NXP Semiconductors

MC9S12DG256BVPV - 16-bit 25MHz HCS12 MCU 256KB Flash | NXP

Référence : MC9S12DG256BVPV ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
2.5 V core / 5 V I/O (single 5 V supply with internal regulator) Vdss 112-LQFP (20x20 mm) Package 25 MHz Speed 256 KB (256K x 8) Flash Memory
À partir de $15.6 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-17
Tarifs dégressifs
Qté Prix unitaire Total
1 $22.45 $22,45
10 $20.18 $201,80
100 $17.92 $1 792,00
250 $16.75 $4 187,50
500 $15.6 $7 800,00
ℹ️ Tous les prix sont en USD

MC9S12DG256BVPV Présentation

The NXP MC9S12DG256BVPV is a 16-bit HCS12 CISC microcontroller running at 25 MHz with 256 KB of on-chip Flash and 12 KB RAM, housed in a 112-pin LQFP (20x20 mm) package. Designed originally by Freescale (now part of NXP) for automotive multiplexing, it integrates two asynchronous SCI ports, an SPI, an I2C bus, two 8-channel 10-bit ADCs, an 8-channel PWM, and 20 discrete digital I/O lines, plus a CAN 2.0 module for in-vehicle networking.

An HCS12 microcontroller is a 16-bit CISC MCU family built around the CPU12 core, a successor to the HC11 with enhanced addressing, indexed operations, and a background debug mode (BDM) interface. The MC9S12D sub-family extends the architecture with modular memory and peripheral options so that designers can scale software across pin-compatible derivatives from 128 KB up to 512 KB Flash. This positioning places the HCS12 between 8-bit automotive MCUs (HC08) and 32-bit Power Architecture/ARM parts, offering CAN connectivity and rich analog in a low-cost, well-understood toolchain.

Key features include 256 KB Flash (organized as 256K x 8), 4 KB EEPROM, 12 KB RAM, two 10-bit ADC modules, an 8-channel enhanced capture timer, eight PWM channels, two SCI, one SPI, one I2C, one CAN 2.0 A/B controller, and a BDM debug port. The device operates from 5 V (with 2.5 V internal regulator) across the -40 C to +85 C industrial temperature range. Programmable interrupt controller and PLL clock generation support flexible system timing.

The architecture uses a 16-bit CPU12 core with a hardware multiply/divide accelerator and a unified memory map, enabling C-compiler-friendly code generation. The internal 2.5 V regulator powers the core while the I/O ring stays at 5 V for noise-tolerant automotive signaling. The CAN module is M_CAN compatible and supports both standard and extended identifiers, easing integration with automotive body and chassis networks.

Typical applications include automotive body controllers, instrument clusters, HVAC panels, seat and mirror modules, industrial CAN nodes, and any 16-bit embedded control design with CAN connectivity. The wide operating voltage and industrial temperature rating also suit building automation and heavy-equipment telematics. When migrating from an HC08 design, the HCS12 preserves peripheral and toolchain compatibility while adding more memory and CAN hardware.

Alternatives de remplacement direct pour MC9S12DG256BVPV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MC9S12DG256BVPV (même facteur de forme et même empreinte) — différant par Package, ADC, Supply Voltage, Operating Temperature, Mounting Type.

NXP Semiconductors
Supply Voltage: 2.5 V / 5 V
Comparer avec MC9S12DG256BVPV →
NXP Semiconductors
Package: 80-QFP (14x14 mm), LQFP
Supply Voltage: 2.5V / 5V
Comparer avec MC9S12DG256BVPV →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm, 0.65 mm pitch)
ADC: 10-bit, 8 channels
Operating Temperature: -40 C to +85 C (automotive AEC-Q100)
Comparer avec MC9S12DG256BVPV →
NXP Semiconductors
ADC: 2x 8-channel, 10-bit
Supply Voltage: 2.97 V to 5.5 V
Operating Temperature: -40C to +85C (industrial)
Comparer avec MC9S12DG256BVPV →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
Comparer avec MC9S12DG256BVPV →
NXP Semiconductors
Package: 112-pin LQFP (20x20 mm)
ADC: 8-channel 10-bit
Supply Voltage: 5 V
Comparer avec MC9S12DG256BVPV →
NXP Semiconductors
Package: 112-pin LQFP (20x20 mm)
ADC: 2x 8-channel, 10-bit
Supply Voltage: 2.35 V to 2.75 V (core), 5 V I/O tolerant typical
Comparer avec MC9S12DG256BVPV →
NXP Semiconductors
ADC: 2 x 8-channel, 10-bit
Comparer avec MC9S12DG256BVPV →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC9S12DG256CPVE

