EPM570T100C4N - MAX II CPLD, 570 LE, 440 Macrocells, TQFP-100 | Intel
Артикул: EPM570T100C4N ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $14.2 | $14,20 |
| 10 | $12.78 | $127,80 |
| 100 | $11.36 | $1.136,00 |
| 500 | $10.1 | $5.050,00 |
| 1.000 | $9.05 | $9.050,00 |
EPM570T100C4N Обзор
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macrocell blocks on a single die with a global interconnect fabric. It sits in the programmable logic hierarchy between simple SPLDs (like GAL/PAL) and high-density FPGAs (like MAX 10 or Cyclone), making it ideal for I/O expansion, bus bridging, power-sequencing logic, and high-drive control where deterministic timing and instant-on boot are mandatory. The MAX II family specifically targets low-power, low-cost glue-logic replacement with on-chip flash storage that eliminates an external configuration PROM.
Key features include 8 Kbits of user flash memory, an on-chip voltage regulator (single 3.3 V supply with internal generation of 1.8 V core), JTAG-based IEEE 1149.1 in-system programmability, 4-input look-up tables, and a MultiVolt I/O bank that supports 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces on the same die. The flash-based configuration memory removes the boot-delay penalty of SRAM FPGAs and is fully re-programmable in-circuit.
Technically, the EPM570T100C4N implements a Logic Array Block (LAB) architecture of 570 LEs distributed across 19 LABs, with each macrocell containing a programmable register, product-term logic, and I/O control. The non-volatile flash cell array achieves zero boot latency, enabling the device to drive outputs within microseconds of power-up. The 100-pin TQFP (T4 suffix = commercial 0 °C to 85 °C, speed grade 4 = 5.4 ns tpd) variant exposes 76 user I/Os and is footprint-compatible with EPM570T100C3N/C5N speed and density siblings.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-sequencing and supervisory logic in networking equipment, glue logic in telecom backplanes, motor-control and LED-driving interfaces, and legacy 5V CPLD replacement in telecom/medical designs. The instant-on non-volatile configuration is particularly valued in deterministic boot systems such as automotive clusters, building automation, and safety-critical industrial controls.
Design considerations include placing the 0.1 µF + 1 µF decoupling capacitors as close as possible to every VCCINT/VCCIO pin pair, providing a clean 3.3 V rail (the internal regulator rejects to 1.8 V core), and verifying the MultiVolt bank voltage (VCCIO) matches the driven interface before any configuration bitstream is loaded. Designers should also confirm the 100-pin TQFP thermal envelope supports their continuous-junction loading before relying on it in enclosed industrial housings.
This page synthesizes distributor stock and pricing snapshots, MAX II drop-in alternatives, and practical glue-logic design notes not collected in any single manufacturer document.
Аналоги без доработки для EPM570T100C4N — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с EPM570T100C4N (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Family, Process Technology, Programming Interface.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
EPM570T100C5N
✅ Прямая замена✓ В наличии
$10.2 / шт.
Открыть даташит →EPM570T100C3N
✅ Прямая замена✓ В наличии
$8.1 / шт.
Открыть даташит →EPM570T100C4
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$9.4 / шт.
Открыть даташит →EPM570T100I5N
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$12.49 / шт.
Открыть даташит →EPM570GT100C5N
✅ Прямая замена✓ В наличии
$11.05 / шт.
Открыть даташит →EPM570GT100C4N
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$9.85 / шт.
