EPM570GF256C3N - 570 LEs MAX II G CPLD | Intel / Altera
N.º da peça: EPM570GF256C3N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.1 | $131,00 |
| 100 | $11.85 | $1.185,00 |
| 500 | $10.6 | $5.300,00 |
| 1.000 | $9.4 | $9.400,00 |
EPM570GF256C3N Visão geral
A CPLD is a non-volatile programmable logic device that provides instant-on configuration from on-chip flash memory, combining the deterministic timing of a PAL/GAL architecture with the integration density of an FPGA. CPLDs sit in the programmable logic hierarchy between discrete 74-series glue logic and full FPGAs, and are commonly used for I/O expansion, bus bridging, power-up sequencing, and control state machines where sub-10 ns propagation delays and zero boot latency are required.
Key features include 570 logic elements, 76 user I/Os, 4-input LUT-based logic blocks, an 8 Kbit user flash memory block, JTAG IEEE 1149.1 boundary-scan support, and an internal oscillator. The device operates from a single 3.3 V core supply (VCCINT) with multi-voltage I/O banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interface levels. The GF256 FineLine BGA package measures 17 mm x 17 mm with a 1.0 mm ball pitch, providing high board density for space-constrained designs.
The MAX II G architecture combines a flash-based configuration memory with a Look-Up Table (LUT) logic fabric, eliminating the external configuration PROM required by older SRAM FPGAs. This instant-on capability, combined with multi-voltage I/O support and low power consumption, makes the EPM570GF256C3N well suited for glue logic replacement, bus interface translation, and LED drive multiplexing in industrial and communications equipment.
Typical applications include I/O expansion and level shifting for microcontrollers and ASICs, bus interface bridging between legacy and modern peripherals, control logic for power supply sequencing, LED drive and multiplexing in signage, and general-purpose glue logic replacement on industrial control boards.
When designing with this part, take advantage of Quartus II design software for synthesis, place-and-route, and timing analysis. The 256-ball BGA footprint requires careful PCB layout with microvia technology for reliable assembly, and the device supports in-system programmability via JTAG for production line updates.
This page synthesizes distributor pricing, drop-in MAX II / MAX II G alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para EPM570GF256C3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570GF256C3N (mesmo formato e footprint) — diferindo em Package, Process Technology, RoHS Status, Programming Interface, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570GF256C3
✅ Drop-In✓ Em estoque
$10.4 / unidade
Ver ficha técnica →EPM570GF256-5N
✅ Drop-In✓ Em estoque
$31.2 / unidade
Ver ficha técnica →EPM570F256C3N
✅ Drop-In✓ Em estoque
$13.75 / unidade
Ver ficha técnica →EPM570F256C5N
✅ Drop-In✓ Em estoque
$17.03 / unidade
Ver ficha técnica →EPM570F256C5NRR
✅ Drop-In✓ Em estoque
$10.9 / unidade
Ver ficha técnica →EPM570GF256C3N Classificações máximas e características elétricas
| Family | MAX II G |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 570 |
| User I/Os | 76 |
| User Flash Memory | 8 Kbit |
| Logic Family | CMOS |
| Supply Voltage VCCINT | 3.3 V (core) |
| I/O Bank Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Encapsulamento | 256-ball FineLine BGA (GF256), 17 x 17 mm, 1.0 mm pitch |
| Tipo de montagem | Surface Mount (BGA) |
