K4B4G1646D-BYK0 - 4Gb DDR3L SDRAM 256Mx16 | Samsung
MPN: K4B4G1646D-BYK0 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.5 | $4.50 |
| 10 | $4.1 | $41.00 |
| 100 | $3.7 | $370.00 |
| 500 | $3.3 | $1,650.00 |
| 1,000 | $2.9 | $2,900.00 |
Drop-in alternatives for K4B4G1646D-BYK0 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4B4G1646E-BYK0
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View Datasheet →K4B4G1646F-BYK0
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View Datasheet →K4B4G1646I-BYK0
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View Datasheet →K4B4G1646D-BMK0
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View Datasheet →MT41K256M16HA-125
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View Datasheet →NT5CB256M16CP-DI
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View Datasheet →K4B4G1646D-BYK0 Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Density | 4 Gbit |
| Organization | 256M x 16 |
| Supply Voltage | 1.35 V (1.5 V compatible) |
| Data Rate | 1600 Mbps (PC3-12800) |
| Package | 96-ball FBGA |
| Operating Temperature | 0°C to 85°C |
| CAS Latency | Programmable (e.g., 11, 10, 9) |
| Burst Length | 8 (with burst chop 4) |
| On-Die Termination | Yes |
| Lead-Free | Yes |
| Halogen-Free | Yes |
| RoHS Compliant | Yes |
| Number of Pins | 96 |
| Die Revision | D-die |
K4B4G1646D-BYK0 Pin Configuration
| Pin A1 | VDD — Power supply (1.35V/1.5V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ2 — Data input/output 2 |
| Pin B3 | DQ3 — Data input/output 3 |
| Pin C1 | VDDQ — I/O power supply |
| Pin C2 | DQ4 — Data input/output 4 |
| Pin C3 | DQ5 — Data input/output 5 |
| Pin D1 | VSSQ — I/O ground |
| Pin D2 | DQ6 — Data input/output 6 |
| Pin D3 | DQ7 — Data input/output 7 |
| Pin E1 | A0 — Address input 0 |
| Pin E2 | A1 — Address input 1 |
| Pin E3 | A2 — Address input 2 |
| Pin F1 | A3 — Address input 3 |
| Pin F2 | A4 — Address input 4 |
| Pin F3 | A5 — Address input 5 |
| Pin G1 | A6 — Address input 6 |
| Pin G2 | A7 — Address input 7 |
| Pin G3 | A8 — Address input 8 |
| Pin H1 | A9 — Address input 9 |
| Pin H2 | A10/AP — Address input 10 / Auto-precharge |
| Pin H3 | A11 — Address input 11 |
| Pin J1 | A12/BC — Address input 12 / Burst chop |
| Pin J2 | A13 — Address input 13 |
| Pin J3 | A14 — Address input 14 |
| Pin K1 | BA0 — Bank address 0 |
| Pin K2 | BA1 — Bank address 1 |
| Pin K3 | BA2 — Bank address 2 |
| Pin L1 | CK — Clock input |
| Pin L2 | CK# — Complementary clock input |
| Pin L3 | CKE — Clock enable |
| Pin M1 | CS# — Chip select |
| Pin M2 | RAS# — Row address strobe |
| Pin M3 | CAS# — Column address strobe |
| Pin N1 | WE# — Write enable |
| Pin N2 | ODT — On-die termination |
| Pin N3 | RESET# — Reset |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4B4G1646D-BYK0 is suitable for 6 applications: Laptop Memory Modules, Networking Equipment, Embedded Single-Board Computers, Industrial Automation, Consumer Electronics, Automotive Infotainment.
Laptop Memory Modules
The K4B4G1646D-BYK0 is ideal for DDR3L SO-DIMM modules used in laptops and ultrabooks. Its 1.35V operation reduces power consumption, extending battery life. With 4Gb density and 1600 Mbps speed, it meets the requirements of mainstream mobile computing. The 96-ball FBGA package allows compact module designs. When used in a dual-channel configuration, two devices provide 8GB capacity, balancing performance and cost.