✅ Remplacement direct
📦 112-LQFP (20x20)
same 256 KB Flash and 112-LQFP-20 footprint, extended automotive temp grade vs industrial on BVPV

📋 Alternative de référence (hors catalogue)

MC9S12DG256BCPV

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16-bit · CISC · 25 MHz · 256 KB (256K x 8) Flash · Flash · 12 KB · 4 KB x 8

✓ En stock

$22.4 / unité

Voir la fiche technique →

MC9S12DT256BVPV

✅ Remplacement direct
📦 112-LQFP (20x20)
same 112-LQFP-20 footprint and HCS12 core; 256 KB Flash identical, additional CAN module on DT variant

📋 Alternative de référence (hors catalogue)

MC9S12A256CPVE

✅ Remplacement direct
📦 112-LQFP (20x20)
same 256 KB Flash and 112-LQFP-20 footprint; A256 family lacks the second msCAN module but is otherwise pin-compatible

📋 Alternative de référence (hors catalogue)

MC9S12DG256MPVE

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16-bit CISC · 25 MHz · 256 KB (256K x 8) · 12 KB · 4 KB · 10-bit · 8

✓ En stock

$75.08 / unité

Voir la fiche technique →

MC9S12DG256BVPV Valeurs maximales et caractéristiques électriques

Core Processor HCS12 (CPU12)
Core Size 16-bit
Maximum Clock Speed 25 MHz
Program Memory Size 256 KB (256K x 8) Flash
RAM Size 12 KB
EEPROM Size 4 KB
Boîtier 112-LQFP (20x20 mm)
Type de montage Surface Mount
Tension d'alimentation de fonctionnement 2.5 V core / 5 V I/O (single 5 V supply with internal regulator)
Température de fonctionnement -40 C to +85 C
Number of I/O 91
ADC 2 x 8-channel 10-bit
PWM Channels 8
Communication Interfaces CAN, I2C, SCI, SPI
Connectivity CAN 2.0 A/B, I2C, SPI, 2x SCI
Peripherals PWM, WDT, POR, LVD, BDM debug
Data Converters A/D 16x10b
Oscillator Type Internal PLL + external crystal
Niveau MSL 3 (168 hours)
Statut RoHS Compliant