| Temperatura de operação | -40C to +125C (industrial) |
| Programming Interface | JTAG (IEEE 1149.1) / in-system programmable |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) |
| Status RoHS | Lead Free / RoHS Compliant |
| Lead Free | Yes |
Configuração de pinos do EPM570GF256C3N
| Pino A1 | I/O — User I/O pin (bank-dependent voltage) |
| Pino A2 | I/O — User I/O pin (bank-dependent voltage) |
| Pino A3 | I/O — User I/O pin (bank-dependent voltage) |
| Pino A4 | VCCIO1 — I/O bank 1 supply voltage |
| Pino A5 | GND — Ground |
| Pino A6 | I/O — User I/O pin (bank 2) |
| Pino A7 | I/O — User I/O pin (bank 2) |
| Pino A8 | I/O — User I/O pin (bank 2) |
| Pino B1 | I/O — User I/O pin (bank 1) |
| Pino B2 | I/O — User I/O pin (bank 1) |
| Pino B3 | I/O — User I/O pin (bank 1) |
| Pino B4 | I/O — User I/O pin (bank 1) |
| Pino B5 | VCCIO2 — I/O bank 2 supply voltage |
| Pino B6 | GND — Ground |
| Pino B7 | I/O — User I/O pin (bank 2) |
| Pino B8 | I/O — User I/O pin (bank 2) |
| Pino C1 | I/O — User I/O pin (bank 1) |
| Pino C2 | I/O — User I/O pin (bank 1) |
| Pino C3 | GND — Ground |
| Pino C4 | I/O — User I/O pin (bank 1) |
| Pino C5 | I/O — User I/O pin (bank 2) |
| Pino C6 | I/O — User I/O pin (bank 2) |
| Pino C7 | GND — Ground |
| Pino C8 | I/O — User I/O pin (bank 2) |
| Pino D1 | I/O — User I/O pin (bank 1) |
| Pino D2 | I/O — User I/O pin (bank 1) |
| Pino D3 | I/O — User I/O pin (bank 1) |
| Pino D4 | VCCINT — Core supply voltage (3.3 V) |
| Pino D5 | I/O — User I/O pin (bank 2) |
| Pino D6 | I/O — User I/O pin (bank 2) |
| Pino D7 | I/O — User I/O pin (bank 2) |
| Pino D8 | I/O — User I/O pin (bank 2) |
| Pino E1 | I/O — User I/O pin (bank 3) |
| Pino E2 | I/O — User I/O pin (bank 3) |
| Pino E3 | I/O — User I/O pin (bank 3) |
| Pino E4 | GND — Ground |
| Pino E5 | I/O — User I/O pin (bank 4) |
| Pino E6 | I/O — User I/O pin (bank 4) |
| Pino E7 | I/O — User I/O pin (bank 4) |
| Pino E8 | I/O — User I/O pin (bank 4) |
| Pino F1 | I/O — User I/O pin (bank 3) |
| Pino F2 | I/O — User I/O pin (bank 3) |
| Pino F3 | VCCIO3 — I/O bank 3 supply voltage |
| Pino F4 | I/O — User I/O pin (bank 3) |
| Pino F5 | I/O — User I/O pin (bank 4) |
| Pino F6 | VCCIO4 — I/O bank 4 supply voltage |
| Pino F7 | I/O — User I/O pin (bank 4) |
| Pino F8 | I/O — User I/O pin (bank 4) |
| Pino G1 | I/O — User I/O pin (bank 3) |
| Pino G2 | GND — Ground |
| Pino G3 | I/O — User I/O pin (bank 3) |
| Pino G4 | TDI — JTAG Test Data In |
| Pino G5 | TMS — JTAG Test Mode Select |
| Pino G6 | I/O — User I/O pin (bank 4) |
| Pino G7 | GND — Ground |
| Pino G8 | I/O — User I/O pin (bank 4) |
| Pino H1 | I/O — User I/O pin (bank 3) |
| Pino H2 | I/O — User I/O pin (bank 3) |
| Pino H3 | I/O — User I/O pin (bank 3) |
| Pino H4 | TCK — JTAG Test Clock |
| Pino H5 | TDO — JTAG Test Data Out |
| Pino H6 | I/O — User I/O pin (bank 4) |
| Pino H7 | I/O — User I/O pin (bank 4) |
| Pino H8 | I/O — User I/O pin (bank 4) |
| Pino J1 | I/O — User I/O pin (bank 3) |
| Pino J2 | I/O — User I/O pin (bank 3) |
| Pino J3 | GND — Ground |
| Pino J4 | VCCINT — Core supply voltage (3.3 V) |
| Pino J5 | nSTATUS — Configuration status (open-drain, pull-up required) |
| Pino J6 | GND — Ground |
| Pino J7 | I/O — User I/O pin (bank 4) |
| Pino J8 | I/O — User I/O pin (bank 4) |
| Pino K1 | I/O — User I/O pin (bank 3) |
| Pino K2 | I/O — User I/O pin (bank 3) |
| Pino K3 | I/O — User I/O pin (bank 3) |
| Pino K4 | nCONFIG — Configuration control input (active-low reset) |
