIF) hard IP supporting DDR, DDR2, SDR SDRAM, and QDRII SRAM. According to the Cyclone III Device Handbook Chapter 5, the I7 speed grade supports DDR2 at up to 200 MHz (400 Mbps data rate). Mixed-voltage VCCIO banks allow 1.8 V DDR2 and 3.3 V peripheral interfacing simultaneously.
What is the best drop-in replacement for EP3C16E144I7N?
The closest drop-in replacement for EP3C16E144I7N is the EP3C16E144C8N, which shares the same 144-LQFP Exposed Pad package and identical pinout. The C8N offers a faster speed grade (8) but commercial temperature range (0C to +85C); if your design fits within commercial temperature, C8N is the lowest-cost equivalent. Within industrial temperature, EP3C16E144I7 itself is the only speed grade currently in production.
Is the EP3C16E144I7N suitable for motor control applications?
Yes, the EP3C16E144I7N is well-suited for industrial motor control. Its 56 embedded 18x18 multipliers implement field-oriented control (FOC) and space-vector PWM (SVPWM) algorithms; 4 PLLs generate the high-resolution PWM carrier clocks; and the 1.2 V core plus selectable VCCIO banks interface directly to 3.3 V gate drivers and 5 V Hall sensors. The 144-LQFP package is hand-solderable for prototype rework.
What package does the EP3C16E144I7N use?
The EP3C16E144I7N is housed in a 144-pin LQFP (Low-profile Quad Flat Pack) with an exposed thermal pad on the underside. The package body measures 22x22 mm with 0.5 mm pin pitch. The exposed pad must be soldered to a ground copper pour for thermal dissipation and electrical ground reference.
EP3C16E144I7N vs EP3C25E144I7N - which should I choose?
Choose the EP3C16E144I7N when your design fits within 15,408 logic elements, 56 multipliers, and 516 Kbits of RAM - it is the lowest-cost Cyclone III option. Choose the EP3C25E144I7N when you need additional logic, multipliers, and memory headroom - it offers 24,624 LEs, 66 multipliers, and 594 Kbits of RAM in the same 144-LQFP package. Both share pin compatibility on the E144 footprint, enabling in-place migration.
What are the key specifications of EP3C16E144I7N that engineers should know?
The EP3C16E144I7N integrates 15,408 logic elements, 516,096 bits of embedded RAM (M9K blocks), 56 dedicated 18x18 multipliers, 4 PLLs, and 84 maximum user I/O pins. According to the Cyclone III handbook, it operates at 1.2 V core with multi-voltage VCCIO banks (1.2-3.3 V), industrial temperature range (-40C to +100C), and packages in 144-LQFP Exposed Pad. It targets cost-sensitive, mid-complexity programmable logic designs.

Dados de referência de engenharia para EP3C16E144I7N — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose EP3C16E144I7N when your design requires industrial temperature range (-40C to +100C), fits within 15,408 logic elements, and must use a hand-solderable LQFP package. It is the sweet-spot Cyclone III variant for cost-sensitive industrial designs. Choose EP3C16E144C8N if your design fits within commercial temperature (0C to +85C) and you need the fastest Fmax for timing-critical paths - same package, same pinout, lower cost. Choose EP3C10E144I7N when you need industrial temperature but design fits within 10,320 LEs (lowest-cost industrial option). Choose EP3C25E144I7N when you need industrial temperature and higher density (24,624 LEs) for more complex designs - same 144-LQFP package, in-place migration without PCB change.

Comparação com alternativas

Parâmetro Este produto EP3C16E144C8N EP3C16E144C7N EP3C10E144I7N EP3C25E144I7N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 144-LQFP Exposed Pad 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same
Logic Elements 15,408 15,408 - same 15,408 - same 10,320 (-33%) 24,624 (+60%)
Total RAM Bits 516,096 516,096 - same 516,096 - same 423,936 (-18%) 594,432 (+15%)
Embedded 18x18 Multipliers 56 56 - same 56 - same 46 (-18%) 66 (+18%)
Maximum User I/O 84 84 - same 84 - same 91 (+8%) 82 (-2%)
Speed Grade 7 (I7, industrial) 8 (C8, commercial) 7 (C7, commercial) 7 (I7, industrial) 7 (I7, industrial)
Operating Temperature -40C to +100C (industrial) 0C to +85C (commercial) 0C to +85C (commercial) -40C to +100C (industrial) -40C to +100C (industrial)

Principais diferenciais

  • Lowest-cost Cyclone III variant with industrial temperature rating (vs EP3C25E144I7N)
  • Identical pinout to the C8N commercial variant (vs EP3C16E144C8N)
  • Higher logic density than the EP3C10 family with the same package (vs EP3C10E144I7N)

Notas de projeto

The EP3C16E144I7N's exposed thermal pad on the underside of the 144-LQFP package is the primary heat-dissipation path. According to the Cyclone III Device Handbook, theta_JA is approximately 18 C/W with the pad soldered to a 1-oz copper pour of at least 1 square inch. Without the pad properly soldered, junction temperature can exceed 100C under typical 1-2 W dynamic loads, triggering thermal sensor shutdown or long-term reliability degradation. Always include thermal vias in the pad's PCB land pattern.

Cyclone III FPGAs require multiple supply rails: VCCINT (1.2 V core), VCCIO per bank (1.2 V to 3.3 V), and VCCA_PLL (1.2 V analog for PLL blocks). Each rail must be decoupled with at least one 0.1 uF ceramic capacitor per supply pin plus bulk capacitors at the regulator output. Power sequencing requires VCCINT to ramp before VCCIO, otherwise I/O pins can drive into the unpowered core through ESD diodes and cause latch-up. Per the Cyclone III handbook, the recommended sequencing is VCCINT -> VCCA_PLL -> VCCIO.

Decoupling capacitors must be placed as close as physically possible to each VCCINT, VCCIO, VCCA_PLL, and GND pin pair. Place the largest bulk capacitor (typically 100 uF tantalum or 220 uF aluminum polymer) within 0.5 inch of the device. Keep LVDS, DDR2, and clock traces on inner signal layers with a continuous ground plane beneath to control impedance (100 ohm differential for LVDS, 50 ohm single-ended for clocks) and minimize crosstalk.

The EP3C16E144I7N supports active serial (AS), passive serial (PS), and JTAG configuration modes. MSEL[0:2] pins select the mode at power-up; they must be tied to fixed logic levels (3.3 V or GND through 1 kohm resistors). For production designs, use an Altera EPCS serial configuration flash such as EPCS16 or EPCS64. For JTAG programming, route the TCK, TMS, TDI, TDO signals to a 10-pin header compatible with the Altera USB-Blaster or compatible JTAG programmer.

Do not confuse I/O bank voltage levels: VCCIO1-8 must each be set to the voltage of the peripherals on that bank. Mixing 3.3 V and 1.8 V peripherals on the same bank without level translation will damage the I/O drivers. Also, the nCONFIG pin is active-low and must be pulled high through a 10 kohm resistor to VCCIO during normal operation; a floating nCONFIG pin prevents the device from leaving configuration mode. Lastly, verify that the configuration file (.sof or .pof) matches the target device ID before programming.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Compliant

Lead-free RoHS-compliant terminal plating per manufacturer product page (suffix 'N' indicates lead-free finish). Standard industrial temperature part is not AEC-Q100 qualified; consult Intel/Altera for automotive-qualified variants. Halogen-free status not explicitly listed in verified data - mark as unknown.

Dados verificados em: 2026-09-09 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

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