NT5CC256M16CN-FLI - 4Gb DDR3L SDRAM | Nanya Technology
N.º da peça: NT5CC256M16CN-FLI ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.8 | $980,00 |
| 500 | $8.5 | $4.250,00 |
| 1.000 | $7.2 | $7.200,00 |
NT5CC256M16CN-FLI Visão geral
DDR3L SDRAM is a type of dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by approximately 20% while maintaining similar performance. It is part of the DDR3 memory family, which uses double data rate architecture to transfer data on both edges of the clock signal, and is widely used in computing, networking, and embedded systems.
Key features include a 16-bit I/O interface, 8 internal banks, burst lengths of 8 and 4 (with burst chop), on-die termination (ODT), and programmable CAS latency. The device supports auto self-refresh and auto precharge functions, ensuring data integrity with minimal power. It also includes write leveling, data mask, and ZQ calibration functions for signal integrity and system reliability.
The NT5CC256M16CN-FLI is fabricated using Nanya's advanced DRAM process technology, providing high density and low power consumption. It supports a temperature range of 0°C to +95°C (case temperature) for industrial applications, with derating required above 95°C. The device is RoHS compliant and lead-free, meeting environmental standards.
Typical applications include DDR3L memory modules for laptops, embedded systems, networking equipment, and industrial computing. Its low voltage and high speed make it ideal for power-sensitive designs, while the industrial temperature range supports harsh environments.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the PCB layout guidelines in the datasheet to minimize signal integrity issues. The device requires a stable 1.35V supply and a 0.75V reference voltage for the address/command bus.
Alternativas drop-in para NT5CC256M16CN-FLI — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com NT5CC256M16CN-FLI (mesmo formato e footprint) — diferindo em Package, Supply Voltage, Data Rate, Density, Auto Self-Refresh.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
NT5CC256M16ER-EK
✅ Drop-In✓ Em estoque
$24 / unidade
Ver ficha técnica →NT5CC256M16CP-FLI
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
NT5CC256M16CN-DIA
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MT41K256M16TW-107
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$14.1 / unidade
Ver ficha técnica →K4B4G1646E-BYMA
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$14.3182 / unidade
Ver ficha técnica →NT5CC256M16CN-FLI Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Density | 4Gb (256M x 16) |
| Tensão de alimentação | 1.35V (DDR3L) |
| Taxa de dados | 1866 Mbps (PC3-14900) |
| I/O Width | 16 bits |
| Internal Banks | 8 |
| Burst Length | 8 and 4 (with burst chop) |
| Latência CAS | Programmable (11, 12, 13) |
| Encapsulamento | TFBGA-96 |
| Faixa de temperatura de operação | 0°C to +95°C (case) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Auto Self-Refresh | Supported |
| Auto Precharge | Supported |
| On-Die Termination (ODT) | Supported |
| Write Leveling | Supported |
| ZQ Calibration | Supported |
Configuração de pinos do NT5CC256M16CN-FLI
| Pino A1 | VDD — Power supply (1.35V) |
| Pino A2 | DQ0 — Data I/O 0 |
| Pino A3 | DQ1 — Data I/O 1 |
| Pino A4 | VSS — Ground |
| Pino B1 | DQ2 — Data I/O 2 |
| Pino B2 | DQ3 — Data I/O 3 |
| Pino B3 | VDDQ — I/O power supply |
| Pino C1 | DQ4 — Data I/O 4 |
| Pino C2 | DQ5 — Data I/O 5 |
| Pino C3 | VSSQ — I/O ground |
| Pino D1 | DQ6 — Data I/O 6 |
| Pino D2 | DQ7 — Data I/O 7 |
| Pino D3 | VDD — Power supply |
| Pino E1 | DM0 — Data mask 0 |
| Pino E2 | DQS0 — Data strobe 0 |
| Pino E3 | DQS0# — Data strobe 0 complement |
Aplicações típicas
NT5CC256M16CN-FLI é adequado para 6 aplicaçãos: Embedded Computing, Networking Equipment, Industrial Automation, Automotive Infotainment, Consumer Electronics, Data Storage Systems.