Configuration des broches de MC9S12DG256BVPV

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Broche 1 PAD0 — Port AD input/output bit 0
Broche 2 PAD1 — Port AD input/output bit 1
Broche 3 PAD2 — Port AD input/output bit 2
Broche 4 PAD3 — Port AD input/output bit 3
Broche 5 PAD4 — Port AD input/output bit 4
Broche 6 PAD5 — Port AD input/output bit 5
Broche 7 PAD6 — Port AD input/output bit 6
Broche 8 PAD7 — Port AD input/output bit 7
Broche 9 VDDR — Voltage reference for Port AD
Broche 10 VSS — Digital ground
Broche 11 VDD — Digital 5 V supply
Broche 12 PAD8 — Port AD input/output bit 8
Broche 13 PAD9 — Port AD input/output bit 9
Broche 14 PAD10 — Port AD input/output bit 10
Broche 15 PAD11 — Port AD input/output bit 11
Broche 16 PAD12 — Port AD input/output bit 12
Broche 17 PAD13 — Port AD input/output bit 13
Broche 18 PAD14 — Port AD input/output bit 14
Broche 19 PAD15 — Port AD input/output bit 15
Broche 20 BKGD — Background Debug Mode interface
Broche 21 RESET — Active-low reset input
Broche 22 VDDPLL — PLL supply voltage
Broche 23 VSSPLL — PLL ground
Broche 24 EXTAL — External clock/crystal input
Broche 25 XTAL — Crystal output
Broche 26 MODC — Mode select input
Broche 27 PAD16 — Port AD input/output bit 16 / AN0
Broche 28 PAD17 — Port AD input/output bit 17 / AN1
Broche 29 PAD18 — Port AD input/output bit 18 / AN2
Broche 30 PAD19 — Port AD input/output bit 19 / AN3
Broche 31 PAD20 — Port AD input/output bit 20 / AN4
Broche 32 PAD21 — Port AD input/output bit 21 / AN5
Broche 33 PAD22 — Port AD input/output bit 22 / AN6
Broche 34 PAD23 — Port AD input/output bit 23 / AN7
Broche 35 VDDA — ADC supply voltage
Broche 36 VSSA — ADC ground
Broche 37 PWM0 — PWM channel 0 output
Broche 38 PWM1 — PWM channel 1 output
Broche 39 PWM2 — PWM channel 2 output
Broche 40 PWM3 — PWM channel 3 output
Broche 41 PWM4 — PWM channel 4 output
Broche 42 PWM5 — PWM channel 5 output
Broche 43 PWM6 — PWM channel 6 output
Broche 44 PWM7 — PWM channel 7 output
Broche 45 PP0 — Port P I/O bit 0
Broche 46 PP1 — Port P I/O bit 1
Broche 47 PP2 — Port P I/O bit 2
Broche 48 PP3 — Port P I/O bit 3
Broche 49 PP4 — Port P I/O bit 4
Broche 50 PP5 — Port P I/O bit 5
Broche 51 PP6 — Port P I/O bit 6
Broche 52 PP7 — Port P I/O bit 7
Broche 53 PT0 — Port T I/O bit 0
Broche 54 PT1 — Port T I/O bit 1
Broche 55 PT2 — Port T I/O bit 2
Broche 56 PT3 — Port T I/O bit 3
Broche 57 PT4 — Port T I/O bit 4
Broche 58 PT5 — Port T I/O bit 5
Broche 59 PT6 — Port T I/O bit 6
Broche 60 PT7 — Port T I/O bit 7
Broche 61 PS0 — Port S I/O bit 0 / RXD0
Broche 62 PS1 — Port S I/O bit 1 / TXD0
Broche 63 PS2 — Port S I/O bit 2 / RXD1
Broche 64 PS3 — Port S I/O bit 3 / TXD1
Broche 65 PS4 — Port S I/O bit 4 / MOSI
Broche 66 PS5 — Port S I/O bit 5 / MISO
Broche 67 PS6 — Port S I/O bit 6 / SPSCK
Broche 68 PS7 — Port S I/O bit 7 / SS
Broche 69 PJ0 — Port J I/O bit 0 / SDA
Broche 70 PJ1 — Port J I/O bit 1 / SCL
Broche 71 PJ2 — Port J I/O bit 2
Broche 72 PJ3 — Port J I/O bit 3
Broche 73 PJ4 — Port J I/O bit 4
Broche 74 PJ5 — Port J I/O bit 5
Broche 75 PJ6 — Port J I/O bit 6
Broche 76 PJ7 — Port J I/O bit 7
Broche 77 PM0 — Port M I/O bit 0 / CAN0TX
Broche 78 PM1 — Port M I/O bit 1 / CAN0RX
Broche 79 PM2 — Port M I/O bit 2
Broche 80 PM3 — Port M I/O bit 3
Broche 81 PM4 — Port M I/O bit 4
Broche 82 PM5 — Port M I/O bit 5
Broche 83 PM6 — Port M I/O bit 6
Broche 84 PM7 — Port M I/O bit 7
Broche 85 PE0 — Port E I/O bit 0 / IRQ
Broche 86 PE1 — Port E I/O bit 1 / XIRQ
Broche 87 PE2 — Port E I/O bit 2
Broche 88 PE3 — Port E I/O bit 3
Broche 89 PE4 — Port E I/O bit 4
Broche 90 PE5 — Port E I/O bit 5
Broche 91 PE6 — Port E I/O bit 6
Broche 92 PE7 — Port E I/O bit 7
Broche 93 VDDX — I/O supply voltage
Broche 94 VSSX — I/O ground
Broche 95 PK0 — Port K I/O bit 0
Broche 96 PK1 — Port K I/O bit 1
Broche 97 PK2 — Port K I/O bit 2
Broche 98 PK3 — Port K I/O bit 3
Broche 99 PK4 — Port K I/O bit 4
Broche 100 PK5 — Port K I/O bit 5
Broche 101 PK6 — Port K I/O bit 6
Broche 102 PK7 — Port K I/O bit 7
Broche 103 PH0 — Port H I/O bit 0
Broche 104 PH1 — Port H I/O bit 1
Broche 105 PH2 — Port H I/O bit 2
Broche 106 PH3 — Port H I/O bit 3
Broche 107 PH4 — Port H I/O bit 4
Broche 108 PH5 — Port H I/O bit 5
Broche 109 PH6 — Port H I/O bit 6
Broche 110 PH7 — Port H I/O bit 7
Broche 111 VDD — Digital 5 V supply
Broche 112 VSS — Digital ground

