EPM570ZM100I8N - 440-Macrocell MAX II CPLD, 100-BGA | Intel / Altera
N.º da peça: EPM570ZM100I8N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $26.42 | $26,42 |
| 10 | $23.78 | $237,80 |
| 100 | $21.13 | $2.113,00 |
| 500 | $18.49 | $9.245,00 |
| 1.000 | $16.5 | $16.500,00 |
EPM570ZM100I8N Visão geral
What is a CPLD? A Complex Programmable Logic Device (CPLD) is a non-volatile, low-density programmable logic device that sits architecturally between discrete logic gates (74HC, 74LV) and FPGAs. CPLDs typically contain a few hundred to a few thousand macrocells organized into Logic Array Blocks (LABs) with a deterministic, non-volatile interconnect fabric. Compared to FPGAs, CPLDs have lower logic density, lower power consumption, instant-on configuration (< 1 ms), and a more predictable timing model that simplifies timing closure for glue-logic and bus-interface designs.
Key features of the EPM570ZM100I8N include 570 Logic Elements, 57 LABs, 440 macrocells, 76 user I/Os, JTAG-compliant IEEE 1149.1 boundary-scan support, in-system programmability (ISP) via JTAG, a chip-wide DEV_OE output-enable pin, and on-chip flash user flash memory for user data storage. The MAX II family is built on a 0.18 μm flash process and is specified for the industrial -40 °C to +85 °C temperature range.
Typical applications include bus-interface bridging (for example, address-latch or chip-select decoding in legacy microprocessor systems), power-sequencer logic, I/O expansion for microcontrollers, LED-display drivers, and configurable glue logic in industrial-control boards where the non-volatile, instant-on behavior of a CPLD is more attractive than an FPGA's configuration delay.
When designing with this device, ensure PCB layout accommodates the 0.8 mm pitch FineLine BGA and that JTAG pins (TCK, TMS, TDI, TDO) are brought out to a test header. The EPM570Z's 1.8 V core must be supplied independently from the 3.3 V or 2.5 V I/O bank supply used by surrounding logic. Always reference the Altera MAX II Device Handbook for timing-model parameters.
Alternativas drop-in para EPM570ZM100I8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570ZM100I8N (mesmo formato e footprint) — diferindo em Series, Operating Temperature, Package, Process Technology, Logic Elements.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570ZM100C7N
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$12.55 / unidade
Ver ficha técnica →EPM570ZM100C6N
✅ Drop-In✓ Em estoque
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Ver ficha técnica →EPM570M100I5N
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Ver ficha técnica →EPM570M100C5N
✅ Drop-In✓ Em estoque
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Ver ficha técnica →EPM570GM100I5N
✅ Drop-In✓ Em estoque
$8.55 / unidade
Ver ficha técnica →EPM570ZM100I8N Classificações máximas e características elétricas
| Device Family | MAX II |
| Series | EPM570Z |
| Logic Elements | 570 |
| Number of Macrocells | 440 |
| Number of Logic Array Blocks (LABs) | 57 |
| User I/Os | 76 |
| Maximum Operating Frequency | 152 MHz |
| Propagation Delay (tPD) | 9 ns |
| Operating Supply Voltage (Core) | 1.8 V |
| Programming Technology | Flash, non-volatile |
| In-System Programmability (ISP) | Yes (JTAG) |
| Boundary Scan | IEEE 1149.1 (JTAG) |
| Faixa de temperatura de operação | -40 C to +85 C (Industrial) |
| Estilo de montagem | SMD/SMT |