Embedded Computing
The NT5CC256M16CN-FLI provides high-density, low-power memory for embedded processors and SoCs. Its 1.35V operation reduces power consumption, making it ideal for battery-powered devices. The 1866 Mbps data rate ensures fast data access for real-time applications. When used in embedded systems, it is typically paired with a DDR3L controller, and proper termination and decoupling are essential for signal integrity.
Recomendado
Networking Equipment
In networking equipment such as routers and switches, the NT5CC256M16CN-FLI provides high-speed packet buffering and routing tables. Its 1866 Mbps data rate supports high-throughput data processing, while the industrial temperature range ensures reliability in telecom environments. The device's on-die termination and write leveling features improve signal integrity on high-speed buses, reducing bit errors.
Recomendado
Industrial Automation
The NT5CC256M16CN-FLI is suitable for industrial automation systems that require reliable memory in harsh conditions. Its 0°C to +95°C operating range and auto self-refresh function ensure data integrity during power fluctuations. The low 1.35V supply reduces heat generation, which is critical in sealed enclosures. It can be used in PLCs, HMIs, and motor control units.
Recomendado
Automotive Infotainment
In automotive infotainment systems, the NT5CC256M16CN-FLI provides high-bandwidth memory for navigation, multimedia, and instrument clusters. Its automotive-grade variant (NT5CC256M16CN-DIA) is AEC-Q100 qualified, ensuring reliability in extreme temperatures. The 1.35V operation reduces power consumption, which is important for vehicle battery life. The device supports fast boot times and smooth graphics rendering.
Recomendado
Consumer Electronics
The NT5CC256M16CN-FLI is used in consumer electronics such as smart TVs, set-top boxes, and gaming consoles. Its high density and low power make it ideal for multimedia applications that require large memory buffers. The 1866 Mbps data rate supports 4K video streaming and multitasking. The compact TFBGA-96 package allows for slim device designs.
Recomendado
Data Storage Systems
In data storage systems such as SSDs and NAS devices, the NT5CC256M16CN-FLI serves as a cache buffer for high-speed data transfers. Its low latency and high bandwidth improve read/write performance. The auto self-refresh feature reduces power consumption during idle periods, which is critical for always-on storage devices. The industrial temperature range supports data center environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para NT5CC256M16CN-FLI — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | NT5CC256M16ER-EK | NT5CC256M16CP-FLI | NT5CC256M16CN-DIA | MT41K256M16TW-107 | K4B4G1646E-BYMA |
|---|---|---|---|---|---|---|
| Package | TFBGA-96 | TFBGA-96 | TFBGA-96 | TFBGA-96 | FBGA-96 | FBGA-96 |
| Brand | Nanya Technology | Nanya Technology | Nanya Technology | Nanya Technology | Micron Technology | Samsung Electronics |
| Density | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb | 4Gb |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps | 1866 Mbps |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | -40°C to +95°C (automotive) | 0°C to +95°C | 0°C to +95°C |
| Automotive Grade | No | No | No | Yes (AEC-Q100) | No | No |
Principais diferenciais
- Industrial temperature range (vs NT5CC256M16ER-EK)
- Automotive grade option (vs NT5CC256M16CN-DIA)
- Lower cost (vs NT5CC256M16ER-EK)
Notas de projeto
Ensure proper decoupling capacitors (0.1uF and 1uF) are placed close to each VDD and VDDQ pin. Use a solid ground plane and minimize trace lengths for DQ and DQS signals to maintain signal integrity at 1866 Mbps.
The device operates up to +95°C case temperature. For high ambient temperatures, ensure adequate airflow or heatsinking. Above 95°C, AC/DC parameters must be derated as per the datasheet note 5.
Use on-die termination (ODT) settings to match the bus impedance. Enable write leveling for proper DQS-DQ alignment. Follow the layout guidelines in the Nanya datasheet for address/command routing to avoid crosstalk.
Informações de conformidade
RoHS compliant and lead-free per Nanya datasheet. AEC-Q100 not applicable for this variant; use NT5CC256M16CN-DIA for automotive.