| Pino K5 | CONF_DONE — Configuration complete output (open-drain) |
| Pino K6 | I/O — User I/O pin (bank 4) |
| Pino K7 | I/O — User I/O pin (bank 4) |
| Pino K8 | I/O — User I/O pin (bank 4) |
| Pino L1 | I/O — User I/O pin (bank 3) |
| Pino L2 | VCCIO3 — I/O bank 3 supply voltage |
| Pino L3 | I/O — User I/O pin (bank 3) |
| Pino L4 | GND — Ground |
| Pino L5 | I/O — User I/O pin (bank 4) |
| Pino L6 | I/O — User I/O pin (bank 4) |
| Pino L7 | VCCIO4 — I/O bank 4 supply voltage |
| Pino L8 | I/O — User I/O pin (bank 4) |
| Pino M1 | I/O — User I/O pin (bank 3) |
| Pino M2 | I/O — User I/O pin (bank 3) |
| Pino M3 | I/O — User I/O pin (bank 3) |
| Pino M4 | I/O — User I/O pin (bank 3) |
| Pino M5 | VCCINT — Core supply voltage (3.3 V) |
| Pino M6 | I/O — User I/O pin (bank 4) |
| Pino M7 | I/O — User I/O pin (bank 4) |
| Pino M8 | I/O — User I/O pin (bank 4) |
| Pino N1 | GND — Ground |
| Pino N2 | I/O — User I/O pin (bank 3) |
| Pino N3 | I/O — User I/O pin (bank 3) |
| Pino N4 | I/O — User I/O pin (bank 3) |
| Pino N5 | I/O — User I/O pin (bank 4) |
| Pino N6 | I/O — User I/O pin (bank 4) |
| Pino N7 | I/O — User I/O pin (bank 4) |
| Pino N8 | GND — Ground |
| Pino P1 | I/O — User I/O pin (bank 1) |
| Pino P2 | I/O — User I/O pin (bank 1) |
| Pino P3 | I/O — User I/O pin (bank 1) |
| Pino P4 | VCCINT — Core supply voltage (3.3 V) |
| Pino P5 | I/O — User I/O pin (bank 2) |
| Pino P6 | I/O — User I/O pin (bank 2) |
| Pino P7 | I/O — User I/O pin (bank 2) |
| Pino P8 | I/O — User I/O pin (bank 2) |
| Pino R1 | I/O — User I/O pin (bank 1) |
| Pino R2 | GND — Ground |
| Pino R3 | I/O — User I/O pin (bank 1) |
| Pino R4 | I/O — User I/O pin (bank 1) |
| Pino R5 | I/O — User I/O pin (bank 2) |
| Pino R6 | GND — Ground |
| Pino R7 | I/O — User I/O pin (bank 2) |
| Pino R8 | I/O — User I/O pin (bank 2) |
| Pino T1 | I/O — User I/O pin (bank 1) |
| Pino T2 | I/O — User I/O pin (bank 1) |
| Pino T3 | VCCIO1 — I/O bank 1 supply voltage |
| Pino T4 | I/O — User I/O pin (bank 1) |
| Pino T5 | I/O — User I/O pin (bank 2) |
| Pino T6 | VCCIO2 — I/O bank 2 supply voltage |
| Pino T7 | I/O — User I/O pin (bank 2) |
| Pino T8 | I/O — User I/O pin (bank 2) |
| Pino U1 | I/O — User I/O pin (bank 1) |
| Pino U2 | I/O — User I/O pin (bank 1) |
| Pino U3 | I/O — User I/O pin (bank 1) |
| Pino U4 | GND — Ground |
| Pino U5 | I/O — User I/O pin (bank 2) |
| Pino U6 | I/O — User I/O pin (bank 2) |
| Pino U7 | I/O — User I/O pin (bank 2) |
| Pino U8 | I/O — User I/O pin (bank 2) |
| Pino V1 | I/O — User I/O pin (bank 1) |
| Pino V2 | I/O — User I/O pin (bank 1) |
| Pino V3 | I/O — User I/O pin (bank 1) |
| Pino V4 | I/O — User I/O pin (bank 1) |
| Pino V5 | VCCINT — Core supply voltage (3.3 V) |
| Pino V6 | I/O — User I/O pin (bank 2) |
| Pino V7 | I/O — User I/O pin (bank 2) |
| Pino V8 | I/O — User I/O pin (bank 2) |
| Pino W1 | GND — Ground |
| Pino W2 | I/O — User I/O pin (bank 1) |
| Pino W3 | I/O — User I/O pin (bank 1) |
| Pino W4 | I/O — User I/O pin (bank 1) |
| Pino W5 | I/O — User I/O pin (bank 2) |
| Pino W6 | I/O — User I/O pin (bank 2) |
| Pino W7 | I/O — User I/O pin (bank 2) |
| Pino W8 | GND — Ground |
Aplicações típicas
EPM570GF256C3N é adequado para 6 aplicaçãos: I/O Expansion and Level Shifting, Bus Interface Bridging, Power Supply Sequencing and Supervisor Logic, LED Drive and Multiplexing in Signage, Industrial Control and Glue Logic Replacement, Communication Protocol Bridging.