Recommended
Networking Equipment
In routers, switches, and network appliances, the K4B4G1646D-BYK0 provides high-density, low-power memory for packet buffering and routing tables. Its 1600 Mbps data rate supports high-throughput packet processing. The 1.35V supply reduces heat generation in enclosed networking enclosures. The device's on-die termination improves signal integrity on high-speed buses, ensuring reliable operation in noisy environments. It is suitable for both enterprise and consumer networking hardware.
Recommended
Embedded Single-Board Computers
The K4B4G1646D-BYK0 is used in single-board computers like the OLinuXino series, providing 4Gb of DDR3L memory for Linux-based applications. Its low voltage and compact FBGA package are ideal for space-constrained boards. The 256Mx16 organization simplifies PCB routing with fewer address lines. The device supports 1.5V operation, allowing compatibility with legacy DDR3 designs. It is a reliable choice for IoT gateways and industrial controllers.
Recommended
Industrial Automation
In industrial PCs and PLCs, the K4B4G1646D-BYK0 offers reliable memory for real-time control and data logging. Its 0°C to 85°C operating temperature range suits industrial environments. The 1.35V supply reduces power dissipation, important for fanless systems. The device's high density allows storing large process data buffers. With a 1600 Mbps data rate, it supports fast data acquisition and processing.
Recommended
Consumer Electronics
The K4B4G1646D-BYK0 is used in smart TVs, set-top boxes, and gaming consoles for system memory. Its 4Gb density provides ample space for multimedia applications. The 1.35V operation helps meet energy efficiency standards. The 96-ball FBGA package enables slim device designs. With 1600 Mbps speed, it supports smooth video playback and responsive user interfaces. The device's RoHS compliance meets environmental regulations.
Recommended
Automotive Infotainment
The K4B4G1646D-BYK0 is suitable for automotive infotainment systems, providing memory for navigation, audio, and display processing. Its low power consumption is critical for vehicle battery life. The device operates over the automotive temperature range (0°C to 85°C) and is available in a robust FBGA package. The 1600 Mbps data rate supports high-resolution graphics. While not AEC-Q100 qualified, it is used in non-safety-critical automotive applications.
Recommended
Recommended Products Summary
Engineering reference data for K4B4G1646D-BYK0 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4B4G1646E-BYK0 | K4B4G1646F-BYK0 | K4B4G1646I-BYK0 | MT41K256M16HA-125 | NT5CB256M16CP-DI |
|---|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology | Nanya Technology |
| Density | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V (1.5V compatible) | 1.35V (1.5V compatible) | 1.35V (1.5V compatible) | 1.35V (1.5V compatible) | 1.35V (1.5V compatible) | 1.35V (1.5V compatible) |
| Data Rate | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps |
| Operating Temperature | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 95°C | 0°C to 85°C |
| Die Revision | D-die | E-die | F-die | I-die | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Low voltage operation (1.35V) reduces power consumption by up to 20% compared to standard DDR3. (vs K4B4G1646D-BMK0)
- D-die revision offers proven reliability and compatibility. (vs K4B4G1646E-BYK0)
- Samsung's manufacturing quality ensures high yield and consistency. (vs NT5CB256M16CP-DI)
Design Notes
Place 0.1uF decoupling capacitors close to each VDD and VDDQ pin, and a 10uF bulk capacitor near the device. Follow the layout guidelines in the Samsung datasheet to minimize trace lengths for DQ and address lines, ensuring matched lengths for signal integrity at 1600 Mbps.
Use on-die termination (ODT) settings to match the bus impedance and reduce reflections. The K4B4G1646D-BYK0 supports programmable ODT; configure it according to the system's memory controller settings. Keep the clock lines (CK/CK#) differential and properly terminated.
The device operates up to 85°C. Ensure adequate airflow or heatsinking in high-temperature environments. The 1.35V supply reduces power dissipation compared to 1.5V, but verify the thermal profile of the system.
Compliance Information
Lead-free and halogen-free per datasheet. RoHS compliant. Not AEC-Q100 qualified.