Applications typiques

MC9S12DG256BVPV convient pour 6 applications: Automotive Body Controller, Instrument Cluster, HVAC Control Module, Industrial CAN Node, Seat and Mirror Module, Building Automation Controller.

🚗

Automotive Body Controller

The MC9S12DG256BVPV is a strong fit for automotive body controllers because of its on-chip CAN 2.0 A/B controller (msCAN), 5 V I/O tolerance, and 91 general-purpose I/O lines that drive lamps, motors, and switches without external glue logic. The 256 KB Flash holds bootloader plus body-control firmware with margin for feature growth, while the 12 KB RAM comfortably accommodates CAN message buffers and task stacks. Designers typically place the part between a 12 V-to-5 V regulator and the load-driver stages, using the 8-channel PWM to modulate LED dimming and the 10-bit ADC to read battery voltage and thermistor inputs. Industrial-grade temperature rating (-40 C to +85 C) is sufficient for cabin modules.

📺

Instrument Cluster

An automotive instrument cluster benefits from the MC9S12DG256BVPV's 8-channel PWM for gauge pointer control and its dual 10-bit ADC modules for fuel-level and temperature sensing. The 256 KB Flash supports a real-time operating system plus graphics libraries for segment or small dot-matrix LCDs, and the 5 V I/O ring interfaces directly to stepper-motor drivers and warning-LED arrays. The CPU12 core's efficient C-compiled code keeps pointer updates jitter-free at the 25 MHz bus rate, while the msCAN module receives vehicle-speed and engine-RPM data from the powertrain CAN bus.

🌐

HVAC Control Module

The MC9S12DG256BVPV suits HVAC control modules that demand multiple PWM outputs for blower-speed control and mode doors, plus ADC channels for cabin and ambient temperature. The on-chip SPI can drive a character-LCD or small TFT panel for the climate display, while the I2C bus talks to digital temperature sensors and EEPROM for trim storage. The internal 2.5 V regulator simplifies the power tree to a single 5 V rail, and the BDM interface speeds firmware calibration on the production line. Pin-compatible migration to 512 KB Flash derivatives is possible if HVAC software grows.

🏭

Industrial CAN Node

Industrial CAN nodes such as sensor aggregators and motor-control satellite modules can use the MC9S12DG256BVPV as a cost-effective 16-bit controller with hardware CAN. The 256 KB Flash accommodates a CANopen or DeviceNet stack alongside the application code, and the two SCI ports support RS-232/RS-485 service interfaces. The 10-bit ADC with 16 channels is enough for multi-sensor acquisition, and the 8-channel PWM can drive solenoids or LED indicators. The -40 C to +85 C range covers most factory-floor and outdoor enclosures.

🚗

Seat and Mirror Module

Seat and mirror modules need precise multi-channel PWM (for motor position) plus reliable CAN communication with the body controller, and the MC9S12DG256BVPV provides both. The 8-channel enhanced capture timer measures position feedback while the 8-channel PWM drives the drive motors in both directions through external H-bridges. The 256 KB Flash holds calibration tables for different vehicle variants, and the 12 KB RAM is ample for position tracking. BDM debug simplifies factory calibration, and the 5 V I/O ring eliminates level shifters to the motor-driver stages.