I/O Expansion and Level Shifting
The EPM570GF256C3N is purpose-built for I/O expansion when a microcontroller's GPIO count is exhausted or when level translation between mixed-voltage domains is required. With 76 user I/Os distributed across four independently-configurable I/O banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V, the device can absorb 30+ discrete 74LVC/74LVT level-shifters and bus-buffer ICs into a single 17 mm x 17 mm BGA. The on-chip flash memory eliminates the external configuration PROM required by SRAM-based FPGAs, while the JTAG port enables in-system reprogramming for design evolution. Instant-on non-volatile configuration means the I/O mapping is valid within microseconds of power-up, ideal for deterministic boot sequencing in industrial PLC backplanes.
Recomendado
Bus Interface Bridging
The EPM570GF256C3N bridges legacy peripheral buses (ISA, parallel SRAM, custom ASIC interfaces) to modern high-speed serial or parallel buses used by application processors. Its 76 I/Os and 570 LUT-based logic elements can implement a full 32-bit datapath with timing margins under 10 ns in the C3 speed grade, sufficient for asynchronous SRAM, NOR flash, and 8/16/32-bit microcontroller bus interfaces. Multi-voltage I/O banks allow the device to sit directly between a 1.8 V application processor and a 3.3 V legacy ASIC, eliminating dedicated bridge ICs. The non-volatile instant-on configuration also makes it well-suited for boot-ROM replacement in systems that need deterministic pre-OS initialization logic.
Recomendado
Power Supply Sequencing and Supervisor Logic
Power supply sequencing for multi-rail systems is a textbook MAX II G application, and the EPM570GF256C3N delivers the I/O count and timing precision required for complex sequencing trees. With 76 I/Os and 570 logic elements, a single device can monitor four to eight voltage rails via PGOOD comparators, drive discrete enable/MOSFET gates, and implement programmable delay-and-assert sequencing with sub-microsecond resolution. The instant-on configuration ensures power sequencing is active before downstream regulators complete their soft-start, critical for ASICs and processors that demand strict rail-order requirements. JTAG programmability allows last-minute sequencing changes without PCB rework, and the industrial -40C to +125C operating range covers telecom and outdoor industrial environments.
Recomendado
LED Drive and Multiplexing in Signage
The EPM570GF256C3N is widely deployed in large-format LED signage and display drivers where 70+ I/Os and deterministic scan timing are required. The 76 user I/Os can drive 24-32 channel multiplexed LED scan rows with PWM brightness control implemented in the LUT fabric at scan rates well above 1 kHz, eliminating flicker artifacts. Multi-voltage I/O bank support allows direct connection to both legacy 5 V LED driver columns and modern 3.3 V shift-register scan chains without level translation. The on-chip 8 Kbit flash memory can store calibration tables and scan patterns, while the JTAG port supports field firmware updates for content playback scheduling. The 256-ball FineLine BGA package keeps the device footprint under 17 mm x 17 mm.
Recomendado
Industrial Control and Glue Logic Replacement
The EPM570GF256C3N is the canonical choice for replacing dozens of discrete 74HC/74LVC/74LVT SSI/MSI glue logic packages on industrial control boards. With 570 logic elements - each implementing a 4-input LUT and flip-flop - the device absorbs 20-50 discrete logic packages into a single 17 mm x 17 mm BGA, freeing substantial PCB area for higher-value signal conditioning or isolation circuitry. The industrial -40C to +125C operating temperature range covers factory floor, outdoor cabinet, and process-control deployment environments. JTAG-supported in-system programmability enables late-stage customization during cabinet integration, and the non-volatile instant-on configuration guarantees deterministic power-up behavior required by IEC 61131 industrial control standards.