| Encapsulamento / Caixa | 100-ball FineLine BGA (MBGA, 0.8 mm pitch) |
| Packaging | Tray |
Configuração de pinos do EPM570ZM100I8N
| Pino A1 | I/O — User I/O pin (bank 1) |
| Pino A2 | I/O — User I/O pin (bank 1) |
| Pino A3 | I/O — User I/O pin (bank 1) |
| Pino A4 | VCCIO1 — I/O bank 1 supply voltage |
| Pino A5 | I/O — User I/O pin (bank 1) |
| Pino A6 | I/O — User I/O pin (bank 1) |
| Pino A7 | I/O — User I/O pin (bank 1) |
| Pino A8 | I/O — User I/O pin (bank 1) |
| Pino A9 | GND — Ground |
| Pino A10 | I/O — User I/O pin (bank 1) |
| Pino B1 | I/O — User I/O pin (bank 1) |
| Pino B2 | GND — Ground |
| Pino B3 | I/O — User I/O pin (bank 1) |
| Pino B4 | I/O — User I/O pin (bank 1) |
| Pino B5 | I/O — User I/O pin (bank 1) |
| Pino B6 | I/O — User I/O pin (bank 1) |
| Pino B7 | I/O — User I/O pin (bank 1) |
| Pino B8 | I/O — User I/O pin (bank 1) |
| Pino B9 | I/O — User I/O pin (bank 1) |
| Pino B10 | I/O — User I/O pin (bank 1) |
| Pino C1 | TDI — JTAG Test Data In |
| Pino C2 | I/O — User I/O pin (bank 1) |
| Pino C3 | VCCINT — Core supply voltage (1.8 V) |
| Pino C4 | I/O — User I/O pin (bank 1) |
| Pino C5 | GND — Ground |
| Pino C6 | I/O — User I/O pin (bank 1) |
| Pino C7 | I/O — User I/O pin (bank 1) |
| Pino C8 | I/O — User I/O pin (bank 1) |
| Pino C9 | VCCIO1 — I/O bank 1 supply voltage |
| Pino C10 | TCK — JTAG Test Clock |
| Pino D1 | I/O — User I/O pin (bank 1) |
| Pino D2 | TMS — JTAG Test Mode Select |
| Pino D3 | I/O — User I/O pin (bank 1) |
| Pino D4 | I/O — User I/O pin (bank 1) |
| Pino D5 | I/O — User I/O pin (bank 1) |
| Pino D6 | I/O — User I/O pin (bank 1) |
| Pino D7 | I/O — User I/O pin (bank 1) |
| Pino D8 | I/O — User I/O pin (bank 1) |
| Pino D9 | I/O — User I/O pin (bank 1) |
| Pino D10 | TDO — JTAG Test Data Out |
| Pino E1 | I/O — User I/O pin (bank 2) |
| Pino E2 | I/O — User I/O pin (bank 2) |
| Pino E3 | I/O — User I/O pin (bank 2) |
| Pino E4 | VCCIO2 — I/O bank 2 supply voltage |
| Pino E5 | GND — Ground |
| Pino E6 | VCCINT — Core supply voltage (1.8 V) |
| Pino E7 | I/O — User I/O pin (bank 2) |
| Pino E8 | I/O — User I/O pin (bank 2) |
| Pino E9 | I/O — User I/O pin (bank 2) |
| Pino E10 | I/O — User I/O pin (bank 2) |
| Pino F1 | I/O — User I/O pin (bank 2) |
| Pino F2 | I/O — User I/O pin (bank 2) |
| Pino F3 | I/O — User I/O pin (bank 2) |
| Pino F4 | I/O — User I/O pin (bank 2) |
| Pino F5 | I/O — User I/O pin (bank 2) |
| Pino F6 | I/O — User I/O pin (bank 2) |
| Pino F7 | I/O — User I/O pin (bank 2) |
| Pino F8 | I/O — User I/O pin (bank 2) |
| Pino F9 | I/O — User I/O pin (bank 2) |
| Pino F10 | I/O — User I/O pin (bank 2) |
| Pino G1 | I/O — User I/O pin (bank 3) |
| Pino G2 | I/O — User I/O pin (bank 3) |
| Pino G3 | I/O — User I/O pin (bank 3) |
| Pino G4 | I/O — User I/O pin (bank 3) |
| Pino G5 | GND — Ground |
| Pino G6 | I/O — User I/O pin (bank 3) |
| Pino G7 | I/O — User I/O pin (bank 3) |
| Pino G8 | I/O — User I/O pin (bank 3) |
| Pino G9 | I/O — User I/O pin (bank 3) |
| Pino G10 | I/O — User I/O pin (bank 3) |
| Pino H1 | DEV_OE — Chip-wide output enable |
| Pino H2 | I/O — User I/O pin (bank 3) |
| Pino H3 | I/O — User I/O pin (bank 3) |
| Pino H4 | VCCIO3 — I/O bank 3 supply voltage |
| Pino H5 | I/O — User I/O pin (bank 3) |
| Pino H6 | I/O — User I/O pin (bank 3) |
| Pino H7 | VCCIO4 — I/O bank 4 supply voltage |
| Pino H8 | I/O — User I/O pin (bank 4) |
| Pino H9 | I/O — User I/O pin (bank 4) |
| Pino H10 | nCONFIG — Configuration start input |
| Pino J1 | I/O — User I/O pin (bank 4) |
| Pino J2 | I/O — User I/O pin (bank 4) |
| Pino J3 | I/O — User I/O pin (bank 4) |
| Pino J4 | I/O — User I/O pin (bank 4) |
| Pino J5 | GND — Ground |
| Pino J6 | I/O — User I/O pin (bank 4) |
| Pino J7 | I/O — User I/O pin (bank 4) |
| Pino J8 | I/O — User I/O pin (bank 4) |
| Pino J9 | I/O — User I/O pin (bank 4) |
| Pino J10 | I/O — User I/O pin (bank 4) |
| Pino K1 | I/O — User I/O pin (bank 4) |
| Pino K2 | I/O — User I/O pin (bank 4) |
| Pino K3 | I/O — User I/O pin (bank 4) |
| Pino K4 | GND — Ground |
| Pino K5 | I/O — User I/O pin (bank 4) |
| Pino K6 | VCCINT — Core supply voltage (1.8 V) |
| Pino K7 | I/O — User I/O pin (bank 4) |
| Pino K8 | I/O — User I/O pin (bank 4) |
| Pino K9 | I/O — User I/O pin (bank 4) |
| Pino K10 | I/O — User I/O pin (bank 4) |
| Pino L1 | I/O — User I/O pin (bank 4) |
| Pino L2 | I/O — User I/O pin (bank 4) |
| Pino L3 | I/O — User I/O pin (bank 4) |
| Pino L4 | I/O — User I/O pin (bank 4) |
| Pino L5 | I/O — User I/O pin (bank 4) |
| Pino L6 | I/O — User I/O pin (bank 4) |
| Pino L7 | I/O — User I/O pin (bank 4) |
| Pino L8 | I/O — User I/O pin (bank 4) |
| Pino L9 | GND — Ground |
| Pino L10 | I/O — User I/O pin (bank 4) |
Aplicações típicas
EPM570ZM100I8N é adequado para 6 aplicaçãos: Microcontroller I/O Expansion & Glue Logic, Power-Sequencer Logic for Multi-Rail Systems, Bus-Bridge and Protocol-Converter Glue, LED Display Driver & Multiplex Controller, Industrial Sensor Signal Conditioning Front-End, Legacy Board Replacement & Long-Life Cycle Designs.
Microcontroller I/O Expansion & Glue Logic
The EPM570ZM100I8N's 440 macrocells and 76 user I/Os make it ideal for expanding the GPIO count of microcontrollers in industrial-control boards. With a 152 MHz internal frequency and 9 ns propagation delay, the device decodes chip-select lines, generates timing waveforms, and latches address/data buses in real time without burdening the MCU. Its flash-based non-volatile configuration boots in under 1 ms, eliminating the need for an external PROM and reducing BOM cost. Quartus II Place-and-Route produces deterministic, timing-closed logic across the 57 LABs, simplifying glue-logic implementation.
Recomendado
Power-Sequencer Logic for Multi-Rail Systems
The EPM570ZM100I8N's 440 macrocells and chip-wide DEV_OE output-enable pin enable robust power-sequencer logic in servers, base stations, and FPGA-based platforms where multiple rails must be enabled in a deterministic order. With 76 user I/Os the CPLD drives dozens of load-switch enable lines and reads PG (power-good) feedback from DC-DC converters. The non-volatile flash configuration eliminates boot-time race conditions common to SRAM-based logic devices, making the EPM570ZM100I8N a reliable, instant-on sequencer for safety-critical rails.
Recomendado
Bus-Bridge and Protocol-Converter Glue
Where legacy microprocessors or DSPs must communicate with modern peripherals, the EPM570ZM100I8N's 152 MHz frequency and 9 ns tPD handle bus-protocol translation (for example, address-latch, wait-state insertion, chip-select decoding) in real time. The 76 user I/Os map directly to address, data, and control signals of 8/16/32-bit buses. JTAG in-system programmability allows field updates without removing the part, and the -40 °C to +85 °C industrial temperature range supports factory-floor deployment.
Recomendado
LED Display Driver & Multiplex Controller
The EPM570ZM100I8N's 440 macrocells easily drive large multiplexed LED arrays and seven-segment displays in industrial HMIs and signage panels. With 76 user I/Os, the CPLD controls row/column multiplexing, brightness modulation via PWM, and refresh timing without external drivers. The 152 MHz internal clock supports high refresh rates that eliminate visible flicker, while the 9 ns propagation delay ensures glitch-free column switching. Non-volatile storage retains display patterns at power-on.
Recomendado
Industrial Sensor Signal Conditioning Front-End
In factory-automation and process-control applications, the EPM570ZM100I8N conditions and routes signals from encoders, optocouplers, and proximity sensors before they reach the MCU or FPGA. The 57 LABs implement Schmitt-trigger cleanup, debounce, quadrature decoding, and frequency multiplication with deterministic timing. The 76 user I/Os accept TTL/CMOS inputs across the -40 °C to +85 °C industrial range, and the non-volatile flash eliminates boot-time glitches on noisy factory power rails.
Recomendado
Legacy Board Replacement & Long-Life Cycle Designs
The MAX II CPLD family, including the EPM570ZM100I8N, is widely used in long-lifecycle industrial, medical, and aerospace platforms where design stability over decades matters. The non-volatile flash configuration and Altera / Intel long-term supply commitment make it a dependable replacement for legacy discrete-logic and PAL/GAL boards. Its 100-ball BGA and JTAG ISP support modern PCB manufacturing while preserving backward compatibility with earlier MAX II designs, and the 76 user I/Os cover most glue-logic retargeting tasks.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570ZM100I8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570ZM100C7N | EPM570ZM100C6N | EPM570M100I5N | EPM570M100C5N | EPM570GM100I5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 100-ball FineLine BGA (MBGA, 0.8 mm) | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| Logic Array Blocks (LABs) | 57 | 57 | 57 | 57 | 57 | 57 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| Sub-Family | EPM570Z (zero-power, 1.8 V core) | EPM570Z | EPM570Z | EPM570 | EPM570 | EPM570G |
| Operating Temperature | -40 C to +85 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +85 C (Industrial) | 0 C to +85 C (Commercial) | -40 C to +85 C (Industrial) |
Principais diferenciais
- Largest macrocell count in the MAX II family with 100-ball BGA low pincount (vs EPM570F256C5N)
- Zero-power sub-family with 1.8 V core and flash non-volatile configuration (vs EPM570M100I5N)
- Industrial temperature grade for harsh-environment deployment (vs EPM570ZM100C7N)
Notas de projeto
The EPM570ZM100I8N requires two supplies per pin-to-bus interface: VCCINT (1.8 V) for the core and VCCIOx (1.5 V / 1.8 V / 2.5 V / 3.3 V) per I/O bank. Decouple each VCCINT and VCCIOx pin with a 0.1 µF X7R ceramic capacitor placed within 3 mm of the ball; add a 10 µF bulk capacitor on each supply rail. Power-rail sequencing is not strictly required because MAX II devices include power-on-reset circuitry, but simultaneous ramp is recommended.
The 100-ball FineLine BGA uses 0.8 mm pitch with a 10x10 array. PCB design requires laser-drilled or micro-via stacked-via fan-out for inner balls; use 0.4 mm via-pad with 0.2 mm finished hole and 4-mil trace/space rules. Match the BGA land pattern to the JEDEC MO-195 FineLine BGA standard. Add a 5 mm keep-out zone around the BGA for re-work and X-ray inspection.
Do not confuse the EPM570ZM100I8N (EPM570Z zero-power sub-family, 1.8 V core) with the EPM570M100I5N (EPM570 standard sub-family with higher VCCINT). Substituting one for the other without verifying the core supply voltage will cause configuration failure. Always confirm VCCINT = 1.8 V for the Z variant before PCB bring-up, and ensure the JTAG chain (TCK/TMS/TDI/TDO) is brought to a test header for in-system programming.
MAX II CPLDs do not include on-chip series termination. For outputs driving > 4 inch traces or > 25 MHz edges, add a 33 Ω series resistor close to the CPLD pin to dampen reflections. For clock-distribution networks, route clock traces on inner stripline layers with ground reference above and below, and keep clock-to-data trace spacing at least 3W (3x trace width).
Informações de conformidade
RoHS and REACH compliance confirmed by Altera / Intel product documentation; lead-free reflow profile per JEDEC J-STD-020. Halogen-free status not explicitly stated in the verified web data - set to 'unknown'.