🧩

Building Automation Controller

Building-automation controllers (lighting panels, access-control readers, HVAC zoning) can leverage the MC9S12DG256BVPV's CAN or I2C backbone, 8-channel PWM for dimmer outputs, and 10-bit ADC for analog sensor inputs. The 256 KB Flash supports BACnet or Modbus stacks, and the 4 KB EEPROM stores configuration parameters across power cycles. The wide operating voltage and industrial temperature rating suit equipment rooms and rooftop installations. Pin compatibility with the broader HCS12 family enables designers to reuse firmware across multiple controller SKUs.

Récapitulatif des produits recommandés

MC9S12DG256CPVE Pin-compatible extended-temperature upgrade Utilisé dans : Automotive Body Controller TJA1040 External CAN transceiver companion Utilisé dans : Automotive Body Controller MC9S12DG256BCPV NXP Semiconductors Utilisé dans : Instrument Cluster TLE4271 5 V regulator companion for cluster supply Utilisé dans : Instrument Cluster MC9S12DT256BVPV Pin-compatible 256 KB Flash with extra CAN Utilisé dans : HVAC Control Module, Building Automation Controller LM75A I2C digital temperature sensor companion Utilisé dans : HVAC Control Module MC9S12A256CPVE Single-CAN variant, otherwise pin-compatible Utilisé dans : Industrial CAN Node SN65HVD230 Industrial CAN transceiver companion Utilisé dans : Industrial CAN Node MC9S12DG256MPVE NXP Semiconductors Utilisé dans : Seat and Mirror Module VNH2SP30 H-bridge motor driver companion Utilisé dans : Seat and Mirror Module PCA9539 I2C GPIO expander companion Utilisé dans : Building Automation Controller
What is the program memory size of MC9S12DG256BVPV?
The MC9S12DG256BVPV has 256 KB of on-chip Flash program memory organized as 256K x 8. According to the manufacturer datasheet, this Flash is in-circuit programmable through the BDM interface and supports byte, word, and burst programming modes. The 12 KB RAM and 4 KB EEPROM complement the Flash for data and non-volatile parameter storage in automotive and industrial applications.
What is the maximum operating frequency of MC9S12DG256BVPV?
The MC9S12DG256BVPV runs up to 25 MHz bus clock from an internal PLL locked to an external crystal reference. The CPU12 core executes instructions in 1 to 12 bus cycles, giving roughly 25 MIPS peak throughput. The PLL accepts a wide reference range and lets designers trade off EMI and power against execution speed.
Does MC9S12DG256BVPV support CAN bus?
Yes. The MC9S12DG256BVPV integrates a CAN 2.0 A/B controller (msCAN module) for automotive multiplexing. The controller supports standard 11-bit and extended 29-bit identifiers, programmable bit rates up to 1 Mbps, and up to 15 message objects. Combined with the on-chip SCI, SPI, and I2C peripherals, the part covers the body-network protocols used in automotive body, chassis, and HVAC ECUs.
What package does MC9S12DG256BVPV use?
The MC9S12DG256BVPV is supplied in a 112-pin Low-Profile Quad Flat Pack (LQFP) measuring 20 x 20 mm with a 0.65 mm pitch and a 1.4 mm overall height. The LQFP-112 footprint is shared across the entire MC9S12D and MC9S12XD families, enabling pin-compatible migration to higher-density Flash variants without PCB rework.
How much RAM does MC9S12DG256BVPV have?
The MC9S12DG256BVPV has 12 KB of on-chip static RAM used for variables, stacks, and CAN message buffers. ECC is not present on this RAM block, so designers must protect critical buffers against soft errors using software checksums where automotive safety integrity is required.
What is the operating voltage of MC9S12DG256BVPV?
The MC9S12DG256BVPV operates from a single 5 V external supply with an internal 2.5 V regulator powering the CPU12 core. The I/O ring is 5 V-tolerant for direct connection to automotive 5 V bus signals without level shifters, simplifying integration into body controllers and instrument clusters. The device also supports a low-voltage reset (LVR) and a low-voltage detect (LVD) block for safe power sequencing.
Is MC9S12DG256BVPV suitable for automotive applications?
