EP2A25F672I6 vs EP2A25F672C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672I6 sa pamamagitan ng Intel at EP2A25F672C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2A25F672I6 EP2A25F672C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Family APEX II APEX II
Logic Elements (typical gates) 25,000 —
Fabric Architecture SRAM-based LUT —
Process Technology 0.18 µm CMOS —
Packhaging 672-ball FineLine BGA (FBGA-672) 672-ball FC-FBGA (FineLine BGA)
Core Voltage 1.5 V —
Configuration Method External SRAM configuration device (EPC series) —
Temperature Grade Industrial (-40 °C to +100 °C ambient) —
Speed Grade 6 C8
Embedded Memory Embedded System Blocks (ESB), dual-port RAM / CAM —
DSP Blocks MultiCore dedicated multipliers —
Boundary Scan JTAG (IEEE 1149.1) compliant —
Clock Management Dedicated PLL / clock tree circuitry —
I/O Bank Count [DATA_NEEDED: number of user I/O banks] —
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] Compliant
Lead-Free [DATA_NEEDED: lead-free status] —
Level ng MSL [DATA_NEEDED: moisture sensitivity level] —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Technology Node — 0.15 um all-layer copper process
System Gates — 900,000
Logic Elements / Cells — 24,320
Maximum Internal Frequency — 333 MHz
Propagation Delay — 1.69 ns
User I/Os — 492
Package Body Size — 27 x 27 mm
Ball Pitch — 1.0 mm
Core Supply Voltage — 1.5 V
Temperature na Operasyon — 0 C to 85 C (commercial)
Multi-Gigabit Transceiver Rate — Up to 1 Gbps per channel
Lead-Free Suffix — N (lead-free, Pb-free finish)

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