Открыть даташит →EPM570T100C4N Максимальные параметры и электрические характеристики
| Family | MAX II |
| Series | MAX® II |
| Logic Elements / Blocks | 570 |
| Macrocells | 440 |
| Number of User I/O | 76 |
| Propagation Delay (tpd) | 5.4 ns (speed grade 4) |
| Maximum Internal Frequency | 247.5 MHz |
| Process Technology | 0.18 µm |
| Supply Voltage - Internal | 2.5 V / 3.3 V |
| Programmable Type | In-System Programmable (Flash, non-volatile) |
| User Flash Memory | 8 Kbits |
| Рабочая температура | 0 °C to 85 °C (TJ, commercial) |
| Тип монтажа | Surface Mount |
| Корпус / Типоразмер | 100-TQFP (14 x 14 mm) |
| Supplier Device Package | 100-TQFP |
| Configuration Memory | Internal flash (no external PROM required) |
| JTAG / ISP | IEEE 1149.1 compliant |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Product Status | Active |
| Статус RoHS | Compliant |
Конфигурация выводов EPM570T100C4N
| Контакт 1 | I/O — User I/O bank 1 |
| Контакт 2 | I/O — User I/O bank 1 |
| Контакт 3 | I/O — User I/O bank 1 |
| Контакт 4 | I/O — User I/O bank 1 |
| Контакт 5 | I/O — User I/O bank 1 |
| Контакт 6 | I/O — User I/O bank 1 |
| Контакт 7 | I/O — User I/O bank 1 |
| Контакт 8 | I/O — User I/O bank 1 |
| Контакт 9 | I/O — User I/O bank 1 |
| Контакт 10 | I/O — User I/O bank 1 |
| Контакт 11 | GND — Ground |
| Контакт 12 | I/O — User I/O bank 2 |
| Контакт 13 | I/O — User I/O bank 2 |
| Контакт 14 | I/O — User I/O bank 2 |
| Контакт 15 | I/O — User I/O bank 2 |
| Контакт 16 | I/O — User I/O bank 2 |
| Контакт 17 | I/O — User I/O bank 2 |
| Контакт 18 | I/O — User I/O bank 2 |
| Контакт 19 | I/O — User I/O bank 2 |
| Контакт 20 | I/O — User I/O bank 2 |
| Контакт 21 | GND — Ground |
| Контакт 22 | I/O — User I/O bank 2 |
| Контакт 23 | I/O — User I/O bank 2 |
| Контакт 24 | I/O — User I/O bank 2 |
| Контакт 25 | I/O — User I/O bank 2 |
| Контакт 26 | I/O — User I/O bank 2 |
| Контакт 27 | I/O — User I/O bank 2 |
| Контакт 28 | VCCIO1 — I/O bank 1 supply voltage |
| Контакт 29 | I/O — User I/O bank 1 |
| Контакт 30 | TDI — JTAG Test Data In |
| Контакт 31 | I/O — User I/O bank 1 |
| Контакт 32 | I/O — User I/O bank 1 |
| Контакт 33 | I/O — User I/O bank 1 |
| Контакт 34 | I/O — User I/O bank 1 |
| Контакт 35 | I/O — User I/O bank 1 |
| Контакт 36 | I/O — User I/O bank 1 |
| Контакт 37 | I/O — User I/O bank 1 |
| Контакт 38 | I/O — User I/O bank 1 |
| Контакт 39 | I/O — User I/O bank 1 |
| Контакт 40 | TMS — JTAG Test Mode Select |
| Контакт 41 | VCCIO1 — I/O bank 1 supply voltage |
| Контакт 42 | I/O — User I/O bank 1 |
| Контакт 43 | I/O — User I/O bank 1 |
| Контакт 44 | I/O — User I/O bank 1 |
| Контакт 45 | I/O — User I/O bank 1 |
| Контакт 46 | I/O — User I/O bank 1 |
| Контакт 47 | I/O — User I/O bank 1 |
| Контакт 48 | I/O — User I/O bank 1 |
| Контакт 49 | I/O — User I/O bank 1 |
| Контакт 50 | I/O — User I/O bank 1 |
| Контакт 51 | TCK — JTAG Test Clock |
| Контакт 52 | GND — Ground |
| Контакт 53 | I/O — User I/O bank 3 |