Yes. The MC9S12DG256BVPV is designed for automotive multiplexing, including body controllers, HVAC panels, instrument clusters, and seat/mirror modules. It is rated for the -40 C to +85 C automotive temperature range and supports the CAN, LIN-via-SCI, and PWM peripherals commonly used in body-network ECUs.
What is the difference between MC9S12DG256BVPV and MC9S12DG256CPVE?
The MC9S12DG256BVPV (suffix BVPV) and the MC9S12DG256CPVE (suffix CPVE) both deliver 256 KB Flash in the 112-LQFP package but differ in their operating temperature grade. The BVPV suffix corresponds to the industrial temperature range, while CPVE specifies the extended automotive temperature grade. Designers should pick the CPVE variant for under-hood or severe-environment ECUs.
Can MC9S12DG256BVPV be replaced by MC9S12XD256CAL?
No, the MC9S12XD256CAL is not a drop-in replacement for the MC9S12DG256BVPV. The X-family parts use the CPU12X core with extended addressing and additional peripheral modules, and they ship in different packages. If your design must stay pin-compatible, choose a part from the MC9S12D-family with the same 112-LQFP-20 footprint.
Where to download MC9S12DG256BVPV datasheet PDF?
The MC9S12DG256BVPV datasheet PDF is available on NXP's official product page, on third-party archives such as Alldatasheet and ManualsLib, and in the distributor listings on DigiKey and Mouser. The user reference manual (MC9S12DT256 Device User Guide) documents the peripheral set and the BDM programming model. Always cross-reference the latest revision on nxp.com before locking down your design.
What is the pinout of MC9S12DG256BVPV?
The MC9S12DG256BVPV pinout is defined for the 112-LQFP package and includes dedicated pins for VDD/VSS pairs, XTAL/EXTAL, RESET, BKGD (BDM), MODC, PAD0-PAD23, AN0-AN15, PWM channels, CAN pins (CANRx/CANTx), SCI pins (TxD/RxD), SPI pins (MOSI/MISO/SPSCK/SS), and the I2C pins (SDA/SCL). Refer to the manufacturer pinout diagram for the exact mapping, since MC9S12D-family packages reuse pins across peripheral functions.
Is MC9S12DG256BVPV in stock and lead-time?
According to DigiKey, the MC9S12DG256BVPV ships immediately at small quantities. Pricing as of 2026-10-18 starts at approximately $22.45 for 1 piece, with steeper price breaks at 100 and 500 pieces. For volume production, request a quote to confirm factory lead time, since the HCS12 family is widely stocked at major distributors but can swing on allocation.
What is the price of MC9S12DG256BVPV?
The MC9S12DG256BVPV unit price as of 2026-10-18 starts around $22.45 for 1-piece quantities and falls to roughly $15.60 at 500 pieces. Industrial-grade volumes can drop below $14 with direct factory orders. Prices vary by distributor (DigiKey, Mouser, Avnet) and by lead-time; always request a current quote before committing to a BOM.
Where to buy MC9S12DG256BVPV online?
The MC9S12DG256BVPV is available online from authorized distributors including DigiKey, Mouser, Avnet, and Newark. XAIPART also lists current stock and pricing for the part. For obsolete or hard-to-find variants of the HCS12 family, independent brokers may carry inventory but require incoming-inspection and traceability verification.
How does MC9S12DG256BVPV compare to the MC9S12XDT512MAL?
The MC9S12XDT512MAL uses the CPU12X core with extended addressing and 512 KB Flash, so it is not a drop-in equivalent for the MC9S12DG256BVPV. It also changes the package and pinout. If your application needs more Flash within the same 112-LQFP-20 footprint, look at the MC9S12DT256 or MC9S12A256 family members rather than the X-series.

Données de référence d'ingénierie pour MC9S12DG256BVPV — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC9S12DG256BVPV when you need a 16-bit HCS12 MCU with 256 KB Flash, 12 KB RAM, 91 I/O lines, and an on-board CAN 2.0 A/B controller in a 112-LQFP-20 footprint for industrial-temperature cabin/body-network ECUs. Pick MC9S12DG256CPVE for extended automotive temperature grades, MC9S12DT256BVPV if you need a second msCAN channel on the same footprint, and MC9S12A256CPVE if you can drop CAN to save cost. For designs that need the CPU12X core or higher Flash density, evaluate the XDT family - but verify the package before locking the PCB layout.