Recomendado
Communication Protocol Bridging
The EPM570GF256C3N bridges communication peripherals - SPI, I2C, UART, parallel camera interfaces, custom FPGA-to-ASIC links - in telecom and embedded networking equipment. The 570 logic elements and 76 I/Os support multiple parallel protocol bridges in one device, while the multi-voltage I/O bank support allows direct connection to both 1.8 V SoC PHYs and 3.3 V legacy peripherals. The instant-on configuration is critical for protocol controllers that must respond to the SoC boot ROM before the OS is loaded. The 256-ball FineLine BGA footprint enables vertical migration to EPM1270 (1270 LEs) or EPM2210 (2210 LEs) on the same PCB, future-proofing the design for protocol feature growth.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570GF256C3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570GF256C3 | EPM570GF256-5N | EPM570F256C3N | EPM570F256C5N | EPM570F256C5NRR |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-ball FineLine BGA (GF256) | 256-ball FineLine BGA (GF256) - same | 256-ball FineLine BGA (GF256) - same | 256-ball BGA (F256) - same ball map | 256-ball BGA (F256) - same ball map | 256-ball BGA (F256) - same ball map |
| Family | MAX II G | MAX II G | MAX II G | MAX II (non-G) | MAX II (non-G) | MAX II (non-G) |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| Speed Grade | C3 | C3 | -5 (slower) | C3 | C5 (faster) | C5 (faster) |
| Operating Temperature | -40C to +125C (industrial) | 0C to +85C (commercial) | -40C to +125C (industrial) | -40C to +125C (industrial) | -40C to +125C (industrial) | -40C to +125C (industrial) |
| Configuration Memory | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) | Flash (non-volatile, instant-on) |
Principais diferenciais
- Non-volatile instant-on flash configuration (vs SRAM-based FPGAs in same density range)
- Multi-voltage I/O bank architecture (vs Discrete 74LVC/74LVT level shifters)
- Vertical density migration on same PCB (vs EPM570F256C5N (MAX II non-G variant))
Notas de projeto
The 256-ball FineLine BGA package at 1.0 mm ball pitch requires PCB fabrication with microvia (laser-drilled) technology and stacked-via construction for reliable assembly. Per the MAX II Device Handbook, the manufacturer recommends Type 4 PCB stack-up with at least 4 layers and a 0.5 oz copper finish for production yields above 98%. For prototype builds, use ENIG (gold over nickel) surface finish rather than OSP to maximize solder joint reliability.
Estimated: the EPM570GF256C3N requires separate VCCINT (3.3 V core) and VCCIO1 through VCCIO4 (1.5/1.8/2.5/3.3 V I/O bank) supplies. Decoupling must place 0.1 uF X7R ceramic capacitors within 100 mils of each VCCINT and VCCIO ball, plus a 10 uF bulk tantalum or ceramic capacitor on each supply rail. The VCCINT core current draw peaks at 50-70 mA during configuration and drops to 10-20 mA in steady state at typical toggle rates.
Do not confuse the GF256 (MAX II G, FineLine BGA, 17 x 17 mm) package with the F256 (MAX II, 17 x 17 mm FineLine BGA) - they share the same ball pitch but have different part-number designations. The MAX II G offers lower static power, but the older MAX II remains pin-compatible. Per the MAX II datasheet chapter on migration, vertical migration between EPM570, EPM1270, and EPM2210 is supported on the GF256 footprint - design your decoupling and power planes for the largest expected device.
For JTAG chain integrity on production boards, add a 10 kohm pull-up resistor on TCK, TMS, and TDI, and route JTAG signals with controlled 50 ohm impedance and matched length to within 100 mils. Place the JTAG connector at the board edge for programming probe access. The CONF_DONE and nSTATUS signals are open-drain outputs that require external pull-up resistors per the MAX II handbook.
Informações de conformidade
Lead-free and RoHS compliant per Altera product marking. AEC-Q100 automotive qualification is not offered on the MAX II G family - use MAX V or Cyclone devices for automotive designs.
