5CSXFC6C6U23C8N vs 5CSXFC6C6U23C8NES Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 5CSXFC6C6U23C8N sa pamamagitan ng Intel at 5CSXFC6C6U23C8NES sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
5CSXFC6C6U23C8NES 5CSXFC6C6U23C8NES - Cyclone V SX SoC FPGA 110K LE | Intel

5CSXFC6C6U23C8NES - Cyclone V SX SoC FPGA 110K LE | Intel

5CSXFC6C6U23C8NES ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro 5CSXFC6C6U23C8N 5CSXFC6C6U23C8NES
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone V SX (SoC FPGA) Cyclone V SX
Series Cyclone V SX —
Architecture MCU + FPGA (Hard Processor System + FPGA fabric) —
Logic Elements 110,000 110,000
Process Technology 28 nm low-power (TSMC) —
Core Voltage 1.1 V —
Hard Processor System (HPS) Dual-core ARM Cortex-A9 MPCore with CoreSight —
Processor Maximum Frequency 600 MHz —
HPS L1 Cache 32 KB instruction + 32 KB data per core —
HPS L2 Cache 512 KB shared —
DSP Blocks Variable-precision DSP (number not specified in retrieved data) —
Embedded Memory M10K blocks (total Kbits [DATA_NEEDED: total embedded memory Kbits]) —
Transceivers Up to 3.125 Gbps integrated transceivers —
Maximum User I/O 145 user I/O (per DigChip summary; full count per package [DATA_NEEDED: package pinout max user I/O]) —
Memory Controller Hard controller supporting DDR2, DDR3, LPDDR2 —
Packhaging 672-pin UFBGA (UBGA), 23x23 mm 672-pin UBGА (23x23 mm)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Temperature na Operasyon -40C to +100C (industrial grade, code C) —
Level ng MSL 3 (per JEDEC J-STD-020, typical for large BGA) —
Tindminan RoHS Compliant Compliant
Lead-Free / Halogen-Free Yes (lead-free BGA; halogen status [DATA_NEEDED: halogen-free yes/no]) —
Speed Grade C8 (commercial speed grade 8) 8 (commercial)
Lifecycle Active (Cyclone V family in production) —
Device Type — SoC FPGA (FPGA + ARM Cortex-A9 HPS)
Hard Processor Subsystem — Dual ARM Cortex-A9 MPCore with CoreSight
HPS Clock Frequency (max) — 600 MHz
Process Node — 28 nm TSMC low-power
Embedded Memory (M10K + MLAB) — 5,140 Kbits (approx)
DSP Blocks (18x19 multipliers) — 112
User I/O Pins — 224
Temperature ng Junction na Operasyon — 0C to +85C (commercial)
External Memory Interfaces — DDR2, DDR3, LPDDR2
Hard PCIe Gen2 Controllers — 2

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