| Контакт 54 | I/O — User I/O bank 3 |
| Контакт 55 | I/O — User I/O bank 3 |
| Контакт 56 | I/O — User I/O bank 3 |
| Контакт 57 | I/O — User I/O bank 3 |
| Контакт 58 | I/O — User I/O bank 3 |
| Контакт 59 | I/O — User I/O bank 3 |
| Контакт 60 | I/O — User I/O bank 3 |
| Контакт 61 | I/O — User I/O bank 3 |
| Контакт 62 | I/O — User I/O bank 3 |
| Контакт 63 | VCCIO3 — I/O bank 3 supply voltage |
| Контакт 64 | I/O — User I/O bank 3 |
| Контакт 65 | I/O — User I/O bank 3 |
| Контакт 66 | I/O — User I/O bank 3 |
| Контакт 67 | I/O — User I/O bank 3 |
| Контакт 68 | I/O — User I/O bank 3 |
| Контакт 69 | I/O — User I/O bank 3 |
| Контакт 70 | I/O — User I/O bank 3 |
| Контакт 71 | I/O — User I/O bank 3 |
| Контакт 72 | TDO — JTAG Test Data Out |
| Контакт 73 | VCCIO3 — I/O bank 3 supply voltage |
| Контакт 74 | I/O — User I/O bank 3 |
| Контакт 75 | I/O — User I/O bank 3 |
| Контакт 76 | I/O — User I/O bank 3 |
| Контакт 77 | I/O — User I/O bank 3 |
| Контакт 78 | I/O — User I/O bank 3 |
| Контакт 79 | I/O — User I/O bank 3 |
| Контакт 80 | I/O — User I/O bank 3 |
| Контакт 81 | I/O — User I/O bank 3 |
| Контакт 82 | I/O — User I/O bank 3 |
| Контакт 83 | GND — Ground |
| Контакт 84 | I/O — User I/O bank 4 |
| Контакт 85 | I/O — User I/O bank 4 |
| Контакт 86 | I/O — User I/O bank 4 |
| Контакт 87 | I/O — User I/O bank 4 |
| Контакт 88 | I/O — User I/O bank 4 |
| Контакт 89 | I/O — User I/O bank 4 |
| Контакт 90 | I/O — User I/O bank 4 |
| Контакт 91 | I/O — User I/O bank 4 |
| Контакт 92 | I/O — User I/O bank 4 |
| Контакт 93 | VCCIO4 — I/O bank 4 supply voltage |
| Контакт 94 | I/O — User I/O bank 4 |
| Контакт 95 | I/O — User I/O bank 4 |
| Контакт 96 | I/O — User I/O bank 4 |
| Контакт 97 | I/O — User I/O bank 4 |
| Контакт 98 | I/O — User I/O bank 4 |
| Контакт 99 | I/O — User I/O bank 4 |
| Контакт 100 | I/O — User I/O bank 4 |
Типичное применение
EPM570T100C4N подходит для 6 применениеs: Industrial I/O Expansion and Bus Bridging, Power Sequencing and Supervisory Logic, Networking and Telecom Backplane Glue Logic, Motor Control and LED Driving Interfaces, Legacy 5V CPLD Replacement, Automotive Cluster and Building Automation Logic.
Industrial I/O Expansion and Bus Bridging
The EPM570T100C4N fits industrial I/O expansion boards because its 76 user I/Os in a 100-TQFP package, 5.4 ns pin-to-pin delay, and MultiVolt 1.5/1.8/2.5/3.3 V banks let one device bridge legacy 5V-tolerant logic, 3.3 V microcontrollers, and 1.8 V FPGAs on the same PCB. Designers typically instantiate it as an address-latch, level shifter, or parallel-to-SPI converter sitting between a host MCU and a downstream ASIC. The non-volatile flash configuration eliminates boot-PROM overhead and lets the CPLD drive enable lines within microseconds of power-up - critical for deterministic industrial control loops. Compared with a small FPGA, the MAX II gives instant-on behavior and lower quiescent cost for glue-logic density in this class.
Рекомендуется
Power Sequencing and Supervisory Logic
The EPM570T100C4N is widely used in power-sequencing and supervisory logic for ATX-style and telecom boards because its 440 macrocells and 0.4 ns granularity combinational paths let designers implement multi-rail sequencers, watchdog timers, and reset-orchestration state machines on 76 I/Os. Its 5.4 ns tpd plus 247.5 MHz fMAX guarantee sub-microsecond response to PG (power-good) edges, and the instant-on flash boot means rails are sequenced without boot-PROM delay. Typical usage places the CPLD between a supervisor IC and the load-switch FETs, generating delayed enable pulses and ORing fault signals into a single PCH-compatible reset. Compared with discrete sequencer ICs, the EPM570T100C4N offers re-programmable sequencing graphs.
Рекомендуется
Networking and Telecom Backplane Glue Logic
In telecom backplanes the EPM570T100C4N acts as a mid-density glue-logic hub, decoding address lines, generating chip-selects for SRAM/Flash banks, and converting between LVCMOS and HSTL interfaces on the same die. Its 76 MultiVolt I/Os let it sit directly on 1.8 V FPGA transceivers and 3.3 V PHY devices without external level shifters, while 440 macrocells are enough to map 16-bit address-decoding trees and 4-channel FIFO flag logic. The 5.4 ns tpd plus 247.5 MHz fMAX meet the hold-time budgets of Fast Ethernet and PCIe Gen1 sideband signals. Compared with a discrete 74AVC/74LVC logic forest, one EPM570T100C4N replaces 30+ buffers in the same board area.
Рекомендуется
Motor Control and LED Driving Interfaces
Motor-control and LED-driving front-ends use the EPM570T100C4N as a flexible PWM generator and fault aggregator, leveraging its 76 user I/Os to drive multiple half-bridge drivers, encode Hall-sensor inputs, and arbitrate hardware protection signals in real time. The 247.5 MHz internal frequency supports PWM resolutions down to ~8 ns at 100 kHz switching, and the 5.4 ns tpd ensures sub-microsecond response to overcurrent comparator trips. Its MultiVolt I/O banks accept 3.3 V MCU outputs and 5 V gate-driver feedback without level shifters, and the flash-based boot means the motor controller is ready within microseconds of DC-bus connection - essential for safe soft-start of PMSM and BLDC drives.
Рекомендуется
Legacy 5V CPLD Replacement
The EPM570T100C4N is a popular drop-in for legacy 5V CPLDs (such as Altera MAX 7000 and Xilinx XC9500 designs) because it delivers equivalent macrocell density at lower power and adds 1.5/1.8/2.5/3.3 V MultiVolt I/O compatibility for modern system designs. With 440 macrocells, 76 I/Os, and 5.4 ns tpd it covers the bulk of legacy state-machine, decoder, and bus-interface designs while shrinking board area and removing the external 5V regulator. Designs can be migrated using the Quartus II 'MAX 7000 to MAX II' project wizard with full pinout preservation in the 100-TQFP footprint. Compared with maintaining an obsolete 5V CPLD on a BOM, the EPM570T100C4N improves lifecycle and EMI simultaneously.
Рекомендуется
Automotive Cluster and Building Automation Logic
In automotive instrument clusters and building-automation controllers, the EPM570T100C4N serves as deterministic glue logic between microcontrollers, display drivers, CAN transceivers, and sensor front-ends. Its instant-on flash configuration makes outputs settle within microseconds of battery connection - critical for safety indicators that must illuminate at crank. The 76 MultiVolt I/Os interface seamlessly with 3.3 V MCUs and 5 V sensor networks, and 440 macrocells are enough to encode CAN-to-LIN gateways, HVAC mode logic, and gauge-stepper waveforms. Designers choose the commercial 0-85 °C variant for cabin modules and migrate to EPM570T100I5N for under-hood locations, all within the same 100-TQFP footprint.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для EPM570T100C4N — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | EPM570T100C5N | EPM570T100C3N | EPM570T100I5N | EPM570GT100C5N | EPM570GT100C4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel (MAX II G) | Intel (MAX II G) |
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/O | 76 | 76 | 76 | 76 | 76 | 76 |
| tpd (pin-to-pin) | 5.4 ns | 5.0 ns (faster) | 6.5 ns (slower) | 5.0 ns (faster, industrial) | 5.0 ns | 5.4 ns |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | -40 °C to 100 °C (industrial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) |
| Core Supply | Internal 1.8 V regulator (single 3.3 V in) | Internal regulator (same) | Internal regulator (same) | Internal regulator (same) | External 1.8 V required | External 1.8 V required |
| Configuration Memory | Internal flash (instant-on) | Internal flash | Internal flash | Internal flash | Internal flash | Internal flash |
Ключевые отличия
- Instant-on non-volatile flash configuration eliminates boot PROM (против SRAM-based CPLDs/FPGAs)
- MultiVolt I/O banks interface directly to 1.5/1.8/2.5/3.3 V logic on the same die (против Legacy 5V-only CPLDs (e.g. MAX 7000))
- Pin-to-pin compatibility across speed grades (C3N/C4N/C5N) and temperature grades (C/I) in the same 100-TQFP footprint (против EPM570 in different packages (e.g. BGA-256))
Заметки по проектированию
The EPM570T100C4N integrates an internal 1.8 V core regulator that operates from a single 3.3 V VCCINT supply. Place one 0.1 µF ceramic decoupling cap within 5 mm of every VCCINT pin and one bulk 10 µF tantalum or ceramic cap near the package; do NOT connect an external 1.8 V rail to VCCINT, as this will back-drive the internal LDO and may damage the device. The MultiVolt VCCIO banks (1.5/1.8/2.5/3.3 V) must each have their own 0.1 µF + 1 µF decoupling pair because they power the I/O drivers directly. Estimated: at 247.5 MHz internal toggle and all 76 I/Os at 25 pF/10 MHz, the device draws approximately 30-50 mA from VCCINT - confirm with the Quartus II PowerPlay analyzer for your design.
Use a four-layer PCB with a continuous ground plane beneath the 100-TQFP footprint; split power planes are acceptable only if the 3.3 V and VCCIO islands do not cross high-di/dt return paths. JTAG signals (TCK/TMS/TDO/TDI) should be routed with 50 Ω characteristic impedance and pulled up to VCCIO1 through 10 kΩ resistors per the MAX II handbook recommendation; missing pull-ups are the single most common cause of ByteBlaster II programming failures. Keep TCK trace length under 75 mm to maintain signal integrity at the 10 MHz default JTAG clock. Thermal performance of the 100-TQFP at full 76-I/O 25 MHz LVCMOS toggle is typically a 15-20 °C junction rise, so no heatsink is required for commercial-temperature designs.
Three pitfalls appear repeatedly in EPM570T100C4N designs: (1) leaving JTAG pins floating - this causes intermittent ISP failures; always add 10 kΩ pull-ups to VCCIO1 on TCK, TMS, TDI, and TRST if exposed. (2) Driving VCCIO before VCCINT during power-up sequencing - the MAX II tolerates any order, but mixed-voltage ramps can momentarily enable I/O during core reset; insert a 1 ms RC delay on VCCIO if your upstream regulator has soft-start. (3) Confusing MAX II (internal regulator) with MAX II G (external 1.8 V core) - a MAX II G device will not program if VCCINT is left at 3.3 V. Always verify the device marking before PCB bring-up.
Информация о соответствии
RoHS and lead-free compliance confirmed via Altera/Intel product environmental certification documents. REACH status per EU distributor declarations. AEC-Q100 is not applicable to CPLDs of this class; for automotive applications use the AEC-Q100-qualified MAX V or Cyclone families instead.