Comparaison avec les alternatives

Paramètre Ce produit MC9S12DG256CPVE MC9S12DG256BCPV MC9S12DT256BVPV MC9S12A256CPVE MC9S12DG256MPVE
Package 112-LQFP (20x20) 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Processor HCS12 (CPU12) HCS12 (CPU12) HCS12 (CPU12) HCS12 (CPU12) HCS12 (CPU12) HCS12 (CPU12)
Maximum Clock Speed 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
Flash Size 256 KB 256 KB 256 KB 256 KB 256 KB 256 KB
RAM Size 12 KB 12 KB 12 KB 12 KB 12 KB 12 KB
CAN Controllers 1 x msCAN 1 x msCAN 1 x msCAN 2 x msCAN 1 x msCAN 1 x msCAN
Temperature Grade Industrial (-40C to +85C) Extended automotive Industrial Industrial Extended automotive Industrial
RoHS Compliance Compliant Compliant Compliant Compliant Compliant Compliant

Principaux différenciateurs

  • Industrial-grade temperature in the BVPV suffix variant (vs MC9S12DG256CPVE)
  • Single msCAN + maximum pin compatibility (vs MC9S12DT256BVPV)
  • 256 KB Flash without second CAN (vs MC9S12A256CPVE)

Notes de conception

Decouple every VDD/VSS pair close to the IC with a 100 nF ceramic plus a bulk 4.7 uF tantalum or ceramic, and add a 1 uF + 10 nF pair on VDDA/VSSA to keep ADC noise low. Place the bulk capacitor within 25 mm of the supply pins and route a wide, low-impedance ground plane directly under the LQFP-112 footprint. The internal 2.5 V regulator still requires a stable 5 V input; add a Pi-filter (ferrite + cap) when sharing the 5 V rail with inductive loads.

Estimated: with a 4-layer PCB and the recommended footprint, theta_JA for the 112-LQFP-20 is approximately 45 C/W in still air. At 25 MHz with all peripherals active, power dissipation is roughly 250 mW, producing a self-heating rise of only 11 C above ambient - well within the 85 C ceiling. For sealed enclosures without airflow, derate the bus frequency or add a copper heat-spreader footprint under the exposed die paddle area.

Keep the BDM (BKGD) trace under 50 mm and protect it with a series 4.7 k resistor to avoid programming glitches. Place the EXTAL/XTAL crystal within 10 mm of the pins with a grounded guard ring to suppress crosstalk. The CAN bus traces should be a 120 ohm differential pair routed away from PWM edges to meet CAN 2.0 signal-integrity margins, and the analog inputs (AN0-AN7) should be guarded by a ground trace to reject switching noise.

Do not leave MODC floating - tie it to VDD or GND through a 10 k resistor to select the desired mode after reset. The MODC, BKGD, and RESET pins are critical for in-circuit programming and must be brought to test points if production-line firmware updates are planned. Verify the PLL filter components (R-C network on VDDPLL/VSSPLL) match the manufacturer reference design; incorrect values will prevent the bus from locking at 25 MHz.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS and REACH compliant per DigiKey product listing. The MC9S12DG256BVPV is the industrial-temperature grade; for AEC-Q100 automotive qualification choose the MC9S12DG256CPVE or equivalent Q-suffix variant. Halogen-free status not stated on the distributor page - verify with the manufacturer before halogen-sensitive designs.

Données vérifiées le : 2026-10-18 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

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Composants & termes associés

NXP Semiconductors MC9S12DG256BVPV MC9S12DG256CPVE MC9S12DT256BVPV MC9S12A256CPVE HCS12 CPU12 CISC microcontroller 16-bit MCU msCAN CAN 2.0 A/B BDM LQFP-112 LQFP automotive body controller instrument cluster HVAC module RoHS REACH AEC-Q100 Flash memory EEPROM PWM I2C SPI
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