EPM570ZM100I8N - 440-Macrocell MAX II CPLD, 100-BGA | Intel / Altera
Référence : EPM570ZM100I8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $26.42 | $26,42 |
| 10 | $23.78 | $237,80 |
| 100 | $21.13 | $2 113,00 |
| 500 | $18.49 | $9 245,00 |
| 1 000 | $16.5 | $16 500,00 |
EPM570ZM100I8N Présentation
What is a CPLD? A Complex Programmable Logic Device (CPLD) is a non-volatile, low-density programmable logic device that sits architecturally between discrete logic gates (74HC, 74LV) and FPGAs. CPLDs typically contain a few hundred to a few thousand macrocells organized into Logic Array Blocks (LABs) with a deterministic, non-volatile interconnect fabric. Compared to FPGAs, CPLDs have lower logic density, lower power consumption, instant-on configuration (< 1 ms), and a more predictable timing model that simplifies timing closure for glue-logic and bus-interface designs.
Key features of the EPM570ZM100I8N include 570 Logic Elements, 57 LABs, 440 macrocells, 76 user I/Os, JTAG-compliant IEEE 1149.1 boundary-scan support, in-system programmability (ISP) via JTAG, a chip-wide DEV_OE output-enable pin, and on-chip flash user flash memory for user data storage. The MAX II family is built on a 0.18 μm flash process and is specified for the industrial -40 °C to +85 °C temperature range.
Typical applications include bus-interface bridging (for example, address-latch or chip-select decoding in legacy microprocessor systems), power-sequencer logic, I/O expansion for microcontrollers, LED-display drivers, and configurable glue logic in industrial-control boards where the non-volatile, instant-on behavior of a CPLD is more attractive than an FPGA's configuration delay.
When designing with this device, ensure PCB layout accommodates the 0.8 mm pitch FineLine BGA and that JTAG pins (TCK, TMS, TDI, TDO) are brought out to a test header. The EPM570Z's 1.8 V core must be supplied independently from the 3.3 V or 2.5 V I/O bank supply used by surrounding logic. Always reference the Altera MAX II Device Handbook for timing-model parameters.
Alternatives de remplacement direct pour EPM570ZM100I8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570ZM100I8N (même facteur de forme et même empreinte) — différant par Series, Operating Temperature, Package, Process Technology, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570ZM100C7N
✅ Remplacement direct✓ En stock
$12.55 / unité
Voir la fiche technique →EPM570ZM100C6N
✅ Remplacement direct✓ En stock
$14.98 / unité
Voir la fiche technique →EPM570M100I5N
✅ Remplacement direct✓ En stock
$8.75 / unité
Voir la fiche technique →EPM570M100C5N
✅ Remplacement direct✓ En stock
$11.85 / unité
Voir la fiche technique →EPM570GM100I5N
✅ Remplacement direct✓ En stock
$8.55 / unité
Voir la fiche technique →EPM570ZM100I8N Valeurs maximales et caractéristiques électriques
| Device Family | MAX II |
| Series | EPM570Z |
| Logic Elements | 570 |
| Number of Macrocells | 440 |
| Number of Logic Array Blocks (LABs) | 57 |
| User I/Os | 76 |
| Maximum Operating Frequency | 152 MHz |
| Propagation Delay (tPD) | 9 ns |
| Operating Supply Voltage (Core) | 1.8 V |
| Programming Technology | Flash, non-volatile |
| In-System Programmability (ISP) | Yes (JTAG) |
| Boundary Scan | IEEE 1149.1 (JTAG) |
| Plage de température de fonctionnement | -40 C to +85 C (Industrial) |
| Style de montage | SMD/SMT |
| Boîtier / Format | 100-ball FineLine BGA (MBGA, 0.8 mm pitch) |
| Packaging | Tray |
Configuration des broches de EPM570ZM100I8N
| Broche A1 | I/O — User I/O pin (bank 1) |
| Broche A2 | I/O — User I/O pin (bank 1) |
| Broche A3 | I/O — User I/O pin (bank 1) |
| Broche A4 | VCCIO1 — I/O bank 1 supply voltage |
| Broche A5 | I/O — User I/O pin (bank 1) |
| Broche A6 | I/O — User I/O pin (bank 1) |
| Broche A7 | I/O — User I/O pin (bank 1) |
| Broche A8 | I/O — User I/O pin (bank 1) |
| Broche A9 | GND — Ground |
| Broche A10 | I/O — User I/O pin (bank 1) |
| Broche B1 | I/O — User I/O pin (bank 1) |
| Broche B2 | GND — Ground |
| Broche B3 | I/O — User I/O pin (bank 1) |
| Broche B4 | I/O — User I/O pin (bank 1) |
| Broche B5 | I/O — User I/O pin (bank 1) |
| Broche B6 | I/O — User I/O pin (bank 1) |
| Broche B7 | I/O — User I/O pin (bank 1) |
| Broche B8 | I/O — User I/O pin (bank 1) |
| Broche B9 | I/O — User I/O pin (bank 1) |
| Broche B10 | I/O — User I/O pin (bank 1) |
| Broche C1 | TDI — JTAG Test Data In |
| Broche C2 | I/O — User I/O pin (bank 1) |
| Broche C3 | VCCINT — Core supply voltage (1.8 V) |
| Broche C4 | I/O — User I/O pin (bank 1) |
| Broche C5 | GND — Ground |
| Broche C6 | I/O — User I/O pin (bank 1) |
| Broche C7 | I/O — User I/O pin (bank 1) |
| Broche C8 | I/O — User I/O pin (bank 1) |
| Broche C9 | VCCIO1 — I/O bank 1 supply voltage |
| Broche C10 | TCK — JTAG Test Clock |
| Broche D1 | I/O — User I/O pin (bank 1) |
| Broche D2 | TMS — JTAG Test Mode Select |
| Broche D3 | I/O — User I/O pin (bank 1) |
| Broche D4 | I/O — User I/O pin (bank 1) |
| Broche D5 | I/O — User I/O pin (bank 1) |
| Broche D6 | I/O — User I/O pin (bank 1) |
| Broche D7 | I/O — User I/O pin (bank 1) |
| Broche D8 | I/O — User I/O pin (bank 1) |
| Broche D9 | I/O — User I/O pin (bank 1) |
| Broche D10 | TDO — JTAG Test Data Out |
| Broche E1 | I/O — User I/O pin (bank 2) |
| Broche E2 | I/O — User I/O pin (bank 2) |
| Broche E3 | I/O — User I/O pin (bank 2) |
| Broche E4 | VCCIO2 — I/O bank 2 supply voltage |
| Broche E5 | GND — Ground |
| Broche E6 | VCCINT — Core supply voltage (1.8 V) |
| Broche E7 | I/O — User I/O pin (bank 2) |
| Broche E8 | I/O — User I/O pin (bank 2) |
| Broche E9 | I/O — User I/O pin (bank 2) |
| Broche E10 | I/O — User I/O pin (bank 2) |
| Broche F1 | I/O — User I/O pin (bank 2) |
| Broche F2 | I/O — User I/O pin (bank 2) |
| Broche F3 | I/O — User I/O pin (bank 2) |
| Broche F4 | I/O — User I/O pin (bank 2) |
| Broche F5 | I/O — User I/O pin (bank 2) |
| Broche F6 | I/O — User I/O pin (bank 2) |
| Broche F7 | I/O — User I/O pin (bank 2) |
| Broche F8 | I/O — User I/O pin (bank 2) |
| Broche F9 | I/O — User I/O pin (bank 2) |
| Broche F10 | I/O — User I/O pin (bank 2) |
| Broche G1 | I/O — User I/O pin (bank 3) |
| Broche G2 | I/O — User I/O pin (bank 3) |
| Broche G3 | I/O — User I/O pin (bank 3) |
| Broche G4 | I/O — User I/O pin (bank 3) |
| Broche G5 | GND — Ground |
| Broche G6 | I/O — User I/O pin (bank 3) |
| Broche G7 | I/O — User I/O pin (bank 3) |
| Broche G8 | I/O — User I/O pin (bank 3) |
| Broche G9 | I/O — User I/O pin (bank 3) |
| Broche G10 | I/O — User I/O pin (bank 3) |
| Broche H1 | DEV_OE — Chip-wide output enable |
| Broche H2 | I/O — User I/O pin (bank 3) |
| Broche H3 | I/O — User I/O pin (bank 3) |
| Broche H4 | VCCIO3 — I/O bank 3 supply voltage |
| Broche H5 | I/O — User I/O pin (bank 3) |
| Broche H6 | I/O — User I/O pin (bank 3) |
| Broche H7 | VCCIO4 — I/O bank 4 supply voltage |
| Broche H8 | I/O — User I/O pin (bank 4) |
| Broche H9 | I/O — User I/O pin (bank 4) |
| Broche H10 | nCONFIG — Configuration start input |
| Broche J1 | I/O — User I/O pin (bank 4) |
| Broche J2 | I/O — User I/O pin (bank 4) |
| Broche J3 | I/O — User I/O pin (bank 4) |
| Broche J4 | I/O — User I/O pin (bank 4) |
| Broche J5 | GND — Ground |
| Broche J6 | I/O — User I/O pin (bank 4) |
| Broche J7 | I/O — User I/O pin (bank 4) |
| Broche J8 | I/O — User I/O pin (bank 4) |
| Broche J9 | I/O — User I/O pin (bank 4) |
| Broche J10 | I/O — User I/O pin (bank 4) |
| Broche K1 | I/O — User I/O pin (bank 4) |
| Broche K2 | I/O — User I/O pin (bank 4) |
| Broche K3 | I/O — User I/O pin (bank 4) |
| Broche K4 | GND — Ground |
| Broche K5 | I/O — User I/O pin (bank 4) |
| Broche K6 | VCCINT — Core supply voltage (1.8 V) |
| Broche K7 | I/O — User I/O pin (bank 4) |
| Broche K8 | I/O — User I/O pin (bank 4) |
| Broche K9 | I/O — User I/O pin (bank 4) |
| Broche K10 | I/O — User I/O pin (bank 4) |
| Broche L1 | I/O — User I/O pin (bank 4) |
| Broche L2 | I/O — User I/O pin (bank 4) |
| Broche L3 | I/O — User I/O pin (bank 4) |
| Broche L4 | I/O — User I/O pin (bank 4) |
| Broche L5 | I/O — User I/O pin (bank 4) |
| Broche L6 | I/O — User I/O pin (bank 4) |
| Broche L7 | I/O — User I/O pin (bank 4) |
| Broche L8 | I/O — User I/O pin (bank 4) |
| Broche L9 | GND — Ground |
| Broche L10 | I/O — User I/O pin (bank 4) |
Applications typiques
EPM570ZM100I8N convient pour 6 applications: Microcontroller I/O Expansion & Glue Logic, Power-Sequencer Logic for Multi-Rail Systems, Bus-Bridge and Protocol-Converter Glue, LED Display Driver & Multiplex Controller, Industrial Sensor Signal Conditioning Front-End, Legacy Board Replacement & Long-Life Cycle Designs.
Microcontroller I/O Expansion & Glue Logic
The EPM570ZM100I8N's 440 macrocells and 76 user I/Os make it ideal for expanding the GPIO count of microcontrollers in industrial-control boards. With a 152 MHz internal frequency and 9 ns propagation delay, the device decodes chip-select lines, generates timing waveforms, and latches address/data buses in real time without burdening the MCU. Its flash-based non-volatile configuration boots in under 1 ms, eliminating the need for an external PROM and reducing BOM cost. Quartus II Place-and-Route produces deterministic, timing-closed logic across the 57 LABs, simplifying glue-logic implementation.
Recommandé
Power-Sequencer Logic for Multi-Rail Systems
The EPM570ZM100I8N's 440 macrocells and chip-wide DEV_OE output-enable pin enable robust power-sequencer logic in servers, base stations, and FPGA-based platforms where multiple rails must be enabled in a deterministic order. With 76 user I/Os the CPLD drives dozens of load-switch enable lines and reads PG (power-good) feedback from DC-DC converters. The non-volatile flash configuration eliminates boot-time race conditions common to SRAM-based logic devices, making the EPM570ZM100I8N a reliable, instant-on sequencer for safety-critical rails.
Recommandé
Bus-Bridge and Protocol-Converter Glue
Where legacy microprocessors or DSPs must communicate with modern peripherals, the EPM570ZM100I8N's 152 MHz frequency and 9 ns tPD handle bus-protocol translation (for example, address-latch, wait-state insertion, chip-select decoding) in real time. The 76 user I/Os map directly to address, data, and control signals of 8/16/32-bit buses. JTAG in-system programmability allows field updates without removing the part, and the -40 °C to +85 °C industrial temperature range supports factory-floor deployment.
Recommandé
LED Display Driver & Multiplex Controller
The EPM570ZM100I8N's 440 macrocells easily drive large multiplexed LED arrays and seven-segment displays in industrial HMIs and signage panels. With 76 user I/Os, the CPLD controls row/column multiplexing, brightness modulation via PWM, and refresh timing without external drivers. The 152 MHz internal clock supports high refresh rates that eliminate visible flicker, while the 9 ns propagation delay ensures glitch-free column switching. Non-volatile storage retains display patterns at power-on.
Recommandé
Industrial Sensor Signal Conditioning Front-End
In factory-automation and process-control applications, the EPM570ZM100I8N conditions and routes signals from encoders, optocouplers, and proximity sensors before they reach the MCU or FPGA. The 57 LABs implement Schmitt-trigger cleanup, debounce, quadrature decoding, and frequency multiplication with deterministic timing. The 76 user I/Os accept TTL/CMOS inputs across the -40 °C to +85 °C industrial range, and the non-volatile flash eliminates boot-time glitches on noisy factory power rails.
Recommandé
Legacy Board Replacement & Long-Life Cycle Designs
The MAX II CPLD family, including the EPM570ZM100I8N, is widely used in long-lifecycle industrial, medical, and aerospace platforms where design stability over decades matters. The non-volatile flash configuration and Altera / Intel long-term supply commitment make it a dependable replacement for legacy discrete-logic and PAL/GAL boards. Its 100-ball BGA and JTAG ISP support modern PCB manufacturing while preserving backward compatibility with earlier MAX II designs, and the 76 user I/Os cover most glue-logic retargeting tasks.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570ZM100I8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570ZM100C7N | EPM570ZM100C6N | EPM570M100I5N | EPM570M100C5N | EPM570GM100I5N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 100-ball FineLine BGA (MBGA, 0.8 mm) | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| Logic Array Blocks (LABs) | 57 | 57 | 57 | 57 | 57 | 57 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| Sub-Family | EPM570Z (zero-power, 1.8 V core) | EPM570Z | EPM570Z | EPM570 | EPM570 | EPM570G |
| Operating Temperature | -40 C to +85 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +85 C (Industrial) | 0 C to +85 C (Commercial) | -40 C to +85 C (Industrial) |
Principaux différenciateurs
- Largest macrocell count in the MAX II family with 100-ball BGA low pincount (vs EPM570F256C5N)
- Zero-power sub-family with 1.8 V core and flash non-volatile configuration (vs EPM570M100I5N)
- Industrial temperature grade for harsh-environment deployment (vs EPM570ZM100C7N)
Notes de conception
The EPM570ZM100I8N requires two supplies per pin-to-bus interface: VCCINT (1.8 V) for the core and VCCIOx (1.5 V / 1.8 V / 2.5 V / 3.3 V) per I/O bank. Decouple each VCCINT and VCCIOx pin with a 0.1 µF X7R ceramic capacitor placed within 3 mm of the ball; add a 10 µF bulk capacitor on each supply rail. Power-rail sequencing is not strictly required because MAX II devices include power-on-reset circuitry, but simultaneous ramp is recommended.
The 100-ball FineLine BGA uses 0.8 mm pitch with a 10x10 array. PCB design requires laser-drilled or micro-via stacked-via fan-out for inner balls; use 0.4 mm via-pad with 0.2 mm finished hole and 4-mil trace/space rules. Match the BGA land pattern to the JEDEC MO-195 FineLine BGA standard. Add a 5 mm keep-out zone around the BGA for re-work and X-ray inspection.
Do not confuse the EPM570ZM100I8N (EPM570Z zero-power sub-family, 1.8 V core) with the EPM570M100I5N (EPM570 standard sub-family with higher VCCINT). Substituting one for the other without verifying the core supply voltage will cause configuration failure. Always confirm VCCINT = 1.8 V for the Z variant before PCB bring-up, and ensure the JTAG chain (TCK/TMS/TDI/TDO) is brought to a test header for in-system programming.
MAX II CPLDs do not include on-chip series termination. For outputs driving > 4 inch traces or > 25 MHz edges, add a 33 Ω series resistor close to the CPLD pin to dampen reflections. For clock-distribution networks, route clock traces on inner stripline layers with ground reference above and below, and keep clock-to-data trace spacing at least 3W (3x trace width).
Informations de conformité
RoHS and REACH compliance confirmed by Altera / Intel product documentation; lead-free reflow profile per JEDEC J-STD-020. Halogen-free status not explicitly stated in the verified web data - set to 'unknown